|
TPA6203A1DGNG4 |
TPA6203A1DRB |
TPA6203A1ZQVR |
TPA6203A1GQVR |
TPA6203A1DRBR |
TPA6203A1DRBRG4 |
TPA6203A1DGNRG4 |
TPA6203A1DRBG4 |
TPA6203A1DGN |
Description |
1.25-W Mono, Fully Differential, Class-AB Audio Amplifier 8-MSOP-PowerPAD -40 to 85 |
1.25-W Mono, Fully Differential, Class-AB Audio Amplifier 8-SON -40 to 85 |
1.25-W Mono, Fully Differential, Class-AB Audio Amplifier 8-BGA MICROSTAR JUNIOR -40 to 85 |
1.25-W Mono, Fully Differential, Class-AB Audio Amplifier 8-BGA MICROSTAR JUNIOR -40 to 85 |
1.25-W Mono, Fully Differential, Class-AB Audio Amplifier 8-SON -40 to 85 |
1.25-W Mono, Fully Differential, Class-AB Audio Amplifier 8-SON -40 to 85 |
1.25-W Mono, Fully Differential, Class-AB Audio Amplifier 8-MSOP-PowerPAD -40 to 85 |
1.25-W Mono, Fully Differential, Class-AB Audio Amplifier 8-SON -40 to 85 |
1.25-W Mono, Fully Differential, Class-AB Audio Amplifier 8-MSOP-PowerPAD -40 to 85 |
Brand Name |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Is it Rohs certified? |
conform to |
conform to |
conform to |
incompatible |
conform to |
conform to |
conform to |
conform to |
conform to |
Parts packaging code |
SOIC |
SON |
BGA |
BGA |
SON |
SON |
SOIC |
SON |
SOIC |
package instruction |
HTSSOP, |
HVQCCN, |
VFBGA, BGA8,3X3,20 |
VFBGA, BGA8,3X3,20 |
HVQCCN, |
HVQCCN, |
HTSSOP, |
HVQCCN, |
HTSSOP, |
Contacts |
8 |
8 |
8 |
8 |
8 |
8 |
8 |
8 |
8 |
Reach Compliance Code |
compli |
compli |
compli |
_compli |
compli |
compli |
compli |
compli |
compli |
ECCN code |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
Nominal bandwidth |
20 kHz |
20 kHz |
20 kHz |
20 kHz |
20 kHz |
20 kHz |
20 kHz |
20 kHz |
20 kHz |
Commercial integrated circuit types |
AUDIO AMPLIFIER |
AUDIO AMPLIFIER |
AUDIO AMPLIFIER |
AUDIO AMPLIFIER |
AUDIO AMPLIFIER |
AUDIO AMPLIFIER |
AUDIO AMPLIFIER |
AUDIO AMPLIFIER |
AUDIO AMPLIFIER |
harmonic distortion |
1% |
1% |
1% |
1% |
1% |
1% |
1% |
1% |
1% |
JESD-30 code |
S-PDSO-G8 |
S-PQCC-N8 |
S-PBGA-B8 |
S-PBGA-B8 |
S-PQCC-N8 |
S-PQCC-N8 |
S-PDSO-G8 |
S-PQCC-N8 |
S-PDSO-G8 |
JESD-609 code |
e4 |
e4 |
e1 |
e0 |
e4 |
e4 |
e4 |
e4 |
e4 |
length |
3 mm |
3 mm |
2 mm |
2 mm |
3 mm |
3 mm |
3 mm |
3 mm |
3 mm |
Humidity sensitivity level |
1 |
2 |
2 |
2 |
2 |
2 |
1 |
2 |
1 |
Number of channels |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
Number of functions |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
Number of terminals |
8 |
8 |
8 |
8 |
8 |
8 |
8 |
8 |
8 |
Maximum operating temperature |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
Nominal output power |
1.25 W |
1.25 W |
1.25 W |
1.25 W |
1.25 W |
1.25 W |
1.25 W |
1.25 W |
1.25 W |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
HTSSOP |
HVQCCN |
VFBGA |
VFBGA |
HVQCCN |
HVQCCN |
HTSSOP |
HVQCCN |
HTSSOP |
Package shape |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
Package form |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
Peak Reflow Temperature (Celsius) |
260 |
260 |
260 |
235 |
260 |
260 |
260 |
260 |
260 |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Maximum seat height |
1.1 mm |
1 mm |
1 mm |
1 mm |
1 mm |
1 mm |
1.1 mm |
1 mm |
1.1 mm |
Maximum supply voltage (Vsup) |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
Minimum supply voltage (Vsup) |
2.5 V |
2.5 V |
2.5 V |
2.5 V |
2.5 V |
2.5 V |
2.5 V |
2.5 V |
2.5 V |
surface mount |
YES |
YES |
YES |
YES |
YES |
YES |
YES |
YES |
YES |
technology |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
Terminal surface |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Tin/Silver/Copper (Sn/Ag/Cu) |
Tin/Lead (Sn/Pb) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Terminal form |
GULL WING |
NO LEAD |
BALL |
BALL |
NO LEAD |
NO LEAD |
GULL WING |
NO LEAD |
GULL WING |
Terminal pitch |
0.65 mm |
0.65 mm |
0.5 mm |
0.5 mm |
0.65 mm |
0.65 mm |
0.65 mm |
0.65 mm |
0.65 mm |
Terminal location |
DUAL |
QUAD |
BOTTOM |
BOTTOM |
QUAD |
QUAD |
DUAL |
QUAD |
DUAL |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
width |
3 mm |
3 mm |
2 mm |
2 mm |
3 mm |
3 mm |
3 mm |
3 mm |
3 mm |
Factory Lead Time |
1 week |
1 week |
1 week |
1 week |
1 week |
- |
- |
1 week |
1 week |
Maker |
- |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
- |
- |
- |
Texas Instruments |