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DIP328-011BLF

Description
CONN IC DIP SOCKET 28POS GOLD
CategoryThe connector   
File Size102KB,1 Pages
ManufacturerAmphenol
Websitehttp://www.amphenol.com/
Environmental Compliance
Download Datasheet Parametric View All

DIP328-011BLF Overview

CONN IC DIP SOCKET 28POS GOLD

DIP328-011BLF Parametric

Parameter NameAttribute value
typeDIP, 0.3" (7.62mm) line spacing
Number of pins or pins (grid)28(2 x 14)
Spacing - Mating0.100"(2.54mm)
Contact surface treatment - matinggold
Contact Surface Treatment Thickness - Mating10.0µin(0.25µm)
Contact Material - Matingcopper beryllium
Installation typeThrough hole
characteristicopen framework
Terminationwelding
spacing-column0.100"(2.54mm)
Contact Surface Preparation - Columntin
Contact Surface Treatment Thickness - Column200.0µin(5.08µm)
Contact Material - Pillarbrass
Shell materialPolydimethylcyclohexyl terephthalate (PCT), polyester, glass fiber reinforced
Operating temperature-
Termination post length0.125"(3.18mm)
Material flammability ratingUL94 V-0
Contact resistance-

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Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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