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MOTOROLA
For More Information On This Product,
2
Go to: www.freescale.com
NC
TIMING SOLUTIONS
DL207 — Rev 0
Freescale Semiconductor, Inc.
MPC942C
DC CHARACTERISTICS
(TA = 0° to 70°C, VCCI = 2.5V
±5%,
VCCO = 2.5V
±5%)
Symbol
VIH
VIL
VOH
VOL
IIN
CIN
CPD
ZOUT
ICC
Characteristic
Input HIGH Voltage
Input LOW Voltage
Output HIGH Voltage
Output LOW Voltage
Input Current
Input Capacitance
Power Dissipation Capacitance
Output Impedance
Maximum Quiescent Supply Current
4.0
14
12
0.5
2.0
0.5
±200
Min
2.0
Typ
Max
VCCI
0.8
Unit
V
V
V
V
µA
pF
pF
Per Output
IOH = –16 mA
IOL = 16 mA
Condition
W
mA
Freescale Semiconductor, Inc...
AC CHARACTERISTICS
(TA = 0° to 70°C, VCCI = 2.5V
±5%,
VCCO = 2.5V
±5%)
Symbol
Fmax
tPLH
tsk(o)
tsk(pr)
tsk(pr)
dt
tr, tf
Characteristic
Maximum Frequency
Propagation Delay
Output–to–Output Skew
Part–to–Part Skew
Part–to–Part Skew
Duty Cycle
Output Rise/Fall Time
45
0.2
1.5
Min
Typ
Max
200
2.8
200
1.3
600
55
1.0
Unit
MHz
ns
ps
ns
ps
%
ns
Notes 1, 2
Notes 1, 3
Condition
DC CHARACTERISTICS
(TA = 0° to 70°C, VCCI = 3.3V
±5%,
VCCO = 3.3V
±5%)
Symbol
VIH
VIL
VOH
VOL
IIN
CIN
CPD
ZOUT
ICC
Characteristic
Input HIGH Voltage
Input LOW Voltage
Output HIGH Voltage
Output LOW Voltage
Input Current
Input Capacitance
Power Dissipation Capacitance
Output Impedance
Maximum Quiescent Supply Current
4.0
14
12
0.5
2.4
0.5
±200
Min
2.4
Typ
Max
VCCI
0.8
Unit
V
V
V
V
µA
pF
pF
Per Output
IOH = –20 mA
IOL = 20 mA
Condition
W
mA
AC CHARACTERISTICS
(TA = 0° to 70°C, VCCI = 3.3V
±5%,
VCCO = 3.3V
±5%)
Symbol
Fmax
tPLH
tsk(o)
tsk(pr)
tsk(pr)
dt
tr, tf
Characteristic
Maximum Frequency
Propagation Delay
Output–to–Output Skew
Part–to–Part Skew
Part–to–Part Skew
Duty Cycle
Output Rise/Fall Time
45
0.2
1.3
Min
Typ
Max
250
2.3
200
1.0
500
55
1.0
Unit
MHz
ns
ps
ns
ps
%
ns
Notes 1, 2
Notes 1, 3
Note 1
Condition
1. Tested using standard input levels, production tested @ 133 MHz.
2. Across temperature and voltage ranges, includes output skew.
3. For a specific temperature and voltage, includes output skew.
TIMING SOLUTIONS
DL207 — Rev 0
For More Information On This Product,
3
Go to: www.freescale.com
MOTOROLA
Freescale Semiconductor, Inc.
MPC942C
OUTLINE DIMENSIONS
–T–, –U–, –Z–
AE
P
1
FA SUFFIX
TQFP PACKAGE
CASE 873A–02
ISSUE A
A
A1
32
25
4X
0.20 (0.008) AB T–U Z
–T–
B
–U–
AE
V
DETAIL Y
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –AB– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS –T–, –U–, AND –Z– TO BE DETERMINED
AT DATUM PLANE –AB–.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –AC–.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.250 (0.010) PER SIDE. DIMENSIONS A AND B
DO INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –AB–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.520 (0.020).
8. MINIMUM SOLDER PLATE THICKNESS SHALL BE
0.0076 (0.0003).
9. EXACT SHAPE OF EACH CORNER MAY VARY
FROM DEPICTION.
MILLIMETERS
MIN
MAX
7.000 BSC
3.500 BSC
7.000 BSC
3.500 BSC
1.400
1.600
0.300
0.450
1.350
1.450
0.300
0.400
0.800 BSC
0.050
0.150
0.090
0.200
0.500
0.700
12
_
REF
0.090
0.160
0.400 BSC
1
_
5
_
0.150
0.250
9.000 BSC
4.500 BSC
9.000 BSC
4.500 BSC
0.200 REF
1.000 REF
INCHES
MIN
MAX
0.276 BSC
0.138 BSC
0.276 BSC
0.138 BSC
0.055
0.063
0.012
0.018
0.053
0.057
0.012
0.016
0.031 BSC
0.002
0.006
0.004
0.008
0.020
0.028
12
_
REF
0.004
0.006
0.016 BSC
1
_
5
_
0.006
0.010
0.354 BSC
0.177 BSC
0.354 BSC
0.177 BSC
0.008 REF
0.039 REF
Freescale Semiconductor, Inc...
B1
8
DETAIL Y
17
V1
9
–Z–
9
S1
S
4X
0.20 (0.008) AC T–U Z
G
–AB–
SEATING
PLANE
DETAIL AD
–AC–
BASE
METAL
N
AC T–U Z
0.10 (0.004) AC
F
8X
M
_
R
C E
SECTION AE–AE
X
DETAIL AD
GAUGE PLANE
0.250 (0.010)
H
W
K
Q
_
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