MR25H256AMDF datasheet, PDF - EEWORLD Datasheet

MR25H256AMDF: DescriptionNVRAM 256Kb 3.3V 32Kx8 SPI; Categorystorage storage; File Size2MB，24 Pages; ManufacturerEverspin Technologies; Environmental Compliance

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NVRAM 256Kb 3.3V 32Kx8 SPI

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Everspin Technologies
package instruction	HVSON,
Reach Compliance Code	compliant
Samacsys Description	MRAM 256Kb 3.3V 32Kx8 SPI
JESD-30 code	R-PDSO-N8
length	6 mm
memory density	262144 bit
Memory IC Type	SPI BUS SERIAL EEPROM
memory width	8
Humidity sensitivity level	3
Number of functions	1
Number of terminals	8
word count	32768 words
character code	32000
Operating mode	SYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-40 °C
organize	32KX8
Package body material	PLASTIC/EPOXY
encapsulated code	HVSON
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Filter level	AEC-Q100
Maximum seat height	0.9 mm
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	AUTOMOTIVE
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	5 mm
Base Number Matches	1

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