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C1206C183B4RC

Description
CERAMIC CHIP CAPACITORS
File Size1013KB,8 Pages
ManufacturerKEMET
Websitehttp://www.kemet.com
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C1206C183B4RC Overview

CERAMIC CHIP CAPACITORS

Ink screen calendar based on AB32 and RT-Thread, open source
Project Background This project is one of the participating projects in the [RT-Thread x RISC-V Application Innovation Competition] Project Introduction What problem does this project solve?Traditiona...
Fillmore Real-time operating system RTOS
Transistor common emitter amplifier circuit
[i=s]This post was last edited by S3S4S5S6 on 2020-8-25 15:51[/i]The figure below is a basic triode amplifier circuit. The circuit parameters are marked in the figure. C12 is 4.7pF. The other paramete...
S3S4S5S6 Analog electronics
[RISC-V] Domestic IDE MRS V1.50+JLink! GD32VF103 development practice
[i=s]This post was last edited by Moiiiiilter on 2021-7-16 11:14[/i]Previously, the onboard LINK debugging and downloading of GD32VF103C_START felt very slow. Recently, I found that the latest V1.50 v...
Moiiiiilter Domestic Chip Exchange
28335 Clock, peripheral and register configuration
1. Clock generation process The external clock or external crystal oscillator provides the clock source OSCCLK to the F28335, enabling the on-chip PLL circuit of the F28335. The PLL circuit multiplies...
Jacktang Microcontroller MCU
The problem of too small spacing between chip leads in AD
[i=s]This post was last edited by yjguohua on 2019-2-20 10:00[/i] [color=#001000][backcolor=rgb(255, 255, 255)]Because the chip pin spacing is less than 10mil, the pad lead spacing is too small, and a...
yjguohua PCB Design
ARM+DSP+IPU heterogeneous multi-core processors communicate between cores through IPC components
##ARM+DSP+IPU heterogeneous multi-core processors communicate between cores through IPC components###1. IPC inter-core communication IPC (Inter-Processor Communication) provides an API that is indepen...
bqgup Innovation Lab

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Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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