EEWORLDEEWORLDEEWORLD

Part Number

Search

JS28F00AP33EFA

Description
IC FLASH 1G PARALLEL 56TSOP
Categorystorage    storage   
File Size1MB,92 Pages
ManufacturerMicron Technology
Websitehttp://www.mdtic.com.tw/
Environmental Compliance
Download Datasheet Parametric View All

JS28F00AP33EFA Overview

IC FLASH 1G PARALLEL 56TSOP

JS28F00AP33EFA Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerMicron Technology
Parts packaging codeTSOP
package instructionTSSOP,
Contacts56
Reach Compliance Codecompliant
Maximum access time105 ns
Other featuresIT ALSO OPERATES IN ASYNCHRONOUS MODE
JESD-30 codeR-PDSO-G56
JESD-609 codee3
length18.4 mm
memory density1073741824 bit
Memory IC TypeFLASH
memory width16
Number of functions1
Number of terminals56
word count67108864 words
character code64000000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize64MX16
Package body materialPLASTIC/EPOXY
encapsulated codeTSSOP
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)260
Programming voltage3 V
Maximum seat height1.2 mm
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)2.3 V
Nominal supply voltage (Vsup)3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceMATTE TIN
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationDUAL
Maximum time at peak reflow temperature30
width14 mm
Base Number Matches1
512Mb, 1Gb, 2Gb: P33-65nm
Features
Micron Parallel NOR Flash Embedded
Memory (P33-65nm)
JS28F512P33BFD, JS28F512P33TFA, JS28F512P33EFA
PC28F512P33BFD, PC28F512P33TFA, PC28F512P33EFA
JS28F00AP33BFA, JS28F00AP33TFA, JS28F00AP33EFA
PC28F00AP33BFA, PC28F00AP33TFA, PC28F00AP33EFA,
PC28F00BP33EFA
Features
• High performance
• Easy BGA package features
– 95ns initial access for 512Mb, 1Gb Easy BGA
– 100ns initial access for 2Gb Easy BGA
– 25ns 16-word asychronous page read mode
– 52 MHz (Easy BGA) with zero WAIT states and
17ns clock-to-data output synchronous burst
read mode
– 4-, 8-, 16-, and continuous word options for burst
mode
• TSOP package features
– 105ns initial access for 512Mb, 1Gb TSOP
• Both Easy BGA and TSOP package features
– Buffered enhanced factory programming (BEFP)
at 2 MB/s (TYP) using a 512-word buffer
– 3.0V buffered programming at 1.46 MB/s (TYP)
using a 512-word buffer
• Architecture
– MLC: highest density at lowest cost
– Symmetrically blocked architecture (512Mb, 1Gb,
2Gb)
– Asymmetrically blocked architecture (512Mb,
1Gb); four 32KB parameter blocks: top or bottom
configuration
– 128KB main blocks
– Blank check to verify an erased block
• Voltage and power
– V
CC
(core) voltage: 2.3–3.6V
– V
CCQ
(I/O) voltage: 2.3–3.6V
– Standy current: 70µA (TYP) for 512Mb; 75µA
(TYP) for 1Gb
– 52 MHz continuous synchronous read current:
21mA (TYP), 24mA (MAX)
• Security
– One-time programmable register: 64 OTP bits,
programmed with unique information from Mi-
cron; 2112 OTP bits available for customer pro-
gramming
– Absolute write protection: V
PP
= V
SS
– Power-transition erase/program lockout
– Individual zero-latency block locking
– Individual block lock-down
– Password access
• Software
25μs
(TYP) program suspend
25μs
(TYP) erase suspend
– Flash Data Integrator optimized
– Basic command set and extended function Inter-
face (EFI) command set compatible
– Common flash interface
• Density and Packaging
– 56-lead TSOP package (512Mb, 1Gb)
– 64-ball Easy BGA package (512Mb, 1Gb, 2Gb)
– 16-bit wide data bus
• Quality and reliabilty
– JESD47 compliant
– Operating temperature: –40°C to +85°C
– Minimum 100,000 ERASE cycles per block
– 65nm process technology
PDF: 09005aef845667b8
p33_65nm_MLC_512Mb-1gb_2gb.pdf - Rev. C 12/13 EN
1
Products and specifications discussed herein are subject to change by Micron without notice.
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2013 Micron Technology, Inc. All rights reserved.

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号