NJL6401R-3
COBP High Speed Photo Diode
GENERAL
DESCRIPTION
The NJL6401R-3 is a high-speed PIN photodiode capable of detecting in a wide wavelength range of up to
infrared light from the blue-violet light.
The features are low wavelength dependence and fast fall-time.
An ultra-small and thin package of COBP is adopted, and providing high efficient space-saving.
.
FEATURES
•
C
orresponding to three wavelength
(=405nm/650nm/780nm)
•
Short rise-time, fall-time
2ns typ. (=405nm/650nm/780nm, VR=2.5V, 10-90%)
•
High speed
250MHz (
=780nm)
300MHz (
=650nm)
350MHz (
=405nm)
•
Miniature, thin package
•
Active area
1.2mmX1.7mmX0.8mm
0.7mmX0.7mm
APPLICATIONS
•
Laser monitor for Blu-ray, etc.
•
Monitor for RGB wavelength
•
Photoelectric switch, Space light transmitting, etc.
ABSOLUTE
MAXIMUM RATINGS
(Ta=25C)
PARAMETER
Reverse Voltage
Operating Temperature
Storage Temperature
Reflow Soldering Temperature
SYMBOL
V
R
T
opr
T
stg
T
sol
RATINGS
35
-30 to +85
-40 to +100
255
UNIT
V
C
C
C
ELECTRO-OPTICAL
CHARACTERISTICS
(Ta=25C)
PARAMETER
Dark Current
Forward Voltage
Capacitance
Peak Wavelength
Sensitivity
SYMBOL
I
D
V
F
C
t
P
S
TEST CONDITION
V
R
=10V
I
F
=1mA
V
R
=2.5V, f=1MHz
MIN
—
—
—
—
0.37
0.34
0.22
—
—
—
—
—
—
TYP
0.1
—
4
800
0.47
0.42
0.28
2
2
2
250
300
350
MAX
2.0
1.0
—
—
—
—
—
—
—
—
—
—
—
UNIT
nA
V
pF
nm
A/W
A/W
A/W
ns
ns
ns
MHz
MHz
MHz
—
V
R
=2.5V,
=780nm
V
R
=2.5V,
=650nm
V
R
=2.5V,
=405nm
V
R
=2.5V,
=780nm,
10-90%, 1mW
V
R
=2.5V,
=650nm,
10-90%, 1mW
V
R
=2.5V,
=405nm,
10-90%, 1mW
V
R
=2.5V,
=780nm,
RL=50-3dB
V
R
=2.5V,
=650nm,
RL=50-3dB
V
R
=2.5V,
=405nm,
RL=50-3dB
Rise time, Fall time
tr/tf
Cut off Frequency
fc
20.June.2014 Rev.2.2
-1-
NJL6401R-3
TYPICAL
CHARACTERISTICS
Relative Sensitivity vs. Illuminance (Ta=25C)
1.00E-03
VR=2.5V
Spectral Response (Ta=25C)
100%
90%
80%
1.00E-04
λ=650nm,780nm
70%
Light Current IL(A)
1.00E-05
λ=405nm
Relative Sensitivity(%)
60%
50%
40%
30%
1.00E-06
1.00E-07
20%
10%
1.00E-08
0.01
0.1
1
Illuminance (mW/cm
2
)
10
100
0%
300
400
500
600
700
800
900
1000
Wavelength(nm)
Dark Current vs. Temperature
1.00E-08
VR=2.5V
1.00E-09
Relative Sensitivity vs. Temperature
105%
104%
103%
102%
Relative Sensitivity(%)
VR=2.5V
λ=780nm
λ=405nm
λ=650nm
1.00E-10
Dark Current ID(A)
101%
100%
99%
98%
97%
96%
1.00E-11
1.00E-12
1.00E-13
1.00E-14
-40
95%
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
Ambient Temperature Ta(ºC)
Ambient Temperature Ta(ºC)
Rise Time vs. Reverse Voltage (Ta=25C)
5.0
RL=50Ω
4.0
λ=780nm
Rise Time(ns)
λ=405nm,650nm
2.0
Fall Time(ns)
3.0
Fall Time vs. Reverse Voltage (Ta=25C)
5.0
RL=50Ω
4.0
λ=780nm
3.0
λ=405nm,650nm
2.0
1.0
1.0
0.0
0
1
2
VR(V)
3
4
5
0.0
0
1
2
VR(V)
3
4
5
20.June.2014 Rev.2.2
-3-
NJL6401R-3
MOUNTING METHOD
NOTE
Mounting was evaluated with the following profiles in our company, so there was no problem.
However, confirm mounting by the condition of your company beforehand.
The exposure of device under higher temperature many affect to the reliability of the products, it is recommended
to complete soldering in the shortest time possible.
Mounting:
Twice soldering is allowed.
INFRARED REFLOW SOLDERING METHOD
Recommended reflow soldering procedure
a : Temperature ramping rate
b : Pre-heating temperature
time
c : Temperature ramping rate
d : Mounting temperature
time
e : Peak temperature
f : Temperature ramping rate
: 1 to 4C/s
: 150 to 180C
: 60 to 120s
: 1 to 4C /s
: 230C
: 20 to 40s
: Lower than 255C
: 1 to 6C /s
e
255C
230C
180C
150C
The temperature indicates at the surface
of mold package
Room
Temp.
a
b
c
d
f
(NOTE1) Using reflow furnace with short wave infrared radiation heater such as halogen lamp
Regarding temperature profile, please refer to those fo reflow furnace.
In this case the resin surface temperature may become higher than lead terminals due to endothermic ally of black colored
mold resin. Therefore, please avoid from direct exposure to mold resin.
(NOTE2) Other method
Such other methods of soldering as dipping the device into melted solder and vapor phase method (VPS) are not appropriate
because the body of device will be heated rapidly. Therefore, these are not recommended to apply.
(NOTE3) The resin gets softened right after soldering, so, the following care has to be taken
Not to contact the lens surface to anything.
Not to dip the device into water or any solvents.
FLOE SOLDERING METHOD
Flow soldering is not possible.
IRON SOLDERING METHOD
Iron soldering is not possible.
20.June.2014 Rev.2.2
-5-
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