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ESD8111PFCT5G

Description
ESD Suppressors / TVS Diodes ENCAPSULATED DSN
CategoryDiscrete semiconductor    diode   
File Size99KB,7 Pages
ManufacturerON Semiconductor
Websitehttp://www.onsemi.cn
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ESD Suppressors / TVS Diodes ENCAPSULATED DSN

ESD8111PFCT5G Parametric

Parameter NameAttribute value
Brand NameON Semiconductor
Is it lead-free?Lead free
MakerON Semiconductor
package instructionR-PBCC-N2
Manufacturer packaging code152AX
Reach Compliance Codecompliant
Factory Lead Time7 weeks
Other featuresULTRA LOW CAPACITANCE
Maximum breakdown voltage8.6 V
Minimum breakdown voltage5.5 V
Breakdown voltage nominal value7.9 V
Maximum clamping voltage8 V
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeTRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 codeR-PBCC-N2
JESD-609 codee3
Number of components1
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formCHIP CARRIER
Peak Reflow Temperature (Celsius)NOT SPECIFIED
polarityBIDIRECTIONAL
GuidelineIEC-61000-4-2
Maximum repetitive peak reverse voltage3.3 V
Maximum reverse current1 µA
Reverse test voltage3.3 V
surface mountYES
technologyAVALANCHE
Terminal surfaceTin (Sn)
Terminal formNO LEAD
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
Base Number Matches1
ESD8101, ESD8111
ESD Protection Diodes
Ultra Low Capacitance ESD Protection
Diode for High Speed Data Line
The ESD81x1 Series ESD protection diodes are designed to protect
high speed data lines from ESD. Ultra−low capacitance and low ESD
clamping voltage make this device an ideal solution for protecting
voltage sensitive high speed data lines.
Features
www.onsemi.com
MARKING
DIAGRAMS
ESD8101 (01005)
DSN2
CASE 152AK
ESD8111 (0201)
WLCSP2
CASE 567AV
ESD8111P (0201)
WLCSP2
CASE 152AX
T, F, Q = Device Code
Low Capacitance (0.20 pF Typ, I/O to GND)
Protection for the Following IEC Standards:
IEC 61000−4−2 (Level 4)
Low ESD Clamping Voltage
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Typical Applications
T
F
USB 3.0/3.1
MHL 2.0
eSATA
MAXIMUM RATINGS
(T
J
= 25°C unless otherwise noted)
Rating
Operating Junction Temperature Range
Storage Temperature Range
Lead Solder Temperature −
Maximum (10 Seconds)
ESD8101:
IEC 61000−4−2 Contact
IEC 61000−4−2 Air
ESD8111:
IEC 61000−4−2 Contact
IEC 61000−4−2 Air
Symbol
T
J
T
stg
T
L
ESD
Value
−55 to +150
−55 to +150
260
Unit
°C
°C
°C
1
PIN CONFIGURATION
AND SCHEMATIC
2
±23
±23
±30
±30
kV
kV
kV
kV
=
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
ORDERING INFORMATION
See detailed ordering and shipping information on page 2 of
this data sheet.
See Application Note AND8308/D for further description of
survivability specs.
©
Semiconductor Components Industries, LLC, 2016
1
June, 2016 − Rev. 5
Publication Order Number:
ESD8101/D
Q

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