DSC400-1311Q0076KE1T datasheet, PDF

Datasheet> All Categories > Passive components> DSC400-1311Q0076KE1T

DSC400-1311Q0076KE1T: DescriptionMEMS CLOCK GENERATOR 4 OUTPUT; CategoryPassive components; File Size1MB，11 Pages; ManufacturerMicrochip; Websitehttps://www.microchip.com

Download Datasheet Parametric Compare View All

DSC400-1311Q0076KE1T Overview

MEMS CLOCK GENERATOR 4 OUTPUT

DSC400-1311Q0076KE1T Parametric

Parameter Name	Attribute value
type	MEMS (silicon)
Frequency - Output 1	24MHz
Frequency - Output 2	25MHz
Frequency - Output 3	200MHz
Frequency - Output 4	150MHz
Function	enable/disable
output	LVCMOS，LVDS
Voltage - Power	2.25 V ~ 3.6 V
frequency stability	±50ppm
Operating temperature	-20°C ~ 70°C
Current - Power (maximum)	44mA
size/dimensions	0.197" long x 0.126" wide (5.00mm x 3.20mm)
high	0.035"（0.90mm）
Package/casing	20-SMD, no leads

DSC400-1311Q0076KE1T Related Products

	DSC400-1311Q0076KE1T	DSC400-1311Q0076KE2T	DSC400-1311Q0076KI1T	DSC400-1311Q0076KI2T	DSC400-1311Q0076KE1	DSC400-1311Q0076KE2	DSC400-1311Q0076KI1	DSC400-1311Q0076KI2
Description	MEMS CLOCK GENERATOR 4 OUTPUT	MEMS CLOCK GENERATOR 4 OUTPUT	MEMS CLOCK GENERATOR 4 OUTPUT	MEMS CLOCK GENERATOR 4 OUTPUT	MEMS CLOCK GENERATOR 4 OUTPUT	MEMS CLOCK GENERATOR 4 OUTPUT	MEMS CLOCK GENERATOR 4 OUTPUT	MEMS CLOCK GENERATOR 4 OUTPUT
type	MEMS (silicon)	MEMS (silicon)	MEMS (silicon)	MEMS (silicon)	MEMS (silicon)	MEMS (silicon)	MEMS (silicon)	MEMS (silicon)
Frequency - Output 1	24MHz	24MHz	24MHz	24MHz	24MHz	24MHz	24MHz	24MHz
Frequency - Output 2	25MHz	25MHz	25MHz	25MHz	25MHz	25MHz	25MHz	25MHz
Frequency - Output 3	200MHz	200MHz	200MHz	200MHz	200MHz	200MHz	200MHz	200MHz
Frequency - Output 4	150MHz	150MHz	150MHz	150MHz	150MHz	150MHz	150MHz	150MHz
Function	enable/disable	enable/disable	enable/disable	enable/disable	enable/disable	enable/disable	enable/disable	enable/disable
output	LVCMOS，LVDS	LVCMOS，LVDS	LVCMOS，LVDS	LVCMOS，LVDS	LVCMOS，LVDS	LVCMOS，LVDS	LVCMOS，LVDS	LVCMOS，LVDS
Voltage - Power	2.25 V ~ 3.6 V	2.25 V ~ 3.6 V	2.25 V ~ 3.6 V	2.25 V ~ 3.6 V	2.25 V ~ 3.6 V	2.25 V ~ 3.6 V	2.25 V ~ 3.6 V	2.25 V ~ 3.6 V
frequency stability	±50ppm	±25ppm	±50ppm	±25ppm	±50ppm	±25ppm	±50ppm	±25ppm
Operating temperature	-20°C ~ 70°C	-20°C ~ 70°C	-40°C ~ 85°C	-40°C ~ 85°C	-20°C ~ 70°C	-20°C ~ 70°C	-40°C ~ 85°C	-40°C ~ 85°C
Current - Power (maximum)	44mA	44mA	44mA	44mA	44mA	44mA	44mA	44mA
size/dimensions	0.197" long x 0.126" wide (5.00mm x 3.20mm)	0.197" long x 0.126" wide (5.00mm x 3.20mm)	0.197" long x 0.126" wide (5.00mm x 3.20mm)	0.197" long x 0.126" wide (5.00mm x 3.20mm)	0.197" long x 0.126" wide (5.00mm x 3.20mm)	0.197" long x 0.126" wide (5.00mm x 3.20mm)	0.197" long x 0.126" wide (5.00mm x 3.20mm)	0.197" long x 0.126" wide (5.00mm x 3.20mm)
high	0.035"（0.90mm）	0.035"（0.90mm）	0.035"（0.90mm）	0.035"（0.90mm）	0.035"（0.90mm）	0.035"（0.90mm）	0.035"（0.90mm）	0.035"（0.90mm）
Package/casing	20-SMD, no leads	20-SMD, no leads	20-SMD, no leads	20-SMD, no leads	20-SMD, no leads	20-SMD, no leads	20-SMD, no leads	20-SMD, no leads

Recommended Resources

6 data infrared signal transmitter (PT2262)

Production of high-quality active two-way constant current power amplifier 02

Light control timing column light circuit

TU-102 urine analyzer reagent belt position detection circuit

Car battery charger circuit diagram

Small circuit breaker starts the circuit directly

The CC2530 low-power terminal keeps reconnecting to the network and consumes power: Test the low power mode of its ZIGBEE protocol stack. TI has indeed spent a lot of effort on this protocol stack and the operating system OSAL that supports it. It is very easy to use. After making a ...; fish001 Wireless Connectivity

Crazy Shell AI open source drone OPENMV script burning: OPENMV scriptwritingThe burning of OPENMV script is relatively simple, mainly relying on the previously installed OPENMV IDE. The specific steps are as follows:Open the openmv die, as shown below.Open...; fengke Test/Measurement

For C5000, how to boot a program larger than 48K?: For C5000, the on-chip BOOT program moves the contents of the data area to the RAM in the program area after power-on, so the FLASH must be placed in the data area after RESET. Since the space in the ...; fish001 DSP and ARM Processors

Qorvo's technical highlights on WiFi 6: Qorvo's Wireless Connectivity Business Unit Director provides practical advice on how to design applications for Wi-Fi 6 and unlock the full potential of the new standard. Q As Wi-Fi 6 becomes more co...; qwqwqw2088 RF/Wirelessly

CMSIS-DAP compatible debugger [Vllink Lite]: [i=s]This post was last edited by le062 on 2018-11-5 05:52[/i] [size=5][b]Written in the front[/b][/size] According to my previous tests, the continuous read and write speeds of ST-Link V2 and Jlink V...; le062 GD32 MCU

Introduction to the mobile station development board: STM32G071 NUCLEO-64: This week, we recommend a development board for the rover: STM32G071 NUCLEO-64 (development board number: 39). This development board is now in the rover, waiting for EE netizens to take it away for e...; 高进 Embedded System

Shortcut: 00 01 02 03 04 05 06 07 08 09 0A 0C 0F 0J 0L 0M 0R 0S 0T 0Z 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F 1H 1K 1M 1N 1P 1S 1T 1V 1X 1Z 20 21 22 23 24 25 26 27 28 29 2A 2B 2C 2D 2E 2F 2G 2K 2M 2N 2P 2Q 2R 2S 2T 2W 2Z 30 31 32 33 34 35 36 37 38 39 3A 3B 3C 3D 3E 3F 3G 3H 3J 3K 3L 3M 3N 3P 3R 3S 3T 3V 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4M 4N 4P 4S 4T 50 51 52 53 54 55 56 57 58 59 5A 5B 5C 5E 5G 5H 5K 5M 5N 5P 5S 5T 5V 60 61 62 63 64 65 66 67 68 69 6A 6C 6E 6F 6M 6N 6P 6R 6S 6T 70 71 72 73 74 75 76 77 78 79 7A 7B 7C 7M 7N 7P 7Q 7V 7W 7X 80 81 82 83 84 85 86 87 88 89 8A 8D 8E 8L 8N 8P 8S 8T 8W 8Y 8Z 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9F 9G 9H 9L 9S 9T 9W

Popular Components