W528S25 datasheet, PDF - EEWORLD Datasheet

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W528S25: DescriptionADPCM VOICE SYNTHESIZER(PowerSpeech); CategoryAnalog mixed-signal IC Consumption circuit; File Size107KB，15 Pages; ManufacturerWinbond Electronics Corporation; Websitehttp://www.winbond.com.tw

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W528S25 Overview

ADPCM VOICE SYNTHESIZER(PowerSpeech)

W528S25 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Winbond Electronics Corporation
Parts packaging code	DIE
package instruction	DIE, DIE OR CHIP
Contacts	15
Reach Compliance Code	unknow
application	VOICE SYNTHESIS; Q AND A GAMES; EDUTAINMENT TOYS
Commercial integrated circuit types	SPEECH SYNTHESIZER
JESD-30 code	R-XUUC-N15
JESD-609 code	e0
Number of functions	1
Number of terminals	15
On-chip memory type	ROM
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	UNSPECIFIED
encapsulated code	DIE
Encapsulate equivalent code	DIE OR CHIP
Package shape	RECTANGULAR
Package form	UNCASED CHIP
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	3/5 V
Certification status	Not Qualified
Maximum read time	25 s
Maximum slew rate	0.8 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	2.4 V
surface mount	YES
Temperature level	COMMERCIAL
Terminal surface	TIN LEAD
Terminal form	NO LEAD
Terminal location	UPPER
Maximum time at peak reflow temperature	NOT SPECIFIED

W528S25 Related Products

	W528S25	W528S60	W528S50	W528S40	W528S20	W528S15	W528S12	W528S10
Description	ADPCM VOICE SYNTHESIZER(PowerSpeech)	ADPCM VOICE SYNTHESIZER(PowerSpeech)	ADPCM VOICE SYNTHESIZER(PowerSpeech)	ADPCM VOICE SYNTHESIZER(PowerSpeech)	ADPCM VOICE SYNTHESIZER(PowerSpeech)	ADPCM VOICE SYNTHESIZER(PowerSpeech)	ADPCM VOICE SYNTHESIZER(PowerSpeech)	ADPCM VOICE SYNTHESIZER(PowerSpeech)
Maker	Winbond Electronics Corporation	-	Winbond Electronics Corporation	Winbond Electronics Corporation	Winbond Electronics Corporation	-	Winbond Electronics Corporation	Winbond Electronics Corporation
package instruction	DIE, DIE OR CHIP	-	DIE, DIE OR CHIP	DIE, DIE OR CHIP	DIE, DIE OR CHIP	-	DIE, DIE OR CHIP	DIE, DIE OR CHIP
Reach Compliance Code	unknow	-	unknow	unknow	unknow	-	unknow	unknow
application	VOICE SYNTHESIS; Q AND A GAMES; EDUTAINMENT TOYS	-	SPEECH IC	SPEECH IC	VOICE SYNTHESIS; Q AND A GAMES; EDUTAINMENT TOYS	-	VOICE SYNTHESIS; Q AND A GAMES; EDUTAINMENT TOYS	VOICE SYNTHESIS; Q AND A GAMES; EDUTAINMENT TOYS
Commercial integrated circuit types	SPEECH SYNTHESIZER	-	SPEECH SYNTHESIZER	SPEECH SYNTHESIZER	SPEECH SYNTHESIZER	-	SPEECH SYNTHESIZER	SPEECH SYNTHESIZER
JESD-30 code	R-XUUC-N15	-	R-XUUC-N15	R-XUUC-N15	R-XUUC-N15	-	R-XUUC-N12	R-XUUC-N12
Number of functions	1	-	1	1	1	-	1	1
Number of terminals	15	-	15	15	15	-	12	12
On-chip memory type	ROM	-	ROM	ROM	ROM	-	ROM	ROM
Maximum operating temperature	70 °C	-	70 °C	70 °C	70 °C	-	70 °C	70 °C
Package body material	UNSPECIFIED	-	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	-	UNSPECIFIED	UNSPECIFIED
encapsulated code	DIE	-	DIE	DIE	DIE	-	DIE	DIE
Encapsulate equivalent code	DIE OR CHIP	-	DIE OR CHIP	DIE OR CHIP	DIE OR CHIP	-	DIE OR CHIP	DIE OR CHIP
Package shape	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	-	RECTANGULAR	RECTANGULAR
Package form	UNCASED CHIP	-	UNCASED CHIP	UNCASED CHIP	UNCASED CHIP	-	UNCASED CHIP	UNCASED CHIP
power supply	3/5 V	-	3/5 V	3/5 V	3/5 V	-	3/5 V	3/5 V
Certification status	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified	-	Not Qualified	Not Qualified
Maximum read time	25 s	-	50 s	40 s	20 s	-	12 s	10 s
Maximum slew rate	0.8 mA	-	0.8 mA	0.8 mA	0.8 mA	-	0.8 mA	0.8 mA
Maximum supply voltage (Vsup)	5.5 V	-	5.5 V	5.5 V	5.5 V	-	5.5 V	5.5 V
Minimum supply voltage (Vsup)	2.4 V	-	2.4 V	2.4 V	2.4 V	-	2.4 V	2.4 V
surface mount	YES	-	YES	YES	YES	-	YES	YES
Temperature level	COMMERCIAL	-	COMMERCIAL	COMMERCIAL	COMMERCIAL	-	COMMERCIAL	COMMERCIAL
Terminal form	NO LEAD	-	NO LEAD	NO LEAD	NO LEAD	-	NO LEAD	NO LEAD
Terminal location	UPPER	-	UPPER	UPPER	UPPER	-	UPPER	UPPER

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