|
74HCT40105D,112 |
74HCT40105D,118 |
Description |
IC 4X16 FIFO REGISTER 16-SOIC |
IC FIFO REGISTER 4X16 16SOIC |
Brand Name |
NXP Semiconductor |
NXP Semiconductor |
Is it Rohs certified? |
conform to |
conform to |
Maker |
NXP |
NXP |
Parts packaging code |
SOP |
SOP |
package instruction |
SOP, SOP16,.25 |
SOP, |
Contacts |
16 |
16 |
Manufacturer packaging code |
SOT109-1 |
SOT109-1 |
Reach Compliance Code |
compliant |
compliant |
Maximum access time |
120 ns |
120 ns |
Other features |
REGISTER BASED; BUBBLE BACK 750NS |
REGISTER BASED; BUBBLE BACK 750NS |
period time |
100 ns |
100 ns |
JESD-30 code |
R-PDSO-G16 |
R-PDSO-G16 |
JESD-609 code |
e4 |
e4 |
length |
9.9 mm |
9.9 mm |
memory density |
64 bit |
64 bit |
memory width |
4 |
4 |
Humidity sensitivity level |
1 |
1 |
Number of functions |
1 |
1 |
Number of terminals |
16 |
16 |
word count |
16 words |
16 words |
character code |
16 |
16 |
Operating mode |
ASYNCHRONOUS |
ASYNCHRONOUS |
Maximum operating temperature |
125 °C |
125 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
organize |
16X4 |
16X4 |
Output characteristics |
3-STATE |
3-STATE |
Exportable |
YES |
YES |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
SOP |
SOP |
Package shape |
RECTANGULAR |
RECTANGULAR |
Package form |
SMALL OUTLINE |
SMALL OUTLINE |
Parallel/Serial |
PARALLEL |
PARALLEL |
Peak Reflow Temperature (Celsius) |
260 |
260 |
Certification status |
Not Qualified |
Not Qualified |
Maximum seat height |
1.75 mm |
1.75 mm |
Maximum supply voltage (Vsup) |
5.5 V |
5.5 V |
Minimum supply voltage (Vsup) |
4.5 V |
4.5 V |
Nominal supply voltage (Vsup) |
5 V |
5 V |
surface mount |
YES |
YES |
technology |
CMOS |
CMOS |
Temperature level |
AUTOMOTIVE |
AUTOMOTIVE |
Terminal surface |
NICKEL PALLADIUM GOLD |
NICKEL PALLADIUM GOLD |
Terminal form |
GULL WING |
GULL WING |
Terminal pitch |
1.27 mm |
1.27 mm |
Terminal location |
DUAL |
DUAL |
Maximum time at peak reflow temperature |
30 |
30 |
width |
3.9 mm |
3.9 mm |