IC HC/UH SERIES, QUAD 2-INPUT XNOR GATE, CDFP14, CERAMIC, FP-14, Gate
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | Texas Instruments |
Parts packaging code | DFP |
package instruction | DFP, FL14,.3 |
Contacts | 14 |
Reach Compliance Code | unknown |
Is Samacsys | N |
series | HC/UH |
JESD-30 code | R-GDFP-F14 |
JESD-609 code | e0 |
length | 9.614 mm |
Load capacitance (CL) | 50 pF |
Logic integrated circuit type | XNOR GATE |
Number of functions | 4 |
Number of entries | 2 |
Number of terminals | 14 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
Package body material | CERAMIC, GLASS-SEALED |
encapsulated code | DFP |
Encapsulate equivalent code | FL14,.3 |
Package shape | RECTANGULAR |
Package form | FLATPACK |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 2/6 V |
propagation delay (tpd) | 36 ns |
Certification status | Not Qualified |
Schmitt trigger | NO |
Maximum seat height | 2.032 mm |
Maximum supply voltage (Vsup) | 6 V |
Minimum supply voltage (Vsup) | 2 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | FLAT |
Terminal pitch | 1.27 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 6.35 mm |
Base Number Matches | 1 |
MM54HC7266W | MM54HC7266E | MM74HC7266M | MM74HC7266MX | |
---|---|---|---|---|
Description | IC HC/UH SERIES, QUAD 2-INPUT XNOR GATE, CDFP14, CERAMIC, FP-14, Gate | HC/UH SERIES, QUAD 2-INPUT XNOR GATE, CQCC20, CERAMIC, LCC-20 | HC/UH SERIES, QUAD 2-INPUT XNOR GATE, PDSO14, PLASTIC, SO-14 | HC/UH SERIES, QUAD 2-INPUT XNOR GATE, PDSO14, PLASTIC, SO-14 |
Maker | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
Parts packaging code | DFP | QLCC | SOIC | SOIC |
package instruction | DFP, FL14,.3 | QCCN, LCC20,.35SQ | SOP, SOP14,.25 | SOP, |
Contacts | 14 | 20 | 14 | 14 |
Reach Compliance Code | unknown | unknown | unknown | unknown |
series | HC/UH | HC/UH | HC/UH | HC/UH |
JESD-30 code | R-GDFP-F14 | S-CQCC-N20 | R-PDSO-G14 | R-PDSO-G14 |
length | 9.614 mm | 8.89 mm | 8.65 mm | 8.65 mm |
Load capacitance (CL) | 50 pF | 50 pF | 50 pF | 50 pF |
Logic integrated circuit type | XNOR GATE | XNOR GATE | XNOR GATE | XNOR GATE |
Number of functions | 4 | 4 | 4 | 4 |
Number of entries | 2 | 2 | 2 | 2 |
Number of terminals | 14 | 20 | 14 | 14 |
Maximum operating temperature | 125 °C | 125 °C | 85 °C | 85 °C |
Minimum operating temperature | -55 °C | -55 °C | -40 °C | -40 °C |
Package body material | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | DFP | QCCN | SOP | SOP |
Package shape | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR |
Package form | FLATPACK | CHIP CARRIER | SMALL OUTLINE | SMALL OUTLINE |
propagation delay (tpd) | 36 ns | 36 ns | 30 ns | 30 ns |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 2.032 mm | 1.905 mm | 1.75 mm | 1.75 mm |
Maximum supply voltage (Vsup) | 6 V | 6 V | 6 V | 6 V |
Minimum supply voltage (Vsup) | 2 V | 2 V | 2 V | 2 V |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V |
surface mount | YES | YES | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS |
Temperature level | MILITARY | MILITARY | INDUSTRIAL | INDUSTRIAL |
Terminal form | FLAT | NO LEAD | GULL WING | GULL WING |
Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
Terminal location | DUAL | QUAD | DUAL | DUAL |
width | 6.35 mm | 8.89 mm | 3.9 mm | 3.9 mm |
Is it lead-free? | Contains lead | Contains lead | Contains lead | - |
Is it Rohs certified? | incompatible | incompatible | incompatible | - |
JESD-609 code | e0 | e0 | e0 | - |
Encapsulate equivalent code | FL14,.3 | LCC20,.35SQ | SOP14,.25 | - |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
power supply | 2/6 V | 2/6 V | 2/6 V | - |
Schmitt trigger | NO | NO | NO | - |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |