AM29DL640D50EI datasheet, PDF - EEWORLD Datasheet

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AM29DL640D50EI: Description64 Megabit (8 M x 8-Bit/4 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Read/Write Flash Memory; File Size646KB，54 Pages; ManufacturerAMD; Websitehttp://www.amd.com

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AM29DL640D50EI Overview

64 Megabit (8 M x 8-Bit/4 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Read/Write Flash Memory

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Am29DL640D

Data Sheet

This product has been retired and is not available for designs.

For new and current designs involving TSOP packages, S29JL064H supersedes Am29DL640D and is the factory-

recommended migration path. Please refer to the S29JL064H datasheet for specifications and ordering informa-

tion.

For new and current designs involving Fine-pitch BGA (FBGA) packages, S29PL064J supersedes Am29DL640D

and is the factory-recommended migration path. Please refer to the S29PL064J Datasheet for specifications and

ordering information.

Availability of this document is retained for reference and historical purposes only.

July 2003

The following document specifies Spansion memory products that are now offered by both Advanced

Micro Devices and Fujitsu. Although the document is marked with the name of the company that

originally developed the specification, these products will be offered to customers of both AMD and

Fujitsu.

Continuity of Specifications

There is no change to this datasheet as a result of offering the device as a Spansion product. Any

changes that have been made are the result of normal datasheet improvement and are noted in the

document revision summary, where supported. Future routine revisions will occur when appropri-

ate, and changes will be noted in a revision summary.

Continuity of Ordering Part Numbers

AMD and Fujitsu continue to support existing part numbers beginning with "Am" and "MBM". To

order these products, please use only the Ordering Part Numbers listed in this document.

For More Information

Please contact your local AMD or Fujitsu sales office for additional information about Spansion mem-

ory solutions.

Publication Number

23695

Revision

Amendment

Issue Date

December 13, 2005

TABLE OF CONTENTS

Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 5

Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . . 6

Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 8

Device Bus Operations . . . . . . . . . . . . . . . . . . . . . . 9

Table 1. Am29DL640D Device Bus Operations ................................9

Write Operation Status . . . . . . . . . . . . . . . . . . . . 29

DQ7: Data# Polling ................................................................. 29

Figure 6. Data# Polling Algorithm .................................................. 29

RY/BY#: Ready/Busy# ......................................... 30

DQ6: Toggle Bit I .................................................................... 30

Figure 7. Toggle Bit Algorithm........................................................ 30

Word/Byte Configuration ........................................ 9

Requirements for Reading Array Data ..................................... 9

Writing Commands/Command Sequences ............................ 10

Accelerated Program Operation ............................................. 10

Autoselect Functions .............................................................. 10

Simultaneous Read/Write Operations with Zero Latency ....... 10

Standby Mode ...................................................... 10

Automatic Sleep Mode ........................................................... 11

RESET#: Hardware Reset Pin ............................................... 11

Output Disable Mode .............................................................. 11

Table 2. Am29DL640D Sector Architecture ....................................11

Table 3. Bank Address ....................................................................14

Secured Silicon Sector Addresses............................. 14

DQ2: Toggle Bit II ................................................................... 31

Reading Toggle Bits DQ6/DQ2 ............................................... 31

DQ5: Exceeded Timing Limits ................................................ 31

DQ3: Sector Erase Timer ....................................................... 31

Table 13. Write Operation Status ................................................... 32

Absolute Maximum Ratings . . . . . . . . . . . . . . . . 33

Figure 8. Maximum Negative Overshoot Waveform ...................... 33

Figure 9. Maximum Positive Overshoot Waveform........................ 33

Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . 33

DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 34

Figure 10. I

CC1

Current vs. Time (Showing Active and

Automatic Sleep Currents) ............................................................. 35

Figure 11. Typical I

CC1

vs. Frequency ............................................ 35

Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . 36

Figure 12. Test Setup.................................................................... 36

Autoselect Mode ................................................... 14

Table 5. Am29DL640D Autoselect Codes, (High Voltage Method) 15

KEY TO SWITCHING WAVEFORMS . . . . . . . . . . 36

Figure 13. Input Waveforms and Measurement Levels ................. 36

Sector/Sector Block Protection and Unprotection 16

Table 6. Am29DL640D Boot Sector/Sector Block Addresses for Pro-

tection/Unprotection ........................................................................16

AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 37

Read-Only Operations ........................................................... 37

Figure 14. Read Operation Timings ............................................... 37

Write Protect (WP#) ................................................................ 17

Table 7. WP#/ACC Modes ..............................................................17

Hardware Reset (RESET#) .................................................... 38

Figure 15. Reset Timings ............................................................... 38

Temporary Sector Unprotect .................................................. 17

Figure 1. Temporary Sector Unprotect Operation........................... 17

Figure 2. In-System Sector Protect/Unprotect Algorithms .............. 18

Word/Byte Configuration (BYTE#) .......................................... 39

Figure 16. BYTE# Timings for Read Operations............................ 39

Figure 17. BYTE# Timings for Write Operations............................ 39

Secured Silicon Sector

Flash Memory Region ............................................................ 19

Figure 3. Secured Silicon Sector Protect Verify .............................. 20

Erase and Program Operations .............................................. 40

Figure 18. Program Operation Timings..........................................

Figure 19. Accelerated Program Timing Diagram..........................

Figure 20. Chip/Sector Erase Operation Timings ..........................

Figure 21. Back-to-back Read/Write Cycle Timings ......................

Figure 22. Data# Polling Timings (During Embedded Algorithms).

Figure 23. Toggle Bit Timings (During Embedded Algorithms)......

Figure 24. DQ2 vs. DQ6.................................................................

Hardware Data Protection ...................................................... 20

Low VCC Write Inhibit ............................................................ 20

Write Pulse “Glitch” Protection ............................................... 20

Logical Inhibit .......................................................................... 20

Power-Up Write Inhibit ............................................................ 20

Common Flash Memory Interface (CFI) . . . . . . . 20

Table 8. CFI Query Identification String ......................

System Interface String...............................................

Table 10. Device Geometry Definition ........................

Table 11. Primary Vendor-Specific Extended Query ..

Temporary Sector Unprotect .................................................. 45

Figure 25. Temporary Sector Unprotect Timing Diagram .............. 45

Figure 26. Sector/Sector Block Protect and

Unprotect Timing Diagram ............................................................. 46

Command Definitions . . . . . . . . . . . . . . . . . . . . . . 24

Reading Array Data ................................................................ 24

Reset Command ..................................................................... 24

Autoselect Command Sequence ............................................ 24

Enter/Exit Secured Silicon Sector

Command Sequence .............................................................. 24

Byte/Word Program Command Sequence ............................. 25

Unlock Bypass Command Sequence ..................................... 25

Figure 4. Program Operation .......................................................... 26

Alternate CE# Controlled Erase and Program Operations ..... 47

Figure 27. Alternate CE# Controlled Write (Erase/Program)

Operation Timings.......................................................................... 48

Chip Erase Command Sequence ........................................... 26

Sector Erase Command Sequence ........................................ 26

Erase Suspend/Erase Resume Commands ........................... 27

Figure 5. Erase Operation............................................................... 27

Table 12. Am29DL640D Command Definitions .......... 28

Erase And Programming Performance . . . . . . . 49

Latchup Characteristics . . . . . . . . . . . . . . . . . . . . 49

TSOP Pin Capacitance . . . . . . . . . . . . . . . . . . . . . 49

Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . 49

Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 50

FBE063—63-Ball Fine-Pitch Ball Grid Array (FBGA)

12 x 11 mm package .............................................................. 50

TS 048—48-Pin Standard TSOP ............................................ 51

Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 52

December 13, 2005

Am29DL640D

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