MX29GL128EHXCI-90G datasheet, PDF

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MX29GL128EHXCI-90G: DescriptionIC FLASH 128MBIT; Categorystorage storage; File Size1MB，72 Pages; ManufacturerMacronix; Websitehttp://www.macronix.com/en-us/Pages/default.aspx; Environmental Compliance

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MX29GL128EHXCI-90G Overview

IC FLASH 128MBIT

MX29GL128EHXCI-90G Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Macronix
Parts packaging code	BGA
package instruction	TBGA, BGA64,8X8,40
Contacts	64
Reach Compliance Code	compliant
ECCN code	3A991.B.1.A
Factory Lead Time	16 weeks
Maximum access time	90 ns
Spare memory width	8
command user interface	YES
Universal Flash Interface	YES
Data polling	YES
JESD-30 code	R-PBGA-B64
length	13 mm
memory density	2147483648 bit
Memory IC Type	FLASH
memory width	16
Number of functions	1
Number of departments/size	128
Number of terminals	64
word count	134217728 words
character code	128000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	128MX16
Package body material	PLASTIC/EPOXY
encapsulated code	TBGA
Encapsulate equivalent code	BGA64,8X8,40
Package shape	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE
page size	8/16 words
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	3/3.3 V
Programming voltage	3 V
Certification status	Not Qualified
ready/busy	YES
Maximum seat height	1.2 mm
Department size	128K
Maximum standby current	0.0001 A
Maximum slew rate	0.1 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
switch bit	YES
type	NOR TYPE
width	10 mm

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MX29GL128E

MX29GL128E DATASHEET

P/N:PM1500

REV. 1.8, NOV. 13, 2013

MX29GL128EHXCI-90G Related Products

	MX29GL128EHXCI-90G	MX29GL128EDXFI-11G	MX29GL128EUXFI-11G	MX29GL128EUT2I-11G	MX29GL128EHMC-90G	MX29GL128ELXCI-90G
Description	IC FLASH 128MBIT	IC FLASH 128MBIT	IC FLASH 128MBIT	IC FLASH 128MBIT	Flash, 128MX16, 90ns, PDSO70, 0.500 INCH, HALOGEN FREE AND ROHS COMPLIANT, MO-174, SSOP-70	Flash, 128MX16, 90ns, PBGA64, 10 X 13 MM, 1.2 MM HEIGHT, 1 MM PITCH, HALOGEN FREE AND ROHS COMPLIANT, MO-216, FBGA-64
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to
Maker	Macronix	Macronix	Macronix	Macronix	Macronix	Macronix
Parts packaging code	BGA	BGA	BGA	TSOP1	SOIC	BGA
package instruction	TBGA, BGA64,8X8,40	LBGA, BGA64,8X8,40	11 X 13 MM, 1 MM HEIGHT, 1.4 MM PITCH, HALOGEN FREE AND ROHS COMPLIANT, MO-192, LFBGA-64	TSSOP, TSSOP56,.63,20	SSOP, SOP70,.63,32	TBGA, BGA64,8X8,40
Contacts	64	64	64	56	70	64
Reach Compliance Code	compliant	unknown	unknown	unknown	unknown	unknown
ECCN code	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A
Maximum access time	90 ns	11 ns	11 ns	11 ns	90 ns	90 ns
Spare memory width	8	8	8	8	8	8
command user interface	YES	YES	YES	YES	YES	YES
Universal Flash Interface	YES	YES	YES	YES	YES	YES
Data polling	YES	YES	YES	YES	YES	YES
JESD-30 code	R-PBGA-B64	R-PBGA-B64	R-PBGA-B64	R-PDSO-G56	R-PDSO-G70	R-PBGA-B64
length	13 mm	13 mm	13 mm	18.4 mm	28.5 mm	13 mm
memory density	2147483648 bit	2147483648 bit	2147483648 bit	2147483648 bit	2147483648 bit	2147483648 bit
Memory IC Type	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH
memory width	16	16	16	16	16	16
Number of functions	1	1	1	1	1	1
Number of departments/size	128	128	128	128	128	128
Number of terminals	64	64	64	56	70	64
word count	134217728 words	134217728 words	134217728 words	134217728 words	134217728 words	134217728 words
character code	128000000	128000000	128000000	128000000	128000000	128000000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	70 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-	-40 °C
organize	128MX16	128MX16	128MX16	128MX16	128MX16	128MX16
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TBGA	LBGA	LBGA	TSSOP	SSOP	TBGA
Encapsulate equivalent code	BGA64,8X8,40	BGA64,8X8,40	BGA64,8X8,40	TSSOP56,.63,20	SOP70,.63,32	BGA64,8X8,40
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, SHRINK PITCH	GRID ARRAY, THIN PROFILE
page size	8/16 words	8/16 words	8/16 words	8/16 words	8/16 words	8/16 words
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	260	NOT SPECIFIED	NOT SPECIFIED
power supply	3/3.3 V	1.8/3.3,3/3.3 V	1.8/3.3,3/3.3 V	1.8/3.3,3/3.3 V	3/3.3 V	3/3.3 V
Programming voltage	3 V	3 V	3 V	3 V	3 V	3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
ready/busy	YES	YES	YES	YES	YES	YES
Maximum seat height	1.2 mm	1.4 mm	1.4 mm	1.2 mm	3.05 mm	1.2 mm
Department size	128K	128K	128K	128K	128K	128K
Maximum standby current	0.0001 A	0.0001 A	0.0001 A	0.0001 A	0.0001 A	0.0001 A
Maximum slew rate	0.1 mA	0.1 mA	0.1 mA	0.1 mA	0.1 mA	0.1 mA
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
Nominal supply voltage (Vsup)	3 V	3 V	3 V	3 V	3 V	3 V
surface mount	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL
Terminal form	BALL	BALL	BALL	GULL WING	GULL WING	BALL
Terminal pitch	1 mm	1 mm	1 mm	0.5 mm	0.8 mm	1 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	DUAL	DUAL	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	40	NOT SPECIFIED	NOT SPECIFIED
switch bit	YES	YES	YES	YES	YES	YES
type	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE
width	10 mm	11 mm	11 mm	14 mm	12.6 mm	10 mm
Factory Lead Time	16 weeks	16 weeks	16 weeks	16 weeks	-	-

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