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BBS-130-T-C

Description
INTERCONNECT STRIPS
CategoryThe connector   
File Size220KB,1 Pages
ManufacturerSAMTEC
Websitehttp://www.samtec.com/
Environmental Compliance
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INTERCONNECT STRIPS

BBS-130-T-C Parametric

Parameter NameAttribute value
Connector typeConnector
Contact typeMale pin
Spacing - Mating0.100"(2.54mm)
Number of pins30
Number of rows1
Line spacing - patching-
Number of pins loadedall
styleboard to board
shieldUncovered
Installation typeThrough hole
Terminationwelding
Fastening typepush-pull
Contact Length - Mating0.125"(3.18mm)
Contact length - terminal0.125"(3.18mm)
Overall contact length0.835"(21.21mm)
Insulation height0.585"(14.86mm)
Contact shaperound
Contact surface treatment - matingtin
Contact Surface Treatment Thickness - Mating-
Contact Surface Preparation - Columnnickel
Contact material-
Insulation MaterialsPolyester, fiberglass reinforced
characteristic-
Operating temperature-55°C ~ 125°C
Intrusion protection-
Material flammability rating-
Insulation colorblack
Rated current-
Rated voltage-
Joint stack height-
Contact Surface Treatment Thickness - Column50.0µin(1.27µm)
application-
F-219 (Rev 02NOV18)
BDL–110–G–F
BBL–112–T–E
BBD–130–T–B
BHS–125–G–A
(2.54 mm) .100"
BBS–116–G–C
BBS, BBL, BHS, BBD, BDL SERIES
MACHINED BOARD STACKING STRIPS
Mates with:
SS, SD, HSS, SL, SDL,
ESS, ESD
TYPE
STRIP
1
NO. PINS
PER ROW
PLATING
OPTION
LEAD
STYLE
FEATURES
Low-profile design
achieves (3.89 mm)
.153" board spacings
when mated with SL
Series.
Approach the reliability
of a permanent
connection with the
flexibility of a separable
connection.
= Standard Single Row
BBS
BBL
(2.54) .100 x No. of Positions
(2.54)
.100
(2.54) .100 TYP
(1.27)
.050
= 20 µ" (0.51 µm)
Gold
–G
–T
= Tin
= Low-Profile Single Row
(2.54)
.100
SPECIFICATIONS
For complete specifications
see www.samtec.com?BBS,
www.samtec.com?BBL,
www.samtec.com?BHS
www.samtec.com?BBD or
www.samtec.com?BDL
Insulator Material:
Black Glass Filled Polyester
(BBS, BBD)
Black High Temp Nylon
(BDL)
Black Liquid Crystal Polymer
(BHS, BBL)
Temperature Range:
-55 °C to +125 °C
Terminal Material:
Phosphor Bronze or Brass
Plating:
Au or Sn over 50 µ" (1.27 µm) Ni
RoHS Compliant:
Yes
Lead-Free Solderable:
Wave only
(BBS, BBD, BBL, BDL)
Wave, or reflow with
all Au (BHS)
= High Temp Single Row
BHS
BBL body available with
Styles –E & –F only.
BBS
BHS
BBL
(2.54) .100 x No. of Positions
= Standard Double Row
BBD
BDL
(5.08)
.200
(2.54) .100 TYP
(2.54)
.100
(1.27)
.050
01 THRU 32
= BBS & BBL
(2.54)
.100
01 THRU 36
BDL body available with
Styles –E & –F only.
= Low-Profile Double Row
BBD
= BBD, BDL & BHS
BDL
Z = (5.33 mm) .210"
–A
Z = (8.51 mm) .335"
–B
Z = (14.86 mm) .585"
–C
Z = (1.78 mm) .070"
–E
Z = (2.16 mm) .085"
–F
RECOGNITIONS
For complete scope
of recognitions see
www.samtec.com/quality
(3.18)
.125
(0.46)
.018
DIA
(1.27)
.050
(1.78)
.070
DIA
(1.27)
.050 DIA
(0.46)
.018
DIA
Style E:
(2.74)
.108
Style F:
(3.18)
.125
(0.46)
.018 DIA
Z
Z
(1.78)
.070 DIA
(0.46)
.018 DIA
(3.18)
.125
FILE NO. E111594
BBL
Series
(3.18)
.125
Z
BBD
Series
BDL
Series
BBS and BHS
Series
Note:
Some lengths, styles and
options are non-standard,
non-returnable.
Due to technical progress, all designs, specifications and components are subject to change without notice.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
WWW.SAMTEC.COM

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