EEWORLDEEWORLDEEWORLD

Part Number

Search
 PDF

FGG.0B.302.CYCD21

Description
CONN PLUG MALE 2POS GOLD CRIMP
CategoryThe connector   
ManufacturerLEMO
Websitehttp://www.lemo-china.com
Environmental Compliance
Download Datasheet Parametric View All

FGG.0B.302.CYCD21 Overview

CONN PLUG MALE 2POS GOLD CRIMP

FGG.0B.302.CYCD21 Parametric

Parameter NameAttribute value
Connector typePlug, male pin
Number of pins2
Housing Dimensions - Plug-in302
Housing size, MIL-
Installation typefree hanging
Installation features-
Terminationcrimp
Fastening typepush-pull
towardsG
Shell materialbrass
Shell surfacechromate
Contact surface treatment - matinggold
colorsilver
Intrusion protectionIP50 - Dustproof
Material flammability ratingUL94 V-0
characteristicback shell
shieldshield
Rated current10A
Rated voltage-
Back shell material, platingBrass, chrome
Cable opening0.055" ~ 0.087"(1.40mm ~ 2.20mm)
Contact materialbrass
Contact Surface Treatment Thickness - Mating39.4µin(1.00µm)
Insert materialPolyetheretherketone (PEEK)
Operating temperature-55°C ~ 250°C
application-
Experiment 7. Lamp with switch
1. Experimental results All the lights are off. Then I press a button and the ()th light comes on. Then I press another button and the ()th light comes on. When I release the button, the light goes ou...
rain MCU
Ask for points
How can I get points? I registered an account but never successfully downloaded any files....
divdir Talking
EEWORLD University ---- Correctly Test MLCC
Correctly testing MLCC : https://training.eeworld.com.cn/course/4830Have you ever encountered a situation where your MLCC (multilayer ceramic capacitor) measurement value is either low or out of speci...
老白菜 Test/Measurement
SigmaTel acquires DDX technology, to be integrated into audio codecs
SigmaTel recently announced the acquisition of Apogee Technology's DDX (Direct Digital Amplification) technology, design team and intellectual property. Ron Edgerton, president and CEO of SigmaTel, sa...
rain Microchip MCU
Design of automobile panel mold for MFC modeling
4. Introducing the idea of parallel engineering in the design of automobile panel molds 4.1. The concept of parallel engineering Parallel engineering is a new product design and manufacturing model pr...
frozenviolet Automotive Electronics
VGA display image
VGA display image...
mdy-吴伟杰 FPGA/CPLD

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号