PLCC-68, Tube
| Parameter Name | Attribute value |
| Brand Name | Integrated Device Technology |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | IDT (Integrated Device Technology) |
| Parts packaging code | PLCC |
| package instruction | 0.950 X 0.950 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-68 |
| Contacts | 68 |
| Manufacturer packaging code | PL68 |
| Reach Compliance Code | not_compliant |
| ECCN code | EAR99 |
| Maximum access time | 25 ns |
| Other features | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN |
| I/O type | COMMON |
| JESD-30 code | S-PQCC-J68 |
| JESD-609 code | e0 |
| length | 24.2062 mm |
| memory density | 262144 bit |
| Memory IC Type | DUAL-PORT SRAM |
| memory width | 8 |
| Humidity sensitivity level | 1 |
| Number of functions | 1 |
| Number of ports | 2 |
| Number of terminals | 68 |
| word count | 32768 words |
| character code | 32000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 32KX8 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | QCCJ |
| Encapsulate equivalent code | LDCC68,1.0SQ |
| Package shape | SQUARE |
| Package form | CHIP CARRIER |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | 225 |
| power supply | 3.3 V |
| Certification status | Not Qualified |
| Maximum seat height | 4.572 mm |
| Maximum standby current | 0.006 A |
| Minimum standby current | 3 V |
| Maximum slew rate | 0.17 mA |
| Maximum supply voltage (Vsup) | 3.6 V |
| Minimum supply voltage (Vsup) | 3 V |
| Nominal supply voltage (Vsup) | 3.3 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn85Pb15) |
| Terminal form | J BEND |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 24.2062 mm |
| Base Number Matches | 1 |
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