IC,1:5 OUTPUT, DIFFERENTIAL,CMOS,QFP,32PIN,PLASTIC
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | NXP |
Parts packaging code | QFP |
package instruction | PLASTIC, LQFP-32 |
Contacts | 32 |
Reach Compliance Code | not_compliant |
Is Samacsys | N |
series | 9993 |
Input adjustment | DIFFERENTIAL MUX |
JESD-30 code | S-PQFP-G32 |
JESD-609 code | e0 |
length | 7 mm |
Logic integrated circuit type | PLL BASED CLOCK DRIVER |
MaximumI(ol) | 0.024 A |
Humidity sensitivity level | 2 |
Number of functions | 1 |
Number of inverted outputs | |
Number of terminals | 32 |
Actual output times | 5 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
Package body material | PLASTIC/EPOXY |
encapsulated code | LQFP |
Encapsulate equivalent code | QFP32,.35SQ,32 |
Package shape | SQUARE |
Package form | FLATPACK, LOW PROFILE |
Peak Reflow Temperature (Celsius) | 220 |
power supply | 3.3 V |
Prop。Delay @ Nom-Sup | 2 ns |
propagation delay (tpd) | 1.8 ns |
Certification status | Not Qualified |
Same Edge Skew-Max(tskwd) | 0.08 ns |
Maximum seat height | 1.6 mm |
Maximum supply voltage (Vsup) | 3.465 V |
Minimum supply voltage (Vsup) | 3.135 V |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | GULL WING |
Terminal pitch | 0.8 mm |
Terminal location | QUAD |
Maximum time at peak reflow temperature | 30 |
width | 7 mm |
minfmax | 100 MHz |
Base Number Matches | 1 |
MPC9993FAR2 | |
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Description | IC,1:5 OUTPUT, DIFFERENTIAL,CMOS,QFP,32PIN,PLASTIC |
Is it Rohs certified? | incompatible |
Maker | NXP |
Parts packaging code | QFP |
package instruction | PLASTIC, LQFP-32 |
Contacts | 32 |
Reach Compliance Code | not_compliant |
Is Samacsys | N |
series | 9993 |
Input adjustment | DIFFERENTIAL MUX |
JESD-30 code | S-PQFP-G32 |
JESD-609 code | e0 |
length | 7 mm |
Logic integrated circuit type | PLL BASED CLOCK DRIVER |
MaximumI(ol) | 0.024 A |
Humidity sensitivity level | 2 |
Number of functions | 1 |
Number of terminals | 32 |
Actual output times | 5 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
Package body material | PLASTIC/EPOXY |
encapsulated code | LQFP |
Encapsulate equivalent code | QFP32,.35SQ,32 |
Package shape | SQUARE |
Package form | FLATPACK, LOW PROFILE |
Peak Reflow Temperature (Celsius) | 220 |
power supply | 3.3 V |
Prop。Delay @ Nom-Sup | 2 ns |
propagation delay (tpd) | 1.8 ns |
Certification status | Not Qualified |
Same Edge Skew-Max(tskwd) | 0.08 ns |
Maximum seat height | 1.6 mm |
Maximum supply voltage (Vsup) | 3.465 V |
Minimum supply voltage (Vsup) | 3.135 V |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | GULL WING |
Terminal pitch | 0.8 mm |
Terminal location | QUAD |
Maximum time at peak reflow temperature | 30 |
width | 7 mm |
minfmax | 100 MHz |
Base Number Matches | 1 |