VL-COMm-26
Extremely small COM Express™ mini form factor
Intel® Atom™ E6x0T processor
Industrial temp. (-40º to +85ºC)
Class 3 manufacturing (optional)
Wide input voltage (8V–17V)
On-board Trusted Platform Module (optional)
COM Express Mini CPU Module
Highlights
COM Express Mini Form Factor
Intel Atom E6x0T Processor
Extremely small 55 mm x 84 mm format with Type 10 pin-out.
1.6 GHz performance. Low power consumption.
Overview
The VL-COMm-26 is an extremely small and rugged Computer on Module (COM) based on
the industry-standard COM Express mini form factor. Roughly the size of a credit card, the
VL-COMm-26 has been engineered to meet the military and medical industries’ requirements
for smaller, lighter, and lower power embedded systems while adhering to stringent regulatory
standards. The VL-COMm-26 is manufactured to IPC-A-610 Class 2 standards. For extremely-
high-reliability applications, IPC-A-610 Class 3 (modified) versions are available. This embedded
computer module, equipped with an Intel Atom E6x0T processor, is designed to withstand
extreme temperature, impact, and vibration.
Industrial Temperature Operation
Class 3 Manufacturing
(optional)
MIL-STD-202G
-40° to +85°C operation for harsh environments.
For applications where extreme reliability is essential.
Qualified for high shock / vibration environments.
Details
Driven by an Intel Atom E6x0T processor, the VL-COMm-26 provides significant performance
and lower power consumption (7W–8W typical) in a very compact package. The VL-COMm-26
provides compatibility with a broad range of standard x86 application development tools for
reduced development time.
The VL-COMm-26 utilizes advanced Intel technologies to maximize performance. Intel Hyper-
Threading Technology (Intel HT Technology) provides two processing threads per physical
core which allows applications to work in parallel and complete tasks sooner. Intel Virtualization
Technology allows one VL-COMm-26 system to function as multiple “virtual” platforms. This
enables computing activities to be isolated into separate partitions for increased application
flexibility and reliability. Enhanced Intel SpeedStep® Technology enables high performance
while meeting the power-conservation needs of embedded systems by switching voltage and
frequency levels in response to processor load.
The integrated Intel GMA600 graphics core provides hardware-accelerated MPEG-4 / H.264
and MPEG-2 video encoding and decoding. A standard LVDS output supports flat panel
displays. An SDVO output supports a variety of signaling interfaces including VGA and DVI.
The standard Type 10 pin-out provides industry-standard system interfaces including Gigabit
Ethernet with network boot capability, seven USB ports, three x1 PCIe lanes, two serial
interfaces, Intel High-Definition Audio (HDA), LPC, and SMBus to the carrier board. An auxiliary
board-to-board connector provides two additional serial interfaces and a CAN interface. Dual
SATA 3 Gb/s interfaces support high-capacity storage. A microSD socket provides flexible
solid-state drive (SSD) options.
For enhanced security, the VL-COMm-26 supports Execute Disable Bit functionality. This
hardware-based security feature reduces exposure to viruses and malicious-code attacks
by preventing harmful software from executing and propagating on the network. An optional
on-board Trusted Platform Module (TPM) is available for applications that require additional
hardware-level security functions.
Trusted Platform Module
(optional)
On-board security option defends against attacks from
unauthorized hardware and software.
Fanless Operation
No moving parts required for CPU cooling.
Wide Input Voltage Range
High-performance Video
Accepts 8 to 17 volts (12V typ.).
Graphics core supports MPEG-4 / H.264 and MPEG-2
encoding and decoding.
Network
RAM
Gigabit Ethernet (GbE) with remote boot support.
Up to 2 GB soldered-on DDR2 RAM.
I/O Interfaces
SATA, PCIe, USB host / client, serial, HD audio, LPC, SMBus,
and CAN.
Flash Memory
On-board microSD™ socket and SDIO interface for plug-in
flash storage.
VersaLogic Corporation
•
12100 SW Tualatin Rd., Tualatin, OR 97062
•
(503) 747-2261
•
Info@VersaLogic.com
•
www.VersaLogic.com
Designed and tested for industrial temperature (-40º to +85ºC) operation, the
rugged VL-COMm-26 also meets MIL-STD-202G specifications for shock
and vibration. Soldered-on RAM provides additional ruggedization for use in
extremely harsh environments. Heatsink or heat plate versions provide fanless
heat dissipation. Thermal monitoring technologies protect the system from
thermal failure by reducing power consumption when required to remain within
normal thermal operating limits.
A wide input voltage range of 8 to 17 volts (12V typ.) simplifies system power supply
requirements. It is fully compatible with 12V automotive-type power systems.
The VL-COMm-26 is compatible with a variety of popular x86 operating systems
including Windows, Windows Embedded, Linux, and VxWorks.
Product customization is available, even in low quantities. Options include
a Trusted Platform Module, conformal coating, BGA underfill, IPC Class 3
(modified) construction, BIOS/splash screen configuration, application-specific
testing, BOM revision locks, special labeling, etc.
As a mate to the VL-COMm-26, VersaLogic can design and manufacture carrier
boards that meet your exact requirements for an embedded system. Please
contact a VersaLogic Sales Engineer for more information.
COM Express Mini CPU Module
Specifications
General
Form Factor
Processor
COM Express mini (Type 10): 55 mm x 84 mm (2.17” x 3.31”)
Intel Atom E6x0T platform. 512K 8-way L2 cache. Intel
Hyper-Threading Technology (HT), Virtualization Technology
(VT), Enhanced SpeedStep Technology, Thermal
Monitoring Technologies, and Execute Disable Bit.
Intel EG20T Platform Controller Hub (PCH)
Connection for 3.0V RTC backup battery
Model
Idle
Typical Max.
S3
VL-COMm-26EAx
7.2W 7.4W 7.6W 3.0W
VL-COMm-26EBx 7.3W 8.0W 8.7W 3.0W
VL-COMm-26ECx
7.3W 8.4W 9.5W 3.0W
VL-COMm-26EDx 7.3W 8.4W 9.5W 3.0W
8V–17V (nominal 12V operation)
All voltage rails monitored. Watchdog timer with
programmable timeout (1 µS to 10 min.).
Standard
IPC-A-610 Class 2
Custom
IPC-A-610 Class 3 (modified)
RoHS compliant
-40° to +85°C. Derate -1.1°C per 305m (1,000 ft.)
above 2,300m (7,500 ft.).
¤
-40° to +85°C
Fanless. Heatsink or bolt-down heat plate.
Model
Temp. Range
Airflow
Heat plate models
-40° to +85°C
Zero airflow
Heat plate must be
kept below 90°C
Heatsink models
-40° to +60°C
Zero airflow
+60° to +85°C
300 LFM
Operating
To 15,000 ft. (4,570m)
Storage
To 40,000 ft. (12,000m)
5°C/min. over operating temperature
Less than 95%, noncondensing
MIL-STD-202G, Method 204, Modified Condition A: 2g
constant acceleration from 5 to 500 Hz, 20 min. per axis
MIL-STD-202G, Method 214A, Condition A: 5.35g rms,
5 min. per axis
MIL-STD-202G, Method 213B, Condition G: 20g
half-sine, 11 ms duration per axis
Support for Intel Trusted Platform Module 1.2 devices
Up to 2 GB soldered-on DDR2 SDRAM. 800 MT/s.
Intel GMA600 high-performance graphics core.
Advanced 2D / 3D graphics. Hardware-accelerated
video encode and decode.
Up to 256 MB + 384 MB shared DRAM
SDVO supports a variety of signaling interfaces
including VGA and DVI. Up to 1920 x 1080 (50 Hz) or
1280 x 1024 (85 Hz).
Single-channel LVDS interface. 18/24-bit. Up to
1280 x 768 (60 Hz).
Two SATA 3 Gb/s ports
π
microSD socket supports up to 32 GB. SDIO interface
supports SD, SDIO, and MMC.
One autodetect 10BaseT/100BaseTX/1000BaseT port.
Network boot option.
Six host and one client USB 2.0 ports
CMOS levels. 16C550 compatible. 1 Mbps max.
Intel High-Definition Audio (HDA) CODEC
Three x1 PCIe (Gen 1) lanes
1 MHz
33 MHz
Wake, reset, and power
2-wire CAN port
CMOS levels. 16C550 compatible. 1 Mbps max.
Handshake lines.
CMOS levels. 16C550 compatible. 1 Mbps max.
AMI Aptio UEFI BIOS with OEM enhancements.
Field reprogrammable.
ACPI 3.0. Support for S3 suspend state.
Compatible with most x86 operating systems including
Windows, Windows Embedded, Linux, and VxWorks
VL-COMm-26
Chipset
Battery
Power Requirements
(@ +12V)
§
Input Voltage
System Reset & Hardware
Monitors
Manufacturing Standards
Regulatory Compliance
Operating Temperature
Storage Temperature
Cooling
Airflow Requirements
Environmental
Ordering Information
Model
VL-COMm-26EAP*
VL-COMm-26EBP
VL-COMm-26ECP
VL-COMm-26EDP*
VL-COMm-26EAK*
VL-COMm-26EBK
VL-COMm-26ECK
VL-COMm-26EDK*
* Special order
Processor
Atom E620T
Atom E640T
Atom E680T
Atom E680T
Atom E620T
Atom E640T
Atom E680T
Atom E680T
Speed
0.6 GHz
1.0 GHz
1.6 GHz
1.6 GHz
0.6 GHz
1.0 GHz
1.6 GHz
1.6 GHz
RAM
512 MB
1 GB
1 GB
2 GB
512 MB
1 GB
1 GB
2 GB
Cooling
Heat plate
Heat plate
Heat plate
Heat plate
Heatsink
Heatsink
Heatsink
Heatsink
Altitude
¤
Thermal Shock
Humidity
Vibration, Sinusoidal
Sweep
¥
Vibration, Random
¥
Mechanical Shock
¥
Accessories
Part Number
Description
Carrier Boards
VL-BBm-10E-xxxx
Carrier board, 5 mm board spacing, AUX connector, Class 2
Solid-State Storage (Flash Memory)
VL-F41-xxxx
microSD card (SDIO), SLC, industrial temp.
Hardware
VL-HDW-405
Secondary mounting plate. Simplifies installation in many situations.
Attaches to heat plate models.
Miscellaneous
VL-HDW-401
Thermal compound paste (1.75g)
Security
Memory
Video
TPM (optional)
System RAM
General
VRAM
Desktop Display Interface π
OEM Flat Panel Interface π
Mass Storage
Network Interface
Type 10
I/O Interfaces
Rotating Drives /
Flash / Solid-State Drives
‡
Ethernet
† π
USB
‡
COM 3 / 4
#
Audio
PCIe
SMBus
LPC
Control
CAN
†
COM 1
#
COM 2
#
BIOS
Sleep Mode
Operating Systems
§ Represents operation at +25°C and +12V supply running Windows XP with LVDS display, SATA, GbE,
COM, and USB keyboard / mouse. Typical power computed as the mean value of Idle and Maximum power
specifications. Maximum power measured with 95% CPU utilization.
† IEEE 1588 Precision Time Protocol (PTP) compatible
‡ Bootable storage device
¤ Extended altitude specifications available upon request
π Available via Type 10 I/O connector
# COM1 and COM2 ports are available only when the auxiliary board-to-board connector is used
¥ MIL-STD-202G shock and vibe levels are used to illustrate the extreme ruggedness of this product in
general. Testing to higher levels and / or different types of shock or vibration methods can be accommodated
per the specific requirements of the application. Contact a VersaLogic Sales Engineer for further information.
Specifications are subject to change without notification. Intel and Atom are trademarks of Intel Corp.
COM Express is a trademark of PICMG. PCI Express is a registered trademark of PCI-SIG. microSD is a
trademark of SD-3C, LLC. All other trademarks are the property of their respective owners.
Auxiliary
I/O Interfaces
Software
02/21/13
VersaLogic Corporation
•
12100 SW Tualatin Rd., Tualatin, OR 97062
•
(503) 747-2261
•
Info@VersaLogic.com
•
www.VersaLogic.com
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