|
M74HC4066TTR |
M74HC4066B1R |
Description |
Analog Switch ICs Quad Bilateral Sw |
Analog Switch ICs Quad Bilateral Sw |
Is it lead-free? |
Lead free |
Lead free |
Is it Rohs certified? |
conform to |
conform to |
Maker |
STMicroelectronics |
STMicroelectronics |
Parts packaging code |
TSSOP |
DIP |
package instruction |
TSSOP-14 |
PLASTIC, DIP-14 |
Contacts |
14 |
14 |
Reach Compliance Code |
compliant |
unknown |
Samacsys Status |
Released |
Released |
Samacsys PartID |
179753 |
600805 |
Samacsys Pin Count |
14 |
14 |
Samacsys Part Category |
Integrated Circuit |
Integrated Circuit |
Samacsys Package Category |
Small Outline Packages |
Other |
Samacsys Footprint Name |
ST TSSOP14_1 |
DIP254P762X510-14 |
Samacsys Released Date |
2015-05-07 08:49:48 |
2017-01-12 09:29:10 |
Is Samacsys |
N |
N |
Analog Integrated Circuits - Other Types |
SPST |
SPST |
JESD-30 code |
R-PDSO-G14 |
R-PDIP-T14 |
JESD-609 code |
e4 |
e4 |
normal position |
NO |
NO |
Number of channels |
1 |
1 |
Number of functions |
4 |
4 |
Number of terminals |
14 |
14 |
Nominal off-state isolation |
60 dB |
60 dB |
On-state resistance matching specifications |
10 Ω |
10 Ω |
Maximum on-state resistance (Ron) |
170 Ω |
170 Ω |
Maximum operating temperature |
125 °C |
125 °C |
Minimum operating temperature |
-55 °C |
-55 °C |
output |
SEPARATE OUTPUT |
SEPARATE OUTPUT |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
TSSOP |
DIP |
Encapsulate equivalent code |
TSSOP14,.25 |
DIP14,.3 |
Package shape |
RECTANGULAR |
RECTANGULAR |
Package form |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
IN-LINE |
Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
NOT SPECIFIED |
power supply |
2/12 V |
2/12 V |
Certification status |
Not Qualified |
Not Qualified |
Maximum seat height |
1.2 mm |
5.1 mm |
Maximum supply voltage (Vsup) |
12 V |
12 V |
Minimum supply voltage (Vsup) |
2 V |
2 V |
Nominal supply voltage (Vsup) |
4.5 V |
4.5 V |
surface mount |
YES |
NO |
Maximum disconnect time |
23 ns |
23 ns |
Maximum connection time |
20 ns |
20 ns |
technology |
CMOS |
CMOS |
Temperature level |
MILITARY |
MILITARY |
Terminal surface |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Terminal form |
GULL WING |
THROUGH-HOLE |
Terminal pitch |
0.65 mm |
2.54 mm |
Terminal location |
DUAL |
DUAL |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
width |
4.4 mm |
7.62 mm |
Base Number Matches |
1 |
1 |