This specification defines the performance, test, quality and reliability requirements of ExpressCard
connectors.
2. SCOPE
This specification provides information regarding product features and materials for ExpressCard
connectors. All products shall meet ExpressCard Standard, PCMCIA /JEITA.
3. GENERAL
This document is composed of the following sections:
Paragraph
Title
1.0
OBJECTIVE
2.0
SCOPE
3.0
GENERAL
4.0
APPLICABLE DOCUMENTS
4.1
STANDARD AND SPECIFICATIONS
5.0
REQUIREMENTS
5.1
MATERIAL
5.2
FINISH
6.0
CONNECTOR REQUIREMENTS
6.1
EXAMINATION OF PRODUCT
6.2
MATING / UNMATING FORCE
6.3
SOLIDERABILITY
6.4
ELECTRICAL REQUIREMENTS
6.5
DURABILITY TEST REQIREMENTS
7.0
TEST SEQUENCE
8.0
RECOMMENDED TEMPERATURE PROFILE
9.0
NOTE
4. APPLICATION DOCUMENTS
4.1 Standards and Specifications
4.1.1 EIA-364-1000.01, Electrical / Socket Test Procedures Including Environmental Classifications
4.1.2 ExpressCard Standard
4.1.3 FCI product drawings
5. REQUIREMENT
5.1 Material
5.1.1 Terminal
5.1.2 Housing
drawing.
The terminal material shall be copper alloy and specified in the product drawing.
The housing material shall be rated UL94V-0 and shall be specified in the product
5.2 Finish
The finish for applicable components shall be specified in product drawings with plating area, plating
material and plating thickness.
6. CONNECTOR REQUIREMENTS
6.1 Examination of Product
Samples must comply to applicable FCI product prints.
6.2 Mating / Unmating force
This document is the property of and embodies CONFIDENTIAL and PROPRIETARY information of FCI Electronics. No part of the information shown on this document may be used in
any way without the written consent of FCI Electronics.
Form E-3005
Rev A 02/12/01
V20603
GS-01-001
PDM: Rev:B
STATUS:
Released
Printed: Nov 28, 2010
.
TYPE
NUMBER
PRODUCT SPECIFICATION
TITLE
PAGE
GS-12-285
REVISION
2 of 7
EXPRESSCARD CONNECTOR PRODUCT SPECIFICATION
AUTHORIZED BY
DATE
A
11/05/’03
KENNY TAI
CLASSIFICATION
UNRESTRICTED
Table 6-1 Mating / Unmating force
Procedure
Test Description
Requirements
Insertion Force
EIA 364-13
Measure the force to mate the dummy card for
module side and, with guiding plates and
39N maximum.
mechanism assemblies in host side at a
maximum rate of 12.5 mm (0.492 inches) per
minute.
EIA 364-13
Measure the force to un-mate the dummy card
for module side and, with guiding plates and
3.7N min.; 18.5N
mechanism assemblies in host side at a
max.
maximum rate of 12.5 mm (0.492 inches) per
minute.
Removal Force
6.3 Solderability: Per EIA-364-638
Steam age for 1 hour. Contact areas evaluated shall meet 95% minimum coverage.
6.4 Electrical Requirements
Unless otherwise specified, all test and measurements shall be made at:
Temperature
25°C +/- 5°C
Relative humidity
50% Max
Table 6-2 lists ExpressCard connector electrical test procedure and requirements.
This document is the property of and embodies CONFIDENTIAL and PROPRIETARY information of FCI Electronics. No part of the information shown on this document may be used in
any way without the written consent of FCI Electronics.
Form E-3005
Rev A 02/12/01
V20603
GS-01-001
PDM: Rev:B
STATUS:
Released
Printed: Nov 28, 2010
.
TYPE
NUMBER
PRODUCT SPECIFICATION
TITLE
PAGE
GS-12-285
REVISION
3 of 7
EXPRESSCARD CONNECTOR PRODUCT SPECIFICATION
AUTHORIZED BY
DATE
A
11/05/’03
KENNY TAI
CLASSIFICATION
UNRESTRICTED
EIA 364-70, method 2
1.The samples size is minimum of
three mated connectors.
2.The samples shall be soldered on a
PCB board with the appropriate
footprint.
3.Wire all the voltage pins and all the
ground pins in a series circuit.
4.A thermocouple of 30 AWG or less
shall be placed toas close to the
mating contact as possible.
5.Conduct a temperature rise vs.
current test.
EIA 364-101
EIA 364-108
EIA 364-90
6-4-4
Current rating
0.75 A per pin minimum.
The temperature rise above
ambient shall not exceed 30
°C.
The ambient condition is still
air at 25 °C.
6-4-5
6-4-6
6-4-7
6-4-8
Insertion loss (IL)
Return loss (RL)
Crosstalk: NEXT
Intra-pair skew
1.7dB max up to 3.125 GHz,
≦-5.5
dB up to 6 GHz
≤-10
dB up to 3.125 GHz,
≤-5
dB up to 6 GHz
-32 dB max up to 3.125 GHz,
≤-26
dB at 6 GHz
5 ps max
6-4-9
6-4-10
Intra-pair skew must be achieved by
design; measurement not required.
Cycle the connector or socket
between 15
°C ±
3
°C
and 85
°C ±3 °
C, as measured on the part.
Ramps should be a minimum of 2
°C
per minute, and dwell times
Thermal Shock
should insure that the contacts reach
the temperature extremes (a
minimum of 5 minutes). Humidity
is not controlled. Perform 10 such
cycles.
EIA-364-31 (Cycle the connector or
socket between 25
°C ±
3
°C
at
80 %
±
3% RH and 65
°C ±
3
°C
at 50
%
±
3% RH. Ramp times should be
Cyclic Temp & Humidity 0.5 hour and dwell times should be
1.0 hour. Dwell times start when the
temperature and humidity have
stabilized within the specified
levels. Perform 24 such cycles.)
Temperature Life (pre-
conditioning)
EIA 364-17, Method A, mated
105 °C for 120 hours
No evidence of physical
damage.
None.
6-4-11
6-4-12 Temperature Life
EIA-364-17, Method A, mated
105 °C for 72 hours
No evidence of physical
damage.
Meet Contact Resistance
(LLCR) requirement.
No evidence of physical
damage.Meet Contact
Resistance (LLCR)
requirement.
This document is the property of and embodies CONFIDENTIAL and PROPRIETARY information of FCI Electronics. No part of the information shown on this document may be used in
any way without the written consent of FCI Electronics.
Form E-3005
Rev A 02/12/01
V20603
GS-01-001
PDM: Rev:B
STATUS:
Released
Printed: Nov 28, 2010
.
TYPE
NUMBER
PRODUCT SPECIFICATION
TITLE
PAGE
GS-12-285
REVISION
4 of 7
EXPRESSCARD CONNECTOR PRODUCT SPECIFICATION
AUTHORIZED BY
DATE
A
11/05/’03
KENNY TAI
CLASSIFICATION
UNRESTRICTED
EIA-364-28, test condition VII, test
condition letter D (15 minutes in
each of 3 mutually perpendicular
directions. Both mating halves
should be rigidly fixed so as not to
contribute to the relative motion of
one contact against another. The
method of fixturing should be
detailed in the test report.)
EIA-364-27
Acceleration 490 m/s2 (50G)
Duration 11ms
Semi-sine wave, velocity change:
3.44 m/s (11.3 ft/s)
EIA-364-09, 50 cycles
EIA-364-09 (see 6.5)
EIA-364-65, class IIA, 7 days, For 2
piese connectors, option 2
Manually mate / unmate the
connectors, 3 cycles.
6-4-13 Vibration
No evidence of physical
damage.
6-4-14 Shock
No evidence of physical
damage.
No evidence of physical
damage.
No evidence of physical
damage.
Meet Contact Resistance
(LLCR) requirement.
no evidence of physical
damage.
6-4-15
Durability (pre-
conditioning)
6-4-16 Durability
6-4-17 Mixed Flowing Gas
6-4-18 Reseating
6.5 Durability Test Requirements
‧
Durability (mating/un-mating) rating of 5000 cycles for the host
‧
Durability (mating/un-mating) rating of 5000 cycles for the module, with an optional rating of 10000
cycles for high-durability modules at module manufacturers' discretion
When testing a higher durability module connector (rated for 10000 cycles), the durability test
procedure for Test Group 7 in EIA 364-1000.01 shall be modified to reflect the requirement of different
durability cycles for the host and module connectors. After 5000 cycles, the LLCR shall be measured.
Starting from the 5001-th cycle, a new host connector shall be used to mate with the high-durability
module connector.
7. TEST SEQUENCE
This document is the property of and embodies CONFIDENTIAL and PROPRIETARY information of FCI Electronics. No part of the information shown on this document may be used in
any way without the written consent of FCI Electronics.
Form E-3005
Rev A 02/12/01
V20603
GS-01-001
PDM: Rev:B
STATUS:
Released
Printed: Nov 28, 2010
.
TYPE
NUMBER
PRODUCT SPECIFICATION
TITLE
PAGE
GS-12-285
REVISION
5 of 7
EXPRESSCARD CONNECTOR PRODUCT SPECIFICATION
AUTHORIZED BY
DATE
A
11/05/’03
KENNY TAI
CLASSIFICATION
UNRESTRICTED
TABLE 7-1 Qualification Testing Matrix
TEST TEST TEST TEST TEST TEST TEST TEST
GROUP GROUP GROUP GROUP GROUP GROUP GROUP GROUP
1
TEST
Examination of Product
Total Mating / Un-mating
Force
Solderability
Low Level Contact
Resistance
Insulation Resistance
DWV
Contact Current Rating
Insertion Loss
Return Loss
Crosstalk
Intra-pair skew
Thermal Shock
Cyclic Temp and Humidity
Temperature Life (pre-
conditioning)
Temperature Life
Vibration
Shock
Durability (pre-conditioning)
Durability
Mixed Flowing Gas
Reseating
Sample Quantity / Group
PARA
6.1
6.2
6.3
6.4.1
6.4.2
6.4.3
6.4.4
6.4.5
6.4.6
6.4.7
6.4.8
6.4.9
6.4.10
6.4.11
6.4.12
6.4.13
6.4.14
6.4.15
6.4.16
6.4.17
6.4.18
4
1
2
3
4
5
6
7
8
TEST SEQUENCE
1
1
1
1
2
3
2,5,7 2,5,8,10 2,5,7,9
7
2,6
2
2
3
4
5
4
6
4
6
8
3
8
4
2,5,7,9,
11
3,5
1
1
1
3
3
3
4
6
10
6
9
5
5
5
5
3
3
5
3
This document is the property of and embodies CONFIDENTIAL and PROPRIETARY information of FCI Electronics. No part of the information shown on this document may be used in
any way without the written consent of FCI Electronics.
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