F-218 (Rev 14DEC17)
CLP–115–02–L–D
CLP–107–02–F–D–P
10 YEAR MFG
WITH 30 µ" GOLD
EXTENDED LIFE
PRODUCT
HIGH MATING
CYCLES
CLP–130–02–L–D
CLP–116–02–F–DH
(1.27 mm) .050"
CLP SERIES
LOW-PROFILE DUAL WIPE SOCKET
SPECIFICATIONS
For complete specifications and
recommended PCB layouts
see www.samtec.com?CLP
Insulator Material:
Black Liquid Crystal Polymer
Contact Material:
Phosphor Bronze
Plating:
Sn or Au over
50 µ" (1.27 µm) Ni
Current Rating (CLP/FTSH):
3.4 A per pin
(2 pins powered)
Voltage Rating:
280 VAC/395 VDC
Operating Temp Range:
-55 °C to +125 °C
Insertion Depth:
Top Entry = (1.40 mm) .055"
minimum, Bottom Entry =
(2.41 mm) .095" minimum
plus board thickness
DH Entry = (2.31 mm) .091"
to (2.67 mm) .105"
Normal Force:
60 grams (0.59 N) average
Max Cycles:
100 with 10 µ" (0.25 µm) Au
RoHS Compliant:
Yes
Mates with:
FTSH, FTS, FW
High-reliability
Tiger Claw
™
contacts
(1.27 mm x 1.27 mm)
.050" x .050"
micro pitch
APPLICATIONS
CLP
FTSH
Low-profile
(2.21 mm)
.087"
HORIZONTAL
Surface
mount
PASS-THRU
Suitable for pass-through
applications
CLP
1
NO. PINS
PER ROW
02
PLATING
OPTION
ROW
OPTION
OTHER
OPTION
PROCESSING
Lead-Free Solderable:
Yes
SMT Lead Coplanarity:
(0.10 mm) .004" max (02-35)
(0.15 mm) .006" max (36-50)*
*(.004" stencil solution
may be available; contact
IPG@samtec.com)
02 thru 50
= Gold flash on
contact, Matte
Tin on tail
–F
–L
= Double
Row
–D
RECOGNITIONS
For complete scope of
recognitions see
www.samtec.com/quality
FILE NO. E111594
= 10 µ" (0.25 µm)
Gold on contact,
Matte Tin on tail
No. of Positions
x (1.27) .050 + (0.43) .017
100
(1.27)
.050
(0.41)
.016
= 10 µ" (0.25 µm)
Gold
(–D only)
(4.32)
.170
–G
= Double
Horizontal
(Requires
FTSH–01
and
FTSH–04
lead styles)
– DH
= Bottom Entry
(Required for bottom entry
applications)
–BE
–A
= Alignment Pin
(Not available with –PA option)
(05, 06, 07, 08, 10, 12, 15,
20, 25, 30, 40 positions only)
(–DH option and other sizes.
Contact Samtec.)
02
(4.57) (3.05)
.180 .120
ALSO AVAILABLE
(MOQ Required)
• Single row
• Other platings
Contact Samtec.
(3.43)
.135
99
01
(6.35)
.250
x
(3.18)
.125
(2.54)
.100
= (4.00 mm) .157" DIA
Polyimide film Pick & Place Pad
(5 positions min.)
–K
–P
(1.27)
.050
(2.29)
.090
–P OPTION
= Pick & Place Pad
(5 positions min. –D only)
(Not always necessary
for auto placement.
See Flex Processing.)
–DH
–D
(1.40)
.055
(8.25)
.325
(3.07)
.121
(0.89)
.035 DIA
(7.00)
.275
–PA OPTION
A
PIN/ROW
Note:
Some sizes, styles and
options are non-standard,
non-returnable.
04-15
16-50
A
(3.56) .140
(7.11) .280
If odd pins/row, alignment
pins are on middle position
on centerline of the part.
If even pins/row, then
alignment pins are between
middle two positions.
= Pick & Place Pad
with Alignment Pin
(–D only)
(Not Available with –A option)
–PA
= Tape & Reel
– TR
Due to technical progress, all designs, specifications and components are subject to change without notice.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
WWW.SAMTEC.COM
Microcontroller MCU
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