74AHC30BQ-Q100X datasheet, PDF

74AHC30BQ-Q100X: DescriptionIC GATE NAND 1CH 8-INP 14DHVQFN; Categorylogic logic; File Size683KB，15 Pages; ManufacturerNexperia; Websitehttps://www.nexperia.com

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IC GATE NAND 1CH 8-INP 14DHVQFN

Parameter Name	Attribute value
Brand Name	Nexperia
Maker	Nexperia
Parts packaging code	QFN
package instruction	HVQCCN,
Contacts	14
Manufacturer packaging code	SOT762-1
Reach Compliance Code	compliant
Samacsys Description	74AHC(T)30-Q100 - 8-input NAND gate@en-us
series	AHC/VHC/H/U/V
JESD-30 code	R-PQCC-N14
length	3 mm
Logic integrated circuit type	NAND GATE
Humidity sensitivity level	1
Number of functions	1
Number of entries	8
Number of terminals	14
Maximum operating temperature	125 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	HVQCCN
Package shape	RECTANGULAR
Package form	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)	260
propagation delay (tpd)	15.5 ns
Filter level	AEC-Q100
Maximum seat height	1 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	2 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	AUTOMOTIVE
Terminal form	NO LEAD
Terminal pitch	0.5 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	30
width	2.5 mm

	74AHC30BQ-Q100X	74AHC30PW-Q100J
Description	IC GATE NAND 1CH 8-INP 14DHVQFN	IC GATE NAND 1CH 8-INP 14TSSOP
Brand Name	Nexperia	Nexperia
Maker	Nexperia	Nexperia
Parts packaging code	QFN	TSSOP
package instruction	HVQCCN,	TSSOP,
Contacts	14	14
Manufacturer packaging code	SOT762-1	SOT402-1
Reach Compliance Code	compliant	compliant
Samacsys Description	74AHC(T)30-Q100 - 8-input NAND gate@en-us	74AHC(T)30-Q100 - 8-input NAND gate@en-us
series	AHC/VHC/H/U/V	AHC/VHC/H/U/V
JESD-30 code	R-PQCC-N14	R-PDSO-G14
length	3 mm	5 mm
Logic integrated circuit type	NAND GATE	NAND GATE
Humidity sensitivity level	1	1
Number of functions	1	1
Number of entries	8	8
Number of terminals	14	14
Maximum operating temperature	125 °C	125 °C
Minimum operating temperature	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	HVQCCN	TSSOP
Package shape	RECTANGULAR	RECTANGULAR
Package form	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius)	260	260
propagation delay (tpd)	15.5 ns	15.5 ns
Filter level	AEC-Q100	AEC-Q100
Maximum seat height	1 mm	1.1 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V
Minimum supply voltage (Vsup)	2 V	2 V
Nominal supply voltage (Vsup)	5 V	5 V
surface mount	YES	YES
technology	CMOS	CMOS
Temperature level	AUTOMOTIVE	AUTOMOTIVE
Terminal form	NO LEAD	GULL WING
Terminal pitch	0.5 mm	0.65 mm
Terminal location	QUAD	DUAL
Maximum time at peak reflow temperature	30	30
width	2.5 mm	4.4 mm

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