WS57C51C-55L datasheet, PDF - EEWORLD Datasheet

WS57C51C-55L: DescriptionHIGH SPEED 16K x 8 CMOS PROM/RPROM; Categorystorage storage; File Size39KB，7 Pages; ManufacturerSTMicroelectronics; Websitehttp://www.st.com/

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WS57C51C-55L Overview

HIGH SPEED 16K x 8 CMOS PROM/RPROM

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	STMicroelectronics
Parts packaging code	QFJ
package instruction	CERAMIC, LDCC-32
Contacts	32
Reach Compliance Code	not_compliant
ECCN code	EAR99
Maximum access time	55 ns
JESD-30 code	R-CQCC-J32
JESD-609 code	e0
length	13.945 mm
memory density	131072 bit
Memory IC Type	UVPROM
memory width	8
Number of functions	1
Number of terminals	32
word count	16384 words
character code	16000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	16KX8
Output characteristics	3-STATE
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	WQCCJ
Encapsulate equivalent code	LDCC32,.5X.6
Package shape	RECTANGULAR
Package form	CHIP CARRIER, WINDOW
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Maximum seat height	4.06 mm
Maximum slew rate	0.123 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	J BEND
Terminal pitch	1.27 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	11.24 mm
Base Number Matches	1

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