SSTUH32865ET,557 datasheet, PDF

SSTUH32865ET,557: DescriptionIC BUFFER 1.8V 28BIT SOT802; Categorylogic logic; File Size146KB，28 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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SSTUH32865ET,557 Overview

IC BUFFER 1.8V 28BIT SOT802

Parameter Name	Attribute value
Brand Name	NXP Semiconductor
Is it Rohs certified?	incompatible
Maker	NXP
Parts packaging code	BGA
package instruction	9 X 13 MM, 0.80 MM HEIGHT, PLASTIC, SOT-802-1, TFBGA-160
Contacts	160
Manufacturer packaging code	SOT802-1
Reach Compliance Code	unknown
series	SSTU
JESD-30 code	R-PBGA-B160
JESD-609 code	e0
length	13 mm
Logic integrated circuit type	D FLIP-FLOP
Humidity sensitivity level	2
Number of digits	28
Number of functions	1
Number of terminals	160
Maximum operating temperature	70 °C
Minimum operating temperature
Output characteristics	OPEN-DRAIN
Output polarity	COMPLEMENTARY
Package body material	PLASTIC/EPOXY
encapsulated code	TFBGA
Encapsulate equivalent code	BGA160,12X18,25
Package shape	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	240
power supply	1.8 V
propagation delay (tpd)	1.8 ns
Certification status	Not Qualified
Maximum seat height	1.2 mm
Maximum supply voltage (Vsup)	1.9 V
Minimum supply voltage (Vsup)	1.7 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	BALL
Terminal pitch	0.65 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	20
Trigger type	POSITIVE EDGE
width	9 mm
minfmax	450 MHz
Base Number Matches	1

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