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MCP2557FDT-H/MNY

Description
IC TXRX CAN FD 8MBPS 8TDFN
CategoryWireless rf/communication    Telecom circuit   
File Size511KB,36 Pages
ManufacturerMicrochip
Websitehttps://www.microchip.com
Environmental Compliance
Download Datasheet Parametric Compare View All

MCP2557FDT-H/MNY Overview

IC TXRX CAN FD 8MBPS 8TDFN

MCP2557FDT-H/MNY Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerMicrochip
package instructionHVSON,
Reach Compliance Codecompliant
Factory Lead Time5 weeks
JESD-30 codeR-PDSO-N8
JESD-609 codee4
length3 mm
Number of functions1
Number of terminals8
Maximum operating temperature105 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeHVSON
Package shapeRECTANGULAR
Package formSMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Filter levelTS 16949
Maximum seat height0.8 mm
Nominal supply voltage5 V
surface mountYES
Telecom integrated circuit typesINTERFACE CIRCUIT
Temperature levelINDUSTRIAL
Terminal surfaceNickel/Palladium/Gold (Ni/Pd/Au)
Terminal formNO LEAD
Terminal pitch0.5 mm
Terminal locationDUAL
width2 mm
MCP2557FD/8FD
CAN FD Transceiver with Silent Mode
Features
• Silent Mode is Useful in the Following
Applications:
- Disables transmitter in redundant systems
- Implements babbling idiot protection
- Tests connection of bus medium
- Prevents a faulty CAN controller from
disrupting all network communications
• Optimized for CAN FD at 2, 5 and 8 Mbps
Operation:
- Maximum propagation delay: 120 ns
- Loop delay symmetry: ±10%(2 Mbps)
• Meets or Exceeds Stringent Automotive Design
Requirements Including “Hardware Require-
ments for LIN, CAN and FlexRay Interfaces in
Automotive Applications”, Version 1.3, May 2012:
- Conducted emissions at 2 Mbps with
Common-Mode Choke (CMC)
- DPI at 2 Mbps with CMC
• Meets SAE J2962/2 “Communication Transceiv-
ers Qualification Requirements – CAN”
- Passes radiated emissions at 2 Mbps without
a CMC
• Meets Latest ISO/DIS-11898-2:2015
• Meets Latest SAE J2284-4 and -5 Working Drafts
• Digital Inputs of the MCP2557FD are Compatible
to 3.3V and 5V Microcontrollers. R
XD
Output
Requires a 5V Tolerant Microcontroller Input
• Functional Behavior Predictable Under all Supply
Conditions:
- Device is in Unpowered mode if V
DD
drops
below Power-on Reset (POR) level
- Device is in Unpowered mode if V
IO
drops
below POR level
Description
The MCP2557FD/8FD CAN transceiver family is
designed for high-speed CAN FD applications with up
to 8 Mbps communication speed. The maximum prop-
agation delay was improved to support longer bus
length.
The device meets automotive requirements for CAN
FD bit rates exceeding 2 Mbps, low quiescent current,
electromagnetic compatibility (EMC) and electrostatic
discharge (ESD).
Package Types
MCP2557FD
SOIC
T
XD
1
V
SS
2
V
DD
3
R
XD
4
8 S
7 CANH
6 CANL
5 NC
MCP2558FD
SOIC
T
XD
1
V
SS
2
V
DD
3
R
XD
4
8 S
7 CANH
6 CANL
5 V
IO
MCP2557FD
2x3 TDFN*
T
XD
1
V
SS
2
V
DD
3
R
XD
MCP2558FD
2x3 TDFN*
T
XD
1
V
SS
2
V
DD
3
R
XD
8
S
EP
9
7
CANH
6
CANL
5
NC
8
S
EP
9
7
CANH
6
CANL
5
V
IO
4
4
MCP2557FD
3x3 DFN*
T
XD
V
SS
V
DD
R
XD
MCP2558FD
3x3 DFN*
S
CANH
CANL
NC
T
XD
V
SS
V
DD
R
XD
1
2
3
4
EP
9
8
7
6
5
1
2
3
4
EP
9
8
7
6
5
S
CANH
CANL
V
IO
Applications
CAN 2.0 and CAN FD networks in Automotive,
Industrial, Aerospace, Medical, and Consumer
applications.
*Includes Exposed Thermal Pad (EP); see
Table 1-1.
MCP2557FD/8FD Family Members
Device
MCP2557FD
MCP2558FD
Note:
V
IO
Pin
N/A
Yes
NC
Yes
N/A
TTL I/O
Yes
N/A
V
IO
I/O
N/A
Yes
Internal level shifter on digital I/O pins.
Description
For ordering information, see the
Product Identification System
section.
2016 Microchip Technology Inc.
DS20005533A-page 1

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Description IC TXRX CAN FD 8MBPS 8TDFN IC TXRX CAN FD 8MBPS 8DFN IC TXRX CAN FD 8MBPS 8DFN IC TXRX CAN FD 8MBPS 8TDFN IC TXRX CAN FD 8MBPS 8SOIC Type: Transceiver Number of Drivers/Receivers: 1/1 Protocol Category: CAN Bus Data Rate: - Type: Transceiver Number of Drivers/Receivers: 1/1 Protocol Category: CAN Bus Data Rate: - DATACOM, INTERFACE CIRCUIT DATACOM, INTERFACE CIRCUIT DATACOM, INTERFACE CIRCUIT
Maker Microchip Microchip Microchip Microchip Microchip Microchip Microchip Microchip Microchip Microchip
package instruction HVSON, HVSON, HVSON, HVSON, SOP, SOP, SOP, HVSON, HVSON, HVSON,
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant compliant compliant compliant
JESD-30 code R-PDSO-N8 S-PDSO-N8 S-PDSO-N8 R-PDSO-N8 R-PDSO-G8 R-PDSO-G8 R-PDSO-G8 R-PDSO-N8 S-PDSO-N8 R-PDSO-N8
length 3 mm 3 mm 3 mm 3 mm 4.9 mm 4.9 mm 4.9 mm 3 mm 3 mm 3 mm
Number of functions 1 1 1 1 1 1 1 1 1 1
Number of terminals 8 8 8 8 8 8 8 8 8 8
Maximum operating temperature 105 °C 105 °C 105 °C 105 °C 105 °C 105 °C 105 °C 105 °C 105 °C 105 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code HVSON HVSON HVSON HVSON SOP SOP SOP HVSON HVSON HVSON
Package shape RECTANGULAR SQUARE SQUARE RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR SQUARE RECTANGULAR
Package form SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Filter level TS 16949 TS 16949 TS 16949 TS 16949 TS 16949 TS 16949 TS 16949 TS 16949 TS 16949 TS 16949
Maximum seat height 0.8 mm 1 mm 1 mm 0.8 mm 1.75 mm 1.75 mm 1.75 mm 0.8 mm 1 mm 0.8 mm
Nominal supply voltage 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES YES YES YES YES YES YES YES YES YES
Telecom integrated circuit types INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form NO LEAD NO LEAD NO LEAD NO LEAD GULL WING GULL WING GULL WING NO LEAD NO LEAD NO LEAD
Terminal pitch 0.5 mm 0.65 mm 0.65 mm 0.5 mm 1.27 mm 1.27 mm 1.27 mm 0.5 mm 0.65 mm 0.5 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
width 2 mm 3 mm 3 mm 2 mm 3.9 mm 3.9 mm 3.9 mm 2 mm 3 mm 2 mm
Is it Rohs certified? conform to conform to conform to conform to conform to conform to conform to - - -
Factory Lead Time 5 weeks 13 weeks 13 weeks 5 weeks 15 weeks 15 weeks 13 weeks - - -
JESD-609 code e4 e3 e3 e4 e3 e3 e3 - - -
Terminal surface Nickel/Palladium/Gold (Ni/Pd/Au) Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Nickel/Palladium/Gold (Ni/Pd/Au) Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed - - -
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