1M-BIT [128K x 8] CMOS EPROM
| 27C1000A-12 | 27C1000A-90 | MX27C1000ATI-15 | MX27C1000ATI-90 | MX27C1000ATI-12 | |
|---|---|---|---|---|---|
| Description | 1M-BIT [128K x 8] CMOS EPROM | 1M-BIT [128K x 8] CMOS EPROM | 1M-BIT [128K x 8] CMOS EPROM | 1M-BIT [128K x 8] CMOS EPROM | 1M-BIT [128K x 8] CMOS EPROM |
| Is it Rohs certified? | - | - | incompatible | incompatible | incompatible |
| Maker | - | - | Macronix | Macronix | Macronix |
| Parts packaging code | - | - | TSOP1 | TSOP1 | TSOP1 |
| package instruction | - | - | TSOP1, TSSOP32,.8,20 | TSOP1, TSSOP32,.8,20 | TSOP1, TSSOP32,.8,20 |
| Contacts | - | - | 32 | 32 | 32 |
| Reach Compliance Code | - | - | unknow | unknow | unknow |
| ECCN code | - | - | EAR99 | EAR99 | EAR99 |
| Maximum access time | - | - | 150 ns | 90 ns | 120 ns |
| I/O type | - | - | COMMON | COMMON | COMMON |
| JESD-30 code | - | - | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 |
| JESD-609 code | - | - | e0 | e0 | e0 |
| length | - | - | 18.4 mm | 18.4 mm | 18.4 mm |
| memory density | - | - | 1048576 bi | 1048576 bi | 1048576 bi |
| Memory IC Type | - | - | OTP ROM | OTP ROM | OTP ROM |
| memory width | - | - | 8 | 8 | 8 |
| Number of functions | - | - | 1 | 1 | 1 |
| Number of terminals | - | - | 32 | 32 | 32 |
| word count | - | - | 131072 words | 131072 words | 131072 words |
| character code | - | - | 128000 | 128000 | 128000 |
| Operating mode | - | - | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | - | - | 85 °C | 85 °C | 85 °C |
| Minimum operating temperature | - | - | -40 °C | -40 °C | -40 °C |
| organize | - | - | 128KX8 | 128KX8 | 128KX8 |
| Output characteristics | - | - | 3-STATE | 3-STATE | 3-STATE |
| Package body material | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | - | - | TSOP1 | TSOP1 | TSOP1 |
| Encapsulate equivalent code | - | - | TSSOP32,.8,20 | TSSOP32,.8,20 | TSSOP32,.8,20 |
| Package shape | - | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | - | - | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE |
| Parallel/Serial | - | - | PARALLEL | PARALLEL | PARALLEL |
| Peak Reflow Temperature (Celsius) | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| power supply | - | - | 5 V | 5 V | 5 V |
| Certification status | - | - | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | - | - | 1.2 mm | 1.2 mm | 1.2 mm |
| Maximum standby current | - | - | 0.0001 A | 0.0001 A | 0.0001 A |
| Maximum slew rate | - | - | 0.03 mA | 0.03 mA | 0.03 mA |
| Maximum supply voltage (Vsup) | - | - | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | - | - | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | - | - | 5 V | 5 V | 5 V |
| surface mount | - | - | YES | YES | YES |
| technology | - | - | CMOS | CMOS | CMOS |
| Temperature level | - | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal surface | - | - | TIN LEAD | TIN LEAD | TIN LEAD |
| Terminal form | - | - | GULL WING | GULL WING | GULL WING |
| Terminal pitch | - | - | 0.5 mm | 0.5 mm | 0.5 mm |
| Terminal location | - | - | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | - | - | 8 mm | 8 mm | 8 mm |
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