Analog Waveform Generation Function, CMOS, CDIP24,
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Tundra Semiconductor Corp |
Reach Compliance Code | unknown |
Is Samacsys | N |
JESD-30 code | R-XDIP-T24 |
JESD-609 code | e0 |
Number of terminals | 24 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
Package body material | CERAMIC |
encapsulated code | DIP |
Encapsulate equivalent code | DIP24,.6 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
power supply | 5 V |
Certification status | Not Qualified |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Base Number Matches | 1 |
CA82C54-10CD | CA82C54-8ID | CA82C54-10ED | CA82C54-10ID | CA82C54-8CD | CA82C54-8ED | |
---|---|---|---|---|---|---|
Description | Analog Waveform Generation Function, CMOS, CDIP24, | Analog Waveform Generation Function, CMOS, CDIP24, | Analog Waveform Generation Function, CMOS, CDIP24, | Analog Waveform Generation Function, CMOS, CDIP24, | Analog Waveform Generation Function, CMOS, CDIP24, | Analog Waveform Generation Function, CMOS, CDIP24, |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
Maker | Tundra Semiconductor Corp | Tundra Semiconductor Corp | Tundra Semiconductor Corp | Tundra Semiconductor Corp | Tundra Semiconductor Corp | Tundra Semiconductor Corp |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
JESD-30 code | R-XDIP-T24 | R-XDIP-T24 | R-XDIP-T24 | R-XDIP-T24 | R-XDIP-T24 | R-XDIP-T24 |
JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
Number of terminals | 24 | 24 | 24 | 24 | 24 | 24 |
Maximum operating temperature | 70 °C | 85 °C | 125 °C | 85 °C | 70 °C | 125 °C |
Minimum operating temperature | - | -40 °C | -55 °C | -40 °C | - | -55 °C |
Package body material | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
encapsulated code | DIP | DIP | DIP | DIP | DIP | DIP |
Encapsulate equivalent code | DIP24,.6 | DIP24,.6 | DIP24,.6 | DIP24,.6 | DIP24,.6 | DIP24,.6 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | NO | NO | NO | NO | NO | NO |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | INDUSTRIAL | MILITARY | INDUSTRIAL | COMMERCIAL | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
Is Samacsys | N | - | N | N | N | N |