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74HCT40105D,112

Description
IC 4X16 FIFO REGISTER 16-SOIC
Categorystorage    storage   
File Size919KB,36 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
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74HCT40105D,112 Overview

IC 4X16 FIFO REGISTER 16-SOIC

74HCT40105D,112 Parametric

Parameter NameAttribute value
Brand NameNXP Semiconductor
Is it Rohs certified?conform to
MakerNXP
Parts packaging codeSOP
package instructionSOP, SOP16,.25
Contacts16
Manufacturer packaging codeSOT109-1
Reach Compliance Codecompliant
Maximum access time120 ns
Other featuresREGISTER BASED; BUBBLE BACK 750NS
Maximum clock frequency (fCLK)31 MHz
period time100 ns
JESD-30 codeR-PDSO-G16
JESD-609 codee4
length9.9 mm
memory density64 bit
Memory IC TypeOTHER FIFO
memory width4
Humidity sensitivity level1
Number of functions1
Number of terminals16
word count16 words
character code16
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
organize16X4
Output characteristics3-STATE
ExportableYES
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Encapsulate equivalent codeSOP16,.25
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)260
power supply5 V
Certification statusNot Qualified
Maximum seat height1.75 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal surfaceNICKEL PALLADIUM GOLD
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperature30
width3.9 mm

74HCT40105D,112 Related Products

74HCT40105D,112 74HCT40105D,118
Description IC 4X16 FIFO REGISTER 16-SOIC IC FIFO REGISTER 4X16 16SOIC
Brand Name NXP Semiconductor NXP Semiconductor
Is it Rohs certified? conform to conform to
Maker NXP NXP
Parts packaging code SOP SOP
package instruction SOP, SOP16,.25 SOP,
Contacts 16 16
Manufacturer packaging code SOT109-1 SOT109-1
Reach Compliance Code compliant compliant
Maximum access time 120 ns 120 ns
Other features REGISTER BASED; BUBBLE BACK 750NS REGISTER BASED; BUBBLE BACK 750NS
period time 100 ns 100 ns
JESD-30 code R-PDSO-G16 R-PDSO-G16
JESD-609 code e4 e4
length 9.9 mm 9.9 mm
memory density 64 bit 64 bit
memory width 4 4
Humidity sensitivity level 1 1
Number of functions 1 1
Number of terminals 16 16
word count 16 words 16 words
character code 16 16
Operating mode ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 125 °C 125 °C
Minimum operating temperature -40 °C -40 °C
organize 16X4 16X4
Output characteristics 3-STATE 3-STATE
Exportable YES YES
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SOP SOP
Package shape RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 260 260
Certification status Not Qualified Not Qualified
Maximum seat height 1.75 mm 1.75 mm
Maximum supply voltage (Vsup) 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V
surface mount YES YES
technology CMOS CMOS
Temperature level AUTOMOTIVE AUTOMOTIVE
Terminal surface NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD
Terminal form GULL WING GULL WING
Terminal pitch 1.27 mm 1.27 mm
Terminal location DUAL DUAL
Maximum time at peak reflow temperature 30 30
width 3.9 mm 3.9 mm
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