WED8L24257V15BI datasheet, PDF

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WED8L24257V15BI: DescriptionAsynchronous SRAM, 3.3V, 256Kx24; Categorystorage storage; File Size450KB，6 Pages; ManufacturerWhite Electronic Designs Corporation; Websitehttp://www.wedc.com/

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WED8L24257V15BI Overview

Asynchronous SRAM, 3.3V, 256Kx24

WED8L24257V15BI Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	White Electronic Designs Corporation
package instruction	14 X 22 MM, MO-163, BGA-119
Reach Compliance Code	unknow
Maximum access time	15 ns
I/O type	COMMON
JESD-30 code	R-PBGA-B119
length	22 mm
memory density	6291456 bi
Memory IC Type	STANDARD SRAM
memory width	24
Number of functions	1
Number of terminals	119
word count	262144 words
character code	256000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	256KX24
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Encapsulate equivalent code	BGA119,7X17,50
Package shape	RECTANGULAR
Package form	GRID ARRAY
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	3.3 V
Certification status	Not Qualified
Maximum seat height	2.794 mm
Maximum standby current	0.09 A
Minimum standby current	3.14 V
Maximum slew rate	0.48 mA
Maximum supply voltage (Vsup)	3.465 V
Minimum supply voltage (Vsup)	3.135 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	BALL
Terminal pitch	1.27 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	14 mm

WED8L24257V15BI Related Products

	WED8L24257V15BI	WED8L24257V	WED8L24257V12BC	WED8L24257V10BC	WED8L24257V15BC	WED8L24257V12BI
Description	Asynchronous SRAM, 3.3V, 256Kx24	Asynchronous SRAM, 3.3V, 256Kx24	Asynchronous SRAM, 3.3V, 256Kx24	Asynchronous SRAM, 3.3V, 256Kx24	Asynchronous SRAM, 3.3V, 256Kx24	Asynchronous SRAM, 3.3V, 256Kx24
Is it Rohs certified?	incompatible	-	incompatible	incompatible	incompatible	incompatible
Maker	White Electronic Designs Corporation	-	White Electronic Designs Corporation	White Electronic Designs Corporation	White Electronic Designs Corporation	White Electronic Designs Corporation
package instruction	14 X 22 MM, MO-163, BGA-119	-	14 X 22 MM, MO-163, BGA-119	14 X 22 MM, MO-163, BGA-119	14 X 22 MM, MO-163, BGA-119	14 X 22 MM, MO-163, BGA-119
Reach Compliance Code	unknow	-	unknow	unknow	unknow	unknow
Maximum access time	15 ns	-	12 ns	10 ns	15 ns	12 ns
I/O type	COMMON	-	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-PBGA-B119	-	R-PBGA-B119	R-PBGA-B119	R-PBGA-B119	R-PBGA-B119
length	22 mm	-	22 mm	22 mm	22 mm	22 mm
memory density	6291456 bi	-	6291456 bi	6291456 bi	6291456 bi	6291456 bi
Memory IC Type	STANDARD SRAM	-	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	24	-	24	24	24	24
Number of functions	1	-	1	1	1	1
Number of terminals	119	-	119	119	119	119
word count	262144 words	-	262144 words	262144 words	262144 words	262144 words
character code	256000	-	256000	256000	256000	256000
Operating mode	ASYNCHRONOUS	-	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	-	70 °C	70 °C	70 °C	85 °C
organize	256KX24	-	256KX24	256KX24	256KX24	256KX24
Output characteristics	3-STATE	-	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	BGA	-	BGA	BGA	BGA	BGA
Encapsulate equivalent code	BGA119,7X17,50	-	BGA119,7X17,50	BGA119,7X17,50	BGA119,7X17,50	BGA119,7X17,50
Package shape	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY	-	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY
Parallel/Serial	PARALLEL	-	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	3.3 V	-	3.3 V	3.3 V	3.3 V	3.3 V
Certification status	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	2.794 mm	-	2.794 mm	2.794 mm	2.794 mm	2.794 mm
Maximum standby current	0.09 A	-	0.09 A	0.09 A	0.09 A	0.09 A
Minimum standby current	3.14 V	-	3.14 V	3.14 V	3.14 V	3.14 V
Maximum slew rate	0.48 mA	-	0.48 mA	0.5 mA	0.48 mA	0.48 mA
Maximum supply voltage (Vsup)	3.465 V	-	3.465 V	3.465 V	3.465 V	3.465 V
Minimum supply voltage (Vsup)	3.135 V	-	3.135 V	3.135 V	3.135 V	3.135 V
Nominal supply voltage (Vsup)	3.3 V	-	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	-	YES	YES	YES	YES
technology	CMOS	-	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	-	COMMERCIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL
Terminal form	BALL	-	BALL	BALL	BALL	BALL
Terminal pitch	1.27 mm	-	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	BOTTOM	-	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	14 mm	-	14 mm	14 mm	14 mm	14 mm

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