|
MAX1214EGK+TD |
MAX1214EGK-TD |
MAX1214EGK-D |
MAX1214EGK+D |
Description |
IC ADC 12BIT 210MSPS 68-QFN |
Analog to Digital Converters - ADC |
Analog to Digital Converters - ADC |
IC ADC 12BIT 210MSPS 68-QFN |
Is it Rohs certified? |
conform to |
incompatible |
incompatible |
conform to |
Parts packaging code |
QFN |
QFN |
QFN |
QFN |
package instruction |
10 X 10 MM, 0.9 MM HEIGHT, ROHS COMPLIANT, MO-220, QFN-68 |
10 X 10 MM, 0.9 MM HEIGHT, MO-220, QFN-68 |
10 X 10 MM, 0.9 MM HEIGHT, MO-220, QFN-68 |
HVQCCN, LCC68,.4SQ,20 |
Contacts |
68 |
68 |
68 |
68 |
Reach Compliance Code |
compliant |
not_compliant |
not_compliant |
compliant |
ECCN code |
3A001.A.5.A.3 |
3A001.A.5.A.3 |
3A001.A.5.A.3 |
3A001.A.5.A.3 |
Maximum analog input voltage |
1.59 V |
1.59 V |
1.59 V |
1.59 V |
Converter type |
ADC, PROPRIETARY METHOD |
ADC, PROPRIETARY METHOD |
ADC, PROPRIETARY METHOD |
ADC, PROPRIETARY METHOD |
JESD-30 code |
S-XQCC-N68 |
S-XQCC-N68 |
S-XQCC-N68 |
S-XQCC-N68 |
length |
10 mm |
10 mm |
10 mm |
10 mm |
Maximum linear error (EL) |
0.0427% |
0.0427% |
0.0427% |
0.0427% |
Humidity sensitivity level |
3 |
1 |
3 |
3 |
Number of analog input channels |
1 |
1 |
1 |
1 |
Number of digits |
12 |
12 |
12 |
12 |
Number of functions |
1 |
1 |
1 |
1 |
Number of terminals |
68 |
68 |
68 |
68 |
Maximum operating temperature |
85 °C |
85 °C |
85 °C |
85 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
Output bit code |
BINARY, OFFSET BINARY, 2'S COMPLEMENT BINARY |
BINARY, OFFSET BINARY, 2\'S COMPLEMENT BINARY |
BINARY, OFFSET BINARY, 2\'S COMPLEMENT BINARY |
BINARY, OFFSET BINARY, 2\'S COMPLEMENT BINARY |
Output format |
PARALLEL, WORD |
PARALLEL, WORD |
PARALLEL, WORD |
PARALLEL, WORD |
Package body material |
UNSPECIFIED |
UNSPECIFIED |
UNSPECIFIED |
UNSPECIFIED |
encapsulated code |
HVQCCN |
HVQCCN |
HVQCCN |
HVQCCN |
Encapsulate equivalent code |
LCC68,.4SQ,20 |
LCC68,.4SQ,20 |
LCC68,.4SQ,20 |
LCC68,.4SQ,20 |
Package shape |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
Package form |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
Peak Reflow Temperature (Celsius) |
260 |
225 |
245 |
260 |
power supply |
1.8 V |
1.8 V |
1.8 V |
1.8 V |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Sampling rate |
210 MHz |
210 MHz |
210 MHz |
210 MHz |
Sample and hold/Track and hold |
TRACK |
TRACK |
TRACK |
TRACK |
Maximum seat height |
0.9 mm |
0.9 mm |
0.9 mm |
0.9 mm |
Nominal supply voltage |
1.8 V |
1.8 V |
1.8 V |
1.8 V |
surface mount |
YES |
YES |
YES |
YES |
Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
Terminal form |
NO LEAD |
NO LEAD |
NO LEAD |
NO LEAD |
Terminal pitch |
0.5 mm |
0.5 mm |
0.5 mm |
0.5 mm |
Terminal location |
QUAD |
QUAD |
QUAD |
QUAD |
Maximum time at peak reflow temperature |
30 |
NOT SPECIFIED |
NOT SPECIFIED |
30 |
width |
10 mm |
10 mm |
10 mm |
10 mm |
JESD-609 code |
e3 |
- |
e0 |
e3 |
Terminal surface |
Matte Tin (Sn) |
- |
TIN LEAD |
TIN |
Maker |
- |
Maxim |
Maxim |
Maxim |