AM50DL9608GB75IS datasheet, PDF

AM50DL9608GB75IS: Description64 Megabit (4 M x 16-Bit) and 32 Megabit (2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memories, and 8 Mbit; Categorystorage storage; File Size471KB，70 Pages; ManufacturerSPANSION; Websitehttp://www.spansion.com/

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AM50DL9608GB75IS Overview

64 Megabit (4 M x 16-Bit) and 32 Megabit (2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memories, and 8 Mbit

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	SPANSION
Parts packaging code	BGA
package instruction	8 X 11.60 MM, FBGA-73
Contacts	73
Reach Compliance Code	_compli
Maximum access time	75 ns
Other features	PSEUDO SRAM IS ORGANISED AS 512K X 16; CONTAINS ADDITIONAL 2M X 16 FLASH
JESD-30 code	R-PBGA-B73
JESD-609 code	e0
length	11.6 mm
memory density	67108864 bi
Memory IC Type	MEMORY CIRCUIT
memory width	16
Mixed memory types	FLASH+PSRAM
Humidity sensitivity level	3
Number of functions	1
Number of terminals	73
word count	4194304 words
character code	4000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	4MX16
Package body material	PLASTIC/EPOXY
encapsulated code	LFBGA
Encapsulate equivalent code	BGA73,10X12,32
Package shape	RECTANGULAR
Package form	GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	240
power supply	3 V
Certification status	Not Qualified
Maximum seat height	1.4 mm
Maximum standby current	0.00006 A
Maximum slew rate	0.03 mA
Maximum supply voltage (Vsup)	3.3 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	30
width	8 mm
Base Number Matches	1

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