|
74LV03PWDH |
74LV03PWDH-T |
74LV03PW |
74LV03DB |
74LV03DB-T |
74LV03PW-T |
Description |
IC LV/LV-A/LVX/H SERIES, QUAD 2-INPUT NAND GATE, PDSO14, Gate |
IC LV/LV-A/LVX/H SERIES, QUAD 2-INPUT NAND GATE, PDSO14, Gate |
IC LV/LV-A/LVX/H SERIES, QUAD 2-INPUT NAND GATE, PDSO14, Gate |
IC LV/LV-A/LVX/H SERIES, QUAD 2-INPUT NAND GATE, PDSO14, Gate |
IC LV/LV-A/LVX/H SERIES, QUAD 2-INPUT NAND GATE, PDSO14, Gate |
IC LV/LV-A/LVX/H SERIES, QUAD 2-INPUT NAND GATE, PDSO14, PLASTIC, TSSOP1-14, Gate |
Maker |
NXP |
NXP |
NXP |
NXP |
NXP |
NXP |
package instruction |
TSSOP, |
TSSOP, |
TSSOP, |
SSOP, |
SSOP, |
TSSOP, |
Reach Compliance Code |
unknown |
unknown |
unknown |
unknown |
unknown |
unknown |
series |
LV/LV-A/LVX/H |
LV/LV-A/LVX/H |
LV/LV-A/LVX/H |
LV/LV-A/LVX/H |
LV/LV-A/LVX/H |
LV/LV-A/LVX/H |
JESD-30 code |
R-PDSO-G14 |
R-PDSO-G14 |
R-PDSO-G14 |
R-PDSO-G14 |
R-PDSO-G14 |
R-PDSO-G14 |
length |
5 mm |
5 mm |
5 mm |
6.2 mm |
6.2 mm |
5 mm |
Load capacitance (CL) |
50 pF |
50 pF |
50 pF |
50 pF |
50 pF |
50 pF |
Logic integrated circuit type |
NAND GATE |
NAND GATE |
NAND GATE |
NAND GATE |
NAND GATE |
NAND GATE |
Number of functions |
4 |
4 |
4 |
4 |
4 |
4 |
Number of entries |
2 |
2 |
2 |
2 |
2 |
2 |
Number of terminals |
14 |
14 |
14 |
14 |
14 |
14 |
Maximum operating temperature |
125 °C |
125 °C |
125 °C |
125 °C |
125 °C |
125 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
Output characteristics |
OPEN-DRAIN |
OPEN-DRAIN |
OPEN-DRAIN |
OPEN-DRAIN |
OPEN-DRAIN |
OPEN-DRAIN |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
TSSOP |
TSSOP |
TSSOP |
SSOP |
SSOP |
TSSOP |
Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package form |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, SHRINK PITCH |
SMALL OUTLINE, SHRINK PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
propagation delay (tpd) |
31 ns |
31 ns |
31 ns |
31 ns |
31 ns |
31 ns |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Maximum seat height |
1.1 mm |
1.1 mm |
1.1 mm |
2 mm |
2 mm |
1.1 mm |
Maximum supply voltage (Vsup) |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
Minimum supply voltage (Vsup) |
1 V |
1 V |
1 V |
1 V |
1 V |
1 V |
Nominal supply voltage (Vsup) |
3.3 V |
3.3 V |
3.3 V |
3.3 V |
3.3 V |
3.3 V |
surface mount |
YES |
YES |
YES |
YES |
YES |
YES |
technology |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
Temperature level |
AUTOMOTIVE |
AUTOMOTIVE |
AUTOMOTIVE |
AUTOMOTIVE |
AUTOMOTIVE |
AUTOMOTIVE |
Terminal form |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
Terminal pitch |
0.65 mm |
0.65 mm |
0.65 mm |
0.65 mm |
0.65 mm |
0.65 mm |
Terminal location |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
width |
4.4 mm |
4.4 mm |
4.4 mm |
5.3 mm |
5.3 mm |
4.4 mm |
Base Number Matches |
1 |
1 |
1 |
1 |
1 |
1 |