MCP47FEB01A1-E/ST datasheet, PDF

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MCP47FEB01A1-E/ST: DescriptionIC DAC 8BIT; CategoryAnalog mixed-signal IC converter; File Size1MB，102 Pages; ManufacturerMicrochip; Websitehttps://www.microchip.com; Environmental Compliance

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MCP47FEB01A1-E/ST Overview

IC DAC 8BIT

MCP47FEB01A1-E/ST Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Microchip
package instruction	TSSOP, TSSOP8,.25
Reach Compliance Code	compliant
Factory Lead Time	10 weeks
Maximum analog output voltage	5.46 V
Minimum analog output voltage	0.01 V
Converter type	D/A CONVERTER
Enter bit code	BINARY
Input format	SERIAL
JESD-30 code	R-PDSO-G8
JESD-609 code	e3
length	4.4 mm
Maximum linear error (EL)	0.1953%
Humidity sensitivity level	1
Number of digits	8
Number of functions	1
Number of terminals	8
Maximum operating temperature	125 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	TSSOP
Encapsulate equivalent code	TSSOP8,.25
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius)	260
Filter level	TS 16949
Maximum seat height	1.2 mm
Nominal settling time (tstl)	6 µs
Maximum slew rate	0.5 mA
Nominal supply voltage	5 V
surface mount	YES
Temperature level	AUTOMOTIVE
Terminal surface	Matte Tin (Sn)
Terminal form	GULL WING
Terminal pitch	0.65 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	40
width	3 mm

User Manual

AN1326 - Using DAC for LDMOS Amplifier Bias Control Applications

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MCP47FEBXX

8-/10-/12-Bit Single/Dual Voltage Output Nonvolatile

Digital-to-Analog Converters with I

C™ Interface

Features

• Operating Voltage Range:

- 2.7V to 5.5V - Full Specifications

- 1.8V to 2.7V - Reduced Device Specifications

• Output Voltage Resolutions:

- 8-bit:

MCP47FEB0X

(256 Steps)

- 10-bit:

MCP47FEB1X

(1024 Steps)

- 12-bit:

MCP47FEB2X

(4096 Steps)

• Rail-to-Rail Output

• Fast Settling Time of 6 µs (typical)

• DAC Voltage Reference Source Options:

- Device V

- External V

REF

pin (buffered or unbuffered)

- Internal Band Gap (1.22V typical)

• Output Gain Options:

- Unity (1x)

- 2x (when not using internal V

as voltage

source)

• Nonvolatile Memory (EEPROM):

- User-programmed Power-on Reset

(POR)/Brown-out Reset (BOR) output setting

recall and device configuration bits

- Auto Recall of Saved DAC register setting

- Auto Recall of Saved Device Configuration

(Voltage Reference, Gain, Power-Down)

• Power-on/Brown-out Reset Protection

• Nonvolatile Memory Write Protect (WP) Bit

• Power-Down Modes:

- Disconnects output buffer (High Impedance)

- Selection of V

OUT

pull-down resistors

(100 k or 1 k)

• Low Power Consumption:

- Normal operation: <180 µA (Single), 380 µA

(Dual)

- Power-down operation: 650 nA typical

- EEPROM write cycle (1.9 mA maximum)

• I

C™ Interface:

- Slave address options: four predefined

addresses or user programmable (all 7 bits)

- Standard (100 kbps), Fast (400 kbps), and

High-Speed (up to 3.4 Mbps) modes

• Package Types: 8-lead TSSOP

• Extended Temperature Range: -40°C to +125°C

Package Types

MCP47FEBX1

TSSOP

Single

REF0

OUT0

NC 4

8 SDA

7 SCL

6 LAT0/HVC

5 V

MCP47FEBX2

TSSOP

Dual

REF

(1)

OUT0

OUT1

Note 1:

8 SDA

7 SCL

6 LAT

(1)

/HVC

5 V

This pin’s signal can be connected to DAC0

and/or DAC1.

General Description

The MCP47FEBXX are Single- and Dual-channel 8-bit,

10-bit, and 12-bit buffered voltage output Digital-to-

Analog Converters (DAC) with nonvolatile memory and

an I

C serial interface.

The V

REF

pin, the device V

or the internal band gap

voltage can be selected as the DAC’s reference

voltage. When V

is selected, V

is connected

internally to the DAC reference circuit. When the V

REF

pin is used, the user can select the output buffer’s gain

to be 1 or 2. When the gain is 2, the V

REF

pin voltage

should be limited to a maximum of V

/2.

These devices have a two-wire I

C-compatible serial

interface for Standard (100 kHz), Fast (400 kHz) or

High-Speed (1.7 MHz and 3.4 MHz) modes.

Applications

•

Set Point or Offset Trimming

Sensor Calibration

Low-Power Portable Instrumentation

PC Peripherals

Data Acquisition Systems

Motor Control



2015 Microchip Technology Inc.

DS20005375A-page 1

MCP47FEBXX

1.0

ELECTRICAL CHARACTERISTICS

Absolute Maximum Ratings

(†)

Voltage on V

with respect to V

......................................................................................................... -0.6V to +6.5V

Voltage on all pins with respect to V

............................................................................................... -0.6V to V

+0.3V

Input clamp current, I

< 0, V

> V

, V

> V

on HV pins) .......................................................................... ±20 mA

Output clamp current, I

< 0 or V

> V

)...................................................................................................±20 mA

Maximum current out of V

Maximum current into V

(Single) ..........................................................................................................50 mA

(Dual)...........................................................................................................100 mA

(Single) ..........................................................................................................50 mA

(Dual)...........................................................................................................100 mA

Maximum current sourced by the V

OUT

pin ............................................................................................................20 mA

Maximum current sunk by the V

OUT

pin..................................................................................................................20 mA

Maximum current sunk by the V

REF

pin .................................................................................................................125 µA

Maximum input current source/sunk by SDA, SCL pins ..........................................................................................2 mA

Maximum output current sunk by SDA Output pin .................................................................................................25 mA

Total power dissipation

(1)

....................................................................................................................................400 mW

Package power dissipation (T

= +50°C, T

= +150°C)

TSSOP-8...................................................................................................................................................700 mW

ESD protection on all pins

±4

kV (HBM)

±400V

(MM)

kV (CDM)

Latch-Up (per JEDEC JESD78A) @ +125°C ..................................................................................................... ±100 mA

Storage temperature ...............................................................................................................................-65°C to +150°C

Ambient temperature with power applied ...............................................................................................-55°C to +125°C

Soldering temperature of leads (10 seconds) ....................................................................................................... +300°C

Maximum Junction Temperature (T

) .................................................................................................................... +150°C

† Notice:

Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is

a stress rating only and functional operation of the device at those or any other conditions above those indicated in the

operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods

may affect device reliability.

Note 1:

Power dissipation is calculated as follows:

DIS

= V

x {I



} +



{(V

– V

) x I

} +

(V

x I

)



2015 Microchip Technology Inc.

DS20005375A-page 5

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