|
FZ1600R17KE3NOSA1 |
FZ1600R17KE3 |
Description |
IGBT MODULE 1700V 1600A |
Thermal Interface Products Soft PGS - IGBT Mod Infineon |
Is it lead-free? |
Contains lead |
Contains lead |
Is it Rohs certified? |
incompatible |
incompatible |
Maker |
Infineon |
Infineon |
Parts packaging code |
MODULE |
MODULE |
package instruction |
FLANGE MOUNT, R-XUFM-X7 |
FLANGE MOUNT, R-XUFM-X7 |
Contacts |
7 |
7 |
Reach Compliance Code |
not_compliant |
unknown |
ECCN code |
EAR99 |
EAR99 |
Shell connection |
ISOLATED |
ISOLATED |
Maximum collector current (IC) |
2300 A |
2300 A |
Collector-emitter maximum voltage |
1700 V |
1700 V |
Configuration |
PARALLEL, 2 ELEMENTS WITH BUILT-IN DIODE |
PARALLEL, 2 ELEMENTS WITH BUILT-IN DIODE |
JESD-30 code |
R-XUFM-X7 |
R-XUFM-X7 |
Number of components |
2 |
2 |
Number of terminals |
7 |
7 |
Maximum operating temperature |
150 °C |
150 °C |
Package body material |
UNSPECIFIED |
UNSPECIFIED |
Package shape |
RECTANGULAR |
RECTANGULAR |
Package form |
FLANGE MOUNT |
FLANGE MOUNT |
Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
NOT SPECIFIED |
Polarity/channel type |
N-CHANNEL |
N-CHANNEL |
Certification status |
Not Qualified |
Not Qualified |
surface mount |
NO |
NO |
Terminal form |
UNSPECIFIED |
UNSPECIFIED |
Terminal location |
UPPER |
UPPER |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
Transistor component materials |
SILICON |
SILICON |
Nominal off time (toff) |
1770 ns |
1770 ns |
Nominal on time (ton) |
750 ns |
750 ns |