Datasheet
RL78/G1C
RENESAS MCU
R01DS0348EJ0120
Rev.1.20
Sep 30, 2016
Integrated USB Controller, True Low Power Platform (as low as 112.5
µ
A/MHz, and 0.61
µ
A for RTC + LVD),
2.4 V to 5.5 V Operation, 32 Kbyte Flash, 31 DMIPS at 24 MHz, for All USB Based Applications
1.
1.1
OUTLINE
Features
Direct Memory Access (DMA) Controller
•
Up to 2 fully programmable channels
•
Transfer unit: 8- or 16-bit
Multiple Communication Interfaces
2
•
Up to 2 x I C master
2
•
Up to 1 x I C multi-master
•
Up to 2 x CSI (7-, 8-bit)
•
Up to 1 x UART (7-, 8-, 9-bit)
Extended-Function Timers
•
Multi-function 16-bit timer TAU: Up to 4 channels
(remote control output available)
•
Real-time clock (RTC): 1 channel (full calendar and
alarm function with watch correction function)
•
12-bit interval timer: 1 channel
•
15 kHz watchdog timer: 1 channel (window function)
Rich Analog
•
ADC: Up to 9 channels, 8/10-bit resolution, 2.1
µs
minimum conversion time
•
Internal voltage reference (1.45 V)
•
On-chip temperature sensor
Safety Features (IEC or UL 60730 compliance)
•
Flash memory CRC calculation
•
RAM parity error check
•
RAM write protection
•
SFR write protection
•
Illegal memory access detection
•
Clock stop/frequency detection
•
ADC self-test
•
I/O port read back function (echo)
General Purpose I/O
•
5 V tolerant, high-current (up to 20 mA per pin)
•
Open-Drain, Internal Pull-up support
Operating Ambient Temperature
• Standard:
−40°C
to + 85°C
• Extended:
−40°C
to + 105°C
Package Type and Pin Count
• 32-pin plastic HWQFN (5 x 5)
• 32-pin plastic LQFP (7 x 7)
• 48-pin plastic LFQFP (7 x 7)
• 48-pin plastic HWQFN (7 x 7)
Note
To use the Apple Inc. battery charging mode, you must
join in Apple's Made for iPod/iPhone/iPad (MFi)
licensing program. Before requesting this specification
from Renesas Electronics, please join in the Apple's
MFi licensing program.
Ultra-Low Power Technology
•
2.4 V to 5.5 V operation from a single supply
•
Stop (RAM retained): 0.23
µA,
(LVD enabled): 0.31
µA
•
Halt (RTC + LVD): 0.57
µA
•
Supports snooze
•
Operating: 71
µA/MHz
16-bit RL78 CPU Core
•
Delivers 31 DMIPS at maximum operating frequency
of 24 MHz
•
Instruction Execution: 86% of instructions can be
executed in 1 to 2 clock cycles
•
CISC Architecture (Harvard) with 3-stage pipeline
•
Multiply Signed & Unsigned: 16 x 16 to 32-bit result in
1 clock cycle
•
MAC: 16 x 16 to 32-bit result in 2 clock cycles
•
16-bit barrel shifter for shift & rotate in 1 clock cycle
•
1-wire on-chip debug function
Code Flash Memory
•
Density: 32 KB
•
Block size: 1 KB
•
On-chip single voltage flash memory with protection
from block erase/writing
•
Self-programming with secure boot swap function
and flash shield window function
Data Flash Memory
•
Data Flash with background operation
•
Data flash size: 2 KB
•
Erase Cycles: 1 Million (typ.)
•
Erase/programming voltage: 2.4 V to 5.5 V
RAM
•
5.5 KB size options
•
Supports operands or instructions
•
Back-up retention in all modes
High-speed On-chip Oscillator
•
24 MHz with +/− 1% accuracy over voltage (2.4 V to
5.5 V) and temperature (−20°C to +85°C)
•
Pre-configured settings: 48 MHz, 24 MHz (TYP.)
Reset and Supply Management
•
Power-on reset (POR) monitor/generator
•
Low voltage detection (LVD) with 9 setting options
(Interrupt and/or reset function)
USB
•
Complying with USB version 2.0, incorporating
host/function controller
•
Corresponding to full-speed transfer (12 Mbps) and
low-speed (1.5 Mbps)
•
Complying with Battery Charging Specification
Revision 1.2
•
Compliant with the 2.1A/1.0A charging mode
prescribed in the Apple Inc. MFi specification in the
Note
USB power supply component specification
R01DS0348EJ0120 Rev.1.20
Sep 30, 2016
Page 1 of 134
RL78/G1C
ROM, RAM capacities
Flash ROM
Data flash
RAM
32-pin
32 KB
2 KB
5.5 KB
Note
R5F10JBC, R5F10KBC
RL78/G1C
1. OUTLINE
48-pin
R5F10JGC, R5F10KGC
Note
This is about 4.5 KB when the self-programming function is used.
Remark
The functions mounted depend on the product. See
1.6 Outline of Functions.
1.2
List of Part Numbers
Package
USB Function
Fields of
Application
Note
Pin count
Part Number
32 pins
32-pin plastic HWQFN
(5 × 5 , 0.5 mm pitch)
Host/Function controller
A
G
R5F10JBCANA#U0, R5F10JBCANA#W0
R5F10JBCGNA#U0, R5F10JBCGNA#W0
R5F10KBCANA#U0, R5F10KBCANA#W0
R5F10KBCGNA#U0, R5F10KBCGNA#W0
R5F10JBCAFP#V0, R5F10JBCAFP#X0
R5F10JBCGFP#V0, R5F10JBCGFP#X0
R5F10KBCAFP#V0, R5F10KBCAFP#X0
R5F10KBCGFP#V0, R5F10KBCGFP#X0
R5F10JGCAFB#V0, R5F10JGCAFB#X0
R5F10JGCGFB#V0, R5F10JGCGFB#X0
R5F10KGCAFB#V0, R5F10KGCAFB#X0s
R5F10JGCANA#U0, R5F10JGCANA#W0
R5F10JGCANA#U0, R5F10JGCANA#W0
R5F10JGCGNA#U0, R5F10JGCGNA#W0
R5F10KGCANA#U0, R5F10KGCANA#W0
R5F10KGCGNA#U0, R5F10KGCGNA#W0
Function controller only
A
G
32-pin plastic LQFP
(7 × 7 , 0.8 mm pitch)
Host/Function controller
A
G
Function controller only
A
G
48 pins
48-pin plastic LFQFP
(7 × 7 , 0.5 mm pitch)
Host/Function controller
A
G
Function controller only
A
G
48-pin plastic HWQFN
(7 × 7 , 0.5 mm pitch)
Host/Function controller
A
G
Function controller only
A
G
Note
For the fields of application, refer to
Figure 1-1
Part Number, Memory Size, and Package of
RL78/G1C.
Caution The part number above is valid as of when this manual was issued. For the latest part number,
see the web page of the target product on the Renesas Electronics website.
R01DS0348EJ0120 Rev.1.20
Sep 30, 2016
Page 2 of 134
RL78/G1C
Figure 1-1. Part Number, Memory Size, and Package of RL78/G1C
1. OUTLINE
Part No.
R5F10JGCAxxxFB#V0
Packing
#U0 : Tray (HWQFN)
#V0 : Tray (LQFP, LFQFP)
#W0 : Embossed Tape (HWQFN)
#X0 : Embossed Tape (LQFP, LFQFP)
Package
FP : LQFP, 0.80 mm pitch
FB : LFQFP, 0.50 mm pitch
NA : HWQFN, 0.50 mm pitch
ROM Number (Blank product is omitted)
Classification
A : Consumer use, operating ambient temperature:
−
40 °C to
+85
°C
G : Industrial use, operating ambient temperature:
−
40 °C to
+105
°C
ROM Capacity
C : 32 KB
Pin count
B : 32-pin
G : 48-pin
RL78/G1C group
10J : USB host / function controller mounted
10K : USB function controller mounted
Type of Memory
F : Flash data memory
Renesas Microcontroller
Renesas Semiconductor
R01DS0348EJ0120 Rev.1.20
Sep 30, 2016
Page 3 of 134
RL78/G1C
1. OUTLINE
1.3
1.3.1
Pin Configuration (Top View)
32-pin products
•
32-pin plastic HWQFN (5 × 5 mm, 0.5 mm pitch)
(1) USB function: Host/Function controller (R5F10JBC)
<R>
UDP0
UDM0
UV
BUS
UV
DD
UDP1
UDM1
P16/TI01/TO01/INTP5/UOVRCUR1
P17/TI02/TO02/UVBUSEN1
exposed die pad
24 23 22 21 20 19 18 17
25
16
26
15
27
14
RL78/G1C
13
28
(Top View)
12
29
30
11
31
10
32
9
1 2 3 4 5 6 7 8
P24/ANI4
P23/ANI3
P22/ANI2
P21/ANI1/AV
REFM
P20/ANI0/AV
REFP
P01/ANI16/TO00/INTP9/SCK01/SCL01/(SCLA0)
P00/ANI17/TI00/INTP8/SI01/SDA01/(SDAA0)
P120/ANI19/SO01/(PCLBUZ1)
P51/INTP2/SO00/TxD0/TOOLTxD/(TI01)/(TO01)
P50/INTP1/SI00/RxD0/TOOLRxD/SDA00/(TI02)/(TO02)
P30/INTP3/SCK00/SCL00/(TI03)/(TO03)/(PCLBUZ0)
P70/PCLBUZ1/UOVRCUR0
P31/TI03/TO03/INTP4/PCLBUZ0/UVBUSEN0
P62
P61/SDAA0
P60/SCLA0
Caution Connect the REGC pin to Vss via a capacitor (0.47 to 1
μ
F).
Remarks 1.
For pin identification, see
1.4
redirection register (PIOR).
3.
It is recommended to connect an exposed die pad to V
SS
.
Pin Identification.
2.
Functions in parentheses in the above figure can be assigned via settings in the peripheral I/O
R01DS0348EJ0120 Rev.1.20
Sep 30, 2016
P40/TOOL0
RESET
P137/INTP0
P122/X2/EXCLK
P121/X1
REGC
V
SS
V
DD
INDEX MARK
Page 4 of 134
RL78/G1C
(2) USB function: Function controller only (R5F10KBC)
<R>
UDP0
UDM0
UV
BUS
UV
DD
IC
Note
IC
Note
P16/TI01/TO01/INTP5
P17/TI02/TO02
1. OUTLINE
exposed die pad
24 23 22 21 20 19 18 17
25
16
26
15
27
14
28
RL78/G1C
13
29
(Top View)
12
30
11
31
10
32
9
1 2 3 4 5 6 7 8
P24/ANI4
P23/ANI3
P22/ANI2
P21/ANI1/AV
REFM
P20/ANI0/AV
REFP
P01/ANI16/TO00/INTP9/SCK01/SCL01/(SCLA0)
P00/ANI17/TI00/INTP8/SI01/SDA01/(SDAA0)
P120/ANI19/SO01/(PCLBUZ1)
P51/INTP2/SO00/TxD0/TOOLTxD/(TI01)/(TO01)
P50/INTP1/SI00/RxD0/TOOLRxD/SDA00/(TI02)/(TO02)
P30/INTP3/SCK00/SCL00/(TI03)/(TO03)/(PCLBUZ0)
P70/PCLBUZ1
P31/TI03/TO03/INTP4/PCLBUZ0
P62
P61/SDAA0
P60/SCLA0
INDEX MARK
Note
IC: Internal Connection Pin. Leave open.
Caution Connect the REGC pin to Vss via a capacitor (0.47 to 1
μ
F).
Remarks 1.
For pin identification, see
1.4
redirection register (PIOR).
3.
It is recommended to connect an exposed die pad to V
SS
.
Pin Identification.
2.
Functions in parentheses in the above figure can be assigned via settings in the peripheral I/O
R01DS0348EJ0120 Rev.1.20
Sep 30, 2016
P40/TOOL0
RESET
P137/INTP0
P122/X2/EXCLK
P121/X1
REGC
V
SS
V
DD
Page 5 of 134
京公网安备 11010802033920号
EEWORLD
