IC D/A CONV 12BIT R-R DUAL 8-DIP
| Parameter Name | Attribute value |
| Brand Name | Linear Technology |
| Is it Rohs certified? | conform to |
| Maker | Linear ( ADI ) |
| Parts packaging code | DIP |
| package instruction | DIP, DIP8,.3 |
| Contacts | 8 |
| Manufacturer packaging code | N |
| Reach Compliance Code | compliant |
| ECCN code | EAR99 |
| Samacsys Description | LINEAR TECHNOLOGY - LTC1448CN8#PBF - IC, DAC, DUAL 12BIT, DIP8, 1448 |
| Maximum analog output voltage | 5.5 V |
| Minimum analog output voltage | |
| Converter type | D/A CONVERTER |
| Enter bit code | BINARY |
| Input format | SERIAL |
| JESD-30 code | R-PDIP-T8 |
| JESD-609 code | e3 |
| Maximum linear error (EL) | 0.1343% |
| Humidity sensitivity level | 1 |
| Number of digits | 12 |
| Number of functions | 2 |
| Number of terminals | 8 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP8,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 3/5 V |
| Certification status | Not Qualified |
| Maximum seat height | 3.937 mm |
| Nominal settling time (tstl) | 14 µs |
| Maximum slew rate | 0.7 mA |
| Nominal supply voltage | 3 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Matte Tin (Sn) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 7.62 mm |
| LTC1448CN8#PBF | LTC2622IMS8#TRPBF | LTC1448CS8#TRPBF | LTC1448IS8#PBF | LTC1448IN8#PBF | LTC1448IS8#TRPBF | |
|---|---|---|---|---|---|---|
| Description | IC D/A CONV 12BIT R-R DUAL 8-DIP | IC DAC 12BIT DUAL R-R VOUT 8MSOP | IC D/A CONV 12BIT R-R DUAL 8SOIC | IC D/A CONV 12BIT R-R DUAL 8SOIC | IC DAC 12BIT R-R DUAL 8-DIP | IC D/A CONV 12BIT R-R DUAL 8SOIC |
| Brand Name | Linear Technology | Linear Technology | Linear Technology | Linear Technology | Linear Technology | Linear Technology |
| Is it Rohs certified? | conform to | conform to | conform to | conform to | conform to | conform to |
| Maker | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) |
| Parts packaging code | DIP | MSOP | SOIC | SOIC | DIP | SOIC |
| package instruction | DIP, DIP8,.3 | TSSOP, TSSOP8,.19 | SOP, SOP8,.25 | SOP, SOP8,.25 | DIP, DIP8,.3 | SOP, SOP8,.25 |
| Contacts | 8 | 8 | 8 | 8 | 8 | 8 |
| Manufacturer packaging code | N | MS8 | S8 | S8 | N | S8 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Maximum analog output voltage | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Converter type | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER |
| Enter bit code | BINARY | BINARY | BINARY | BINARY | BINARY | BINARY |
| Input format | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| JESD-30 code | R-PDIP-T8 | S-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDIP-T8 | R-PDSO-G8 |
| JESD-609 code | e3 | e3 | e3 | e3 | e3 | e3 |
| Maximum linear error (EL) | 0.1343% | 0.0977% | 0.1343% | 0.1343% | 0.1343% | 0.1343% |
| Humidity sensitivity level | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of digits | 12 | 12 | 12 | 12 | 12 | 12 |
| Number of functions | 2 | 1 | 2 | 2 | 2 | 2 |
| Number of terminals | 8 | 8 | 8 | 8 | 8 | 8 |
| Maximum operating temperature | 70 °C | 85 °C | 70 °C | 85 °C | 85 °C | 85 °C |
| Minimum operating temperature | - | -40 °C | - | -40 °C | -40 °C | -40 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | TSSOP | SOP | SOP | DIP | SOP |
| Encapsulate equivalent code | DIP8,.3 | TSSOP8,.19 | SOP8,.25 | SOP8,.25 | DIP8,.3 | SOP8,.25 |
| Package shape | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | 260 | 260 | 260 | NOT SPECIFIED | 260 |
| power supply | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 3.937 mm | 1.1 mm | 1.75 mm | 1.75 mm | 3.937 mm | 1.75 mm |
| Nominal settling time (tstl) | 14 µs | 7 µs | 14 µs | 14 µs | 14 µs | 14 µs |
| Maximum slew rate | 0.7 mA | 1.3 mA | 0.7 mA | 0.7 mA | 0.7 mA | 0.7 mA |
| Nominal supply voltage | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| surface mount | NO | YES | YES | YES | NO | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal surface | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
| Terminal form | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | GULL WING |
| Terminal pitch | 2.54 mm | 0.65 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | 30 | 30 | 30 | NOT SPECIFIED | 30 |
| width | 7.62 mm | 3 mm | 3.9 mm | 3.9 mm | 7.62 mm | 3.9 mm |
| length | - | 3 mm | 4.9 mm | 4.9 mm | - | 4.9 mm |
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