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EDI7F2332MV100BNC

Description
2Mx32 FLASH MODULE
Categorystorage    storage   
File Size146KB,3 Pages
ManufacturerWhite Electronic Designs Corporation
Websitehttp://www.wedc.com/
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EDI7F2332MV100BNC Overview

2Mx32 FLASH MODULE

EDI7F2332MV100BNC Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerWhite Electronic Designs Corporation
package instructionSIMM-80
Reach Compliance Codeunknow
Maximum access time100 ns
JESD-30 codeR-XSMA-N80
memory density134217728 bi
Memory IC TypeFLASH MODULE
memory width32
Number of functions1
Number of terminals80
word count4194304 words
character code4000000
Operating modeASYNCHRONOUS
organize4MX32
Package body materialUNSPECIFIED
encapsulated codeSIMM
Package shapeRECTANGULAR
Package formMICROELECTRONIC ASSEMBLY
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Programming voltage3.3 V
Certification statusNot Qualified
Maximum supply voltage (Vsup)3.3 V
Minimum supply voltage (Vsup)2.7 V
Nominal supply voltage (Vsup)3 V
surface mountNO
technologyCMOS
Terminal formNO LEAD
Terminal locationSINGLE
Maximum time at peak reflow temperatureNOT SPECIFIED
typeNOR TYPE

EDI7F2332MV100BNC Preview

White Electronic Designs
2Mx32 FLASH MODULE
FEATURES
2Mx32 and 2x2Mx32 Densities
Based on AMD - AM29LV017B Flash Device
Fast Read Access Time - 90ns
3.3V-Only Reprogramming
Sector Erase Architecture
Uniform sectors of 64 Kbytes each
Any combination of sectors can be erased
Supports full chip erase
Sector Protection
Hardware method that disables any
combination of sector from write or erase
operations
Embedded Erase Algorithms
Automatically preprograms and erases the chip
or any combination of sectors
Embedded Program Algorithms
Automatically programs and verifies data at
specified address
EDI7F332MV
Data Polling and Toggle Bit feature for detection of
program or erase cycle completion
Low Power Dissipation
30mA per Device Active Write Current
5µA per Device CMOS Standby Current
Typical Endurance >100,000 Cycles
Single 3.0V ±10% Supply
CMOS and TTL Compatible Inputs and Outputs
Commercial and Industrial Temperature Range
Package
80 Pin SIMM (JEDEC)
DESCRIPTION
The EDI7F332MV and EDI7F2332MV are organized as
one and two banks of 2Mx32 respectively. The modules are
based on AMDs AM29LV017B- 2Mx8 Flash device in TSOP
packages which are mounted on an FR4 substrate.
Both modules offer access times between 90 and 120ns
allowing for operation of high-speed microprocessors
without wait states.
FIG. 1 BLOCK DIAGRAMS
EDI7F332MV-BNC: 2Mx32, 80 PIN SIMM
E0#
A0-A20
G#
2M x 8
EDI7F2332MV-BNC: 2x2Mx32, 80 PIN SIMM
E1#
E0#
A0-A20
G#
2M x 8
2M x 8
DQ0-DQ7
W0#
2M x 8
DQ0-DQ7
DQ8-DQ15
W0#
2M x 8
2M x 8
W1#
2M x 8
DQ8-DQ15
DQ16-DQ23
W1#
2M x 8
2M x 8
W2#
2M x 8
DQ16-DQ23
DQ24-DQ31
W2#
2M x 8
2M x 8
W3#
DQ24-DQ31
W3#
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
Sept, 2002
Rev. 0
1
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
White Electronic Designs
CAPACITANCE
(F=1.0MH
Z
, V
IN
= V
CC
or V
SS
)
Parameter
Address Lines
Data lines
Chip Enable Lines
Write Enable Lines
Output Enable lines
Sym
CA
CDQ
CE
CW
CG
2Meg
Max
35
15
40
20
40
2x2Meg
Max
70
30
40
20
80
Unit
pF
pF
pF
pF
pF
EDI7F332MV
PIN CONFIGURATIONS
Pin #
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
*TBD
SIMM DENSITY
Pin #
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
Pin Name
DQ9
DQ8
DQ7
DQ6
DQ5
DQ4
DQ3
DQ2
DQ1
DQ0
NC
V
CC
PD1
PD2
PD3
PD4
PD5
PD6
PD7
V
SS
Pin
21
22
23
24
2Meg
NC
NC
NC
E0#
2x2Meg
NC
NC
E1#
E0#
Pin Name
V
SS
V
CC
NC
G#
W0#
W1#
NC
DQ16
DQ17
DQ18
DQ19
DQ20
DQ21
DQ22
DQ23
DQ24
DQ25
DQ26
DQ27
DQ28
Pin #
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
Pin Name
*
*
*
*
V
SS
DQ29
DQ30
DQ31
W2#
NC
NC
A20
A19
A18
A17
A16
A15
A14
A13
A12
Pin #
41
42
43
44
45
461
47
48
49
50
51
52
53
54
55
56
57
58
59
60
Pin Name
A11
A10
A9
A8
A7
A6
A5
A4
A3
A2
A1
AO
W3#
V
SS
DQ15
DQ14
DQ13
DQ12
DQ11
DQ10
PRESENCE DETECT PIN OUT
Pin
PD1
PD2
PD3
PD4
2Meg
V
SS
NC
V
SS
V
SS
2x2Meg
NC
V
SS
V
SS
V
SS
A0-A20
E0#,E1#
W0#-W3#
G#
DQ0-DQ31
PD
V
CC
V
SS
NC
Address input
Chip Enable
Write Enable
Output Enable
Data Input/Output
Presence Detect
Power 3V±10%
Ground
No Connect
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
Sept, 2002
Rev. 0
2
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
White Electronic Designs
ORDERING INFORMATION
Part Number
EDI7F332MV90BNC
EDI7F332MV100BNC
EDI7F332MV120BNC
Speed (ns)
90
100
120
Package
369
369
369
EDI7F332MV
Note: To order an Industrial grade product substitute the letter C
in the Suffix with the letter I.
PACKAGE NO. 369: 80 PIN SIMM (JEDEC)
4.655 MAX.
4.384
0.850
MAX.
0.250
+
J2-1
J2-2
J2-3
J1
J3
R2
0.120
MAX.
+
0.400
0.125
MIN.
P1
0.050 TYP.
0.062 R
2.245
0.062 R
0.250
4.150
2.192
ORDERING INFORMATION
Part Number
EDI7F2332MV90BNC
EDI7F2332MV100BNC
EDI7F2332MV120BNC
Speed (ns)
90
100
120
Package
370
370
370
Note: To order an Industrial grade product substitute the letter C
in the Suffix with the letter I.
PACKAGE NO. 370: 80 PIN SIMM (JEDEC)
4.655 MAX.
4.384
R1
0.170
MAX.
0.850
MAX.
0.250
+
J1
J2-1
J2-2
J2-3
+
J3
153
0.400
P1
0.050 TYP.
0.062 R
0.062 R
2.245
0.250
4.150
2.192
0.125
MIN.
0.225
MIN.
ALL DIMENSIONS ARE IN INCHES
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
Sept, 2002
Rev. 0
3
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com

EDI7F2332MV100BNC Related Products

EDI7F2332MV100BNC EDI7F332MV100BNC EDI7F332MV EDI7F332MV120BNC EDI7F332MV90BNC EDI7F2332MV90BNC
Description 2Mx32 FLASH MODULE 2Mx32 FLASH MODULE 2Mx32 FLASH MODULE 2Mx32 FLASH MODULE 2Mx32 FLASH MODULE 2Mx32 FLASH MODULE
Is it Rohs certified? incompatible incompatible - incompatible incompatible incompatible
Maker White Electronic Designs Corporation White Electronic Designs Corporation - White Electronic Designs Corporation White Electronic Designs Corporation White Electronic Designs Corporation
package instruction SIMM-80 SIMM-80 - SIMM-80 SIMM-80 SIMM-80
Reach Compliance Code unknow unknow - unknow unknow unknow
Maximum access time 100 ns 100 ns - 120 ns 90 ns 90 ns
JESD-30 code R-XSMA-N80 R-XSMA-N80 - R-XSMA-N80 R-XSMA-N80 R-XSMA-N80
memory density 134217728 bi 67108864 bi - 67108864 bi 67108864 bi 134217728 bi
Memory IC Type FLASH MODULE FLASH MODULE - FLASH MODULE FLASH MODULE FLASH MODULE
memory width 32 32 - 32 32 32
Number of functions 1 1 - 1 1 1
Number of terminals 80 80 - 80 80 80
word count 4194304 words 2097152 words - 2097152 words 2097152 words 4194304 words
character code 4000000 2000000 - 2000000 2000000 4000000
Operating mode ASYNCHRONOUS ASYNCHRONOUS - ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
organize 4MX32 2MX32 - 2MX32 2MX32 4MX32
Package body material UNSPECIFIED UNSPECIFIED - UNSPECIFIED UNSPECIFIED UNSPECIFIED
encapsulated code SIMM SIMM - SIMM SIMM SIMM
Package shape RECTANGULAR RECTANGULAR - RECTANGULAR RECTANGULAR RECTANGULAR
Package form MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY - MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Parallel/Serial PARALLEL PARALLEL - PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Programming voltage 3.3 V 3.3 V - 3.3 V 3.3 V 3.3 V
Certification status Not Qualified Not Qualified - Not Qualified Not Qualified Not Qualified
Maximum supply voltage (Vsup) 3.3 V 3.3 V - 3.3 V 3.3 V 3.3 V
Minimum supply voltage (Vsup) 2.7 V 2.7 V - 2.7 V 2.7 V 2.7 V
Nominal supply voltage (Vsup) 3 V 3 V - 3 V 3 V 3 V
surface mount NO NO - NO NO NO
technology CMOS CMOS - CMOS CMOS CMOS
Terminal form NO LEAD NO LEAD - NO LEAD NO LEAD NO LEAD
Terminal location SINGLE SINGLE - SINGLE SINGLE SINGLE
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
type NOR TYPE NOR TYPE - NOR TYPE NOR TYPE NOR TYPE

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