CDR02BP109BBWM datasheet, PDF - EEWORLD Datasheet

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CDR02BP109BBWM: DescriptionCERAMIC CHIP/MIL-PRF-55681; File Size938KB，10 Pages; ManufacturerKEMET; Websitehttp://www.kemet.com

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CDR02BP109BBWM Overview

CERAMIC CHIP/MIL-PRF-55681

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CERAMIC CHIP/MIL-PRF-55681

CAPACITOR OUTLINE DRAWINGS

CHIP DIMENSIONS

“SOLDERGUARD I” *

SOLDER

“SOLDERGUARD II”

TINNED

NICKEL

ELECTRODES

SILVER

METALLIZATION

ELECTRODES

NICKEL

SILVER

METALLIZATION

Military Designation - “S” or “U”

KEMET Designation - “H”

Military Designation - “W” or “Y”

KEMET Designation - “C”

DIMENSIONS—MILLIMETERS AND (INCHES)

STYLE

KEMET

SIZE

CODE

MIN.

MAX.

CDR01

CDR02

CDR03

CDR04

CDR05

CDR06

CDR31

CDR32

CDR33

CDR34

CDR35

C0805

C1805

C1808

C1812

C1825

C2225

C0805

C1206

C1210

C1812

C1825

2.03 ±.38 (.080 ±.015)

4.57 ±.38 (.180 ±.015)

+.51

+.020

4.57

.180

–.38

–.015

5.72 ±.51 (.225 ±.020)

2.00 ±.20 (.078 ±.008)

3.20 ±.20 (.125 ±.008)

3.20 ±.25 (.125 ±.010)

4.50 ±.25 (.176 ±.010)

4.50 ±.30 (.176 ±.012)

(

)

1.27 ±.38 (.050 ±.015)

2.03 ±.38 (.080 ±.015)

3.18 ±.38 (.125 ±.015)

+.51

+.020

6.35

.250

–.38

–.015

6.35 ±.51 (.250 ±.020)

1.25 ±.20 (.049 ±.008)

1.60 ±.20 (.062 ±.008)

2.50 ±.25 (.098 ±.010)

3.20 ±.25 (.125 ±.010)

6.40 ±.30 (.250 ±.012)

.56 (.022)

.51 (.020)

1.40 (.055)

2.03 (.080)

1.30 (.051)

1.50 (.059)

.51 ± 0.25 (.020 ±.010)

.50 ± 0.20 (.020 ±.008)

.50 ± 0.25 (.020 ±.010)

.50 ± 0.30 (.020 ±.012)

(

)

Note: For Solderguard I (MIL-C55681 “S” or “U” Endmets), the length, width and thickness positive tolerances (including bandwidth) cited above are allowed to increase by the following

amounts:

Width/Thickness

Length

CDR01

0.51MM (.020)

0.38MM (.015)

CDR02-06

0.64MM (.025)

0.38MM (.015)

CDR31-35

0.60MM (.023)

0.30MM (.012)

MIL-PRF-55681 PART NUMBER ORDERING INFORMATION

CDR01

B P

101 B K

S M

STYLE & SIZE CODE

STYLE

C — Ceramic

D — Dielectric, Fixed Chip

R — Established Reliability

FAILURE RATE LEVEL

(%/1000 hrs.)

TERMINATION FINISH

S — Solder Coated, Final

(SolderGuard I)

U — Base Metalization—

Barrier Metal—Solder

Coated (SolderGuard I)

W — Base Metalization—

Barrier Metal—Tinned

Tin or (Tin/Lead Alloy)

SolderGuard II

Y — Base Metalization

Barrier Metal—Tinned

(100% Tin) Solderguard II

RATED TEMPERATURE

–55°C to +125°C

DIELECTRICS

P —± 30 PPM/°C—WITH OR WITHOUT VOLTAGE

X —± 15%—without voltage

+ 15%, –25%—with voltage

CAPACITANCE

Expressed in picofarads (pF).

First 2 digits represent significant figures and the last digit specifies the number of zeros to follow.

(Use 9 for 1.0 through 9.9pF. Example: 2.2pF = 229)

CAPACITANCE TOLERANCE

±.1 pF ±.25 pF ±.5 pF ±1%

±5%

±10% ±20%

RATED VOLTAGE

A — 50; B — 100

KEMET/MIL-PRF-55681 PART NUMBER EQUIVALENTS

C 0805

P 101 K

1 G M C*

CERAMIC

SIZE CODE

See Table Above

END METALIZATION

C — SolderGuard II

(100% Sn)

(Military equiv: Y, W)

H — SolderGuard I

(Sn60)

(Military equiv: S, U)

SPECIFICATION

P -MIL-PRF-55681 = CDR01-CDR06

N-MIL-PRF-55681 = CDR31-CDR35

FAILURE RATE

(%/1,000 hrs.)

M — 1.0

P — 0.1

R — 0.01

S — 0.001

CAPACITANCE CODE

Expressed in picofarads (pF).

First two digits represent significant figures.

Third digit specifies number of zeros. (Use 9

for 1.0 thru 9.9 pF. Example: 2.2 pF –229)

VOLTAGE TEMPERATURE CHARACTERISTIC

Designated by Capacitance

Change Over Temperature Range

G — BP (C0G/NP0) (±30 PPM/°C)

X — BX (±15% Without Voltage

+15% -25% With Voltage)

CAPACITANCE TOLERANCE

.1 pF

.25 pF

.5 pF

10%

20%

VOLTAGE

1 — 100V, 5 — 50V

* Part Number Example: C0805P101K1GMC

(14 digits - no spaces)

Ceramic Surface Mount

M — 1.0

P — 0.1

R — 0.01

S — 0.001

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