CHEMTRONICS
Technical Data Sheet
TDS # SWick
Soder-Wick
Desoldering Braid
PRODUCT DESCRIPTION
Soder-Wick
offers the state of the art in
desoldering technology. Soder-Wick
is
designed for today’s heat sensitive
electronic components using lighter mass,
pure copper braid construction that allows
for better thermal conductivity, even at low
temperatures. Soder-Wick
responds faster
than conventional desoldering braids
thereby minimizing overheating and
preventing PCB damage. A full range of
sizes and flux types are available, including
Rosin, No Clean, unfluxed and a high
temperature Lead-Free version. Whatever
the requirement, Soder-Wick
has the
answer.
Requires little or no post solder cleaning
No corrosive residues
Optimized construction for faster
wicking and heat transfer
Halide free
Minimizes the risk of heat damage to
components and circuit boards
TYPICAL APPLICATIONS
Soder-Wick
desoldering braid safely
removes solder from:
Thru-hole Components
SMT Pads and BGA Pads
Micro Circuits
Terminals
Lugs and Posts
Identification Script
TYPICAL PRODUCT DATA AND
PHYSICAL PROPERTIES
Flux Types:
Rosin Grade WW, Type “R”
Patented No Clean
High Temperature No Clean
ANSI/IPC J STD-004
MIL-F-14256 F
No Clean Flux Spec:
MIL-STD-883B
Bellcore TR-NWT-000078
ANSI/IPC J SF818
Shelflife:
Width
Inches
.030”
.060”
.080”
.110”
.145”
.210”
-
2 years
Width
Metric
0.8mm
1.5mm
2.0mm
2.8mm
3.7mm
5.3mm
-
Specifications:
Size #
1
2
3
4
5
6
BGA
Color
White
Yellow
Green
Blue
Brown
Red
Purple
STATIC DISSIPATIVE PACKAGING
Soder-Wick
SD is packaged on Static
Dissipative bobbins in 5 and 10-foot lengths
to minimize the risk of damage associated
with static electricity. The static dissipative
bobbins qualify as electrostatic discharge
protective per MIL-STD-1686C and MIL-
HDBK-263B, and meet the static delay rate
provision of MIL-B-81705C.
1) Choose a Soder-Wick
desoldering braid width
equal to or slightly larger than the pad or
connection.
2) Choose a solder iron tip equal to or slightly
larger than the pad or connection.
3) Set temperature of iron between 600-750°F
4) Place wick on solder joint and place tip of hot
iron on top of wick
5) As solder becomes molten, the color of the wick
will change from copper to silver.
6) Remove wick and iron from solder joint
simultaneously once color change has stopped.
7) The component lead / pad is now clean and free
from solder.
8) Clip and discard the used portion of the wick.
9) If needed, clean PCB with CircuitWorks
Flux
Remover Pen and remove soils with a
ControlWipes
absorbent wipe.
USAGE INSTRUCTIONS
For industrial use only.
Read MSDS carefully prior to use.
AVAILABILITY
Series:
40
50
80
60
70
75
Soder-Wick
Lead-Free, SD Bobbin
Soder-Wick
Rosin
Soder-Wick
Rosin, SD Bobbin
Soder-Wick
No Clean, SD Bobbin
Soder-Wick
Unfluxed
Soder-Wick
Unfluxed, SD Bobbin
VacuPak
Packaging
The VacuPak Can contains ten five-foot bobbins
in a vacuum sealed can. This package provides
the highest level of cleanliness and freshness.
Great for tool kit storage.
HELPFUL HINTS:
Water Soluble Users:
Use Soder-Wick
Unfluxed
70
or
75
Series to dip in water soluble
flux and then desolder normally.
Ball Grid Array:
Use Soder-Wick BGA with a
large tipped iron to remove solder from a number of
BGA pads all at once.
NOTE:
This information is believed to be accurate. It
is intended for professional end users having the skills to
evaluate and use the data properly. CHEMTRONICS
does not guarantee the accuracy of the data and assumes
no liability in connection with damages incurred while
using it.
Chemtronics, Soder-Wick and CircuitWorks are
registered trademarks of Chemtronics. All rights reserved.
VacuPak and ControlWipes are trademarks of
Chemtronics. All rights reserved.
SODER-WICK
IS DESIGNED TO MEET
OR EXCEED THE FOLLOWING:
MIL-F-14256F, Type R
NASA-STD-8739.3
DOD-STD-883E, Method 2022
ANSI/IPC J STD-004, Type ROL0
BELLCORE TR-NWT-000078
ANSI/IPC J SF-818
SODER-WICK
SD BOBBINS ARE
DESIGNED TO MEET OR EXCEED:
MIL-STD-2000A
MIL-B-81705C
MIL-STD-1686C
MIL-HDBK-263B
Chemtronics
8125 Cobb Center Drive
Kennesaw, GA 30152
1-770-424-4888
DISTRIBUTED BY:
REV. F (08/13)
TECHNICAL & APPLICATION
ASSISTANCE
Chemtronics provides a technical hotline to
answer your technical and application
related questions. The toll free number is:
1-800-TECH-401.
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