|
S912XB256F1CAL |
MC9S12XB128MAA |
MC9S12XA512CAG |
S912XB256F1CALR |
MC9S12XA512CAL |
MC9S12XA256CAG |
MC9S12XA256CAL |
CSC12A032K40JPA |
MC9S12XA256CAA |
MC9S12XA256VAA |
Description |
16-bit Microcontrollers - MCU S912XB256F1CAL/LQFP112///STANDARD MARKING * TRAY D |
16-bit Microcontrollers - MCU 16BIT 128K FLASH 12K RAM |
16-bit Microcontrollers - MCU 512K FLASH HCS12X MCU |
16-bit Microcontrollers - MCU S912XB256F1CAL/LQFP112///REEL 13 Q2/T3 *STANDARD |
16-bit Microcontrollers - MCU 9S12XA512 TSMC3 GENERAL |
16-bit Microcontrollers - MCU 512K FLASH HCS12X MCU |
16-bit Microcontrollers - MCU 9S12XA256 TSMC3 GENERAL |
Array/Network Resistor, Isolated, Metal Glaze/thick Film, 0.3W, 2400ohm, 100V, 5% +/-Tol, -100,100ppm/Cel, |
16-bit Microcontrollers - MCU 9S12XA256 TSMC3 GENERAL |
16-bit Microcontrollers - MCU 9S12XA256 TSMC3 GENERAL |
Is it lead-free? |
- |
Lead free |
Lead free |
- |
Lead free |
Lead free |
Lead free |
- |
Lead free |
Lead free |
Is it Rohs certified? |
- |
conform to |
conform to |
- |
conform to |
conform to |
conform to |
incompatible |
conform to |
conform to |
Maker |
- |
NXP |
NXP |
- |
NXP |
NXP |
NXP |
- |
NXP |
NXP |
Parts packaging code |
- |
QFP |
QFP |
- |
QFP |
QFP |
QFP |
- |
QFP |
QFP |
package instruction |
- |
LEAD FREE, PLASTIC, QFP-80 |
LEAD FREE, LQFP-144 |
- |
LEAD FREE, LQFP-112 |
LEAD FREE, LQFP-144 |
LEAD FREE, LQFP-112 |
- |
LEAD FREE, PLASTIC, QFP-80 |
LEAD FREE, PLASTIC, QFP-80 |
Contacts |
- |
80 |
144 |
- |
112 |
144 |
112 |
- |
80 |
80 |
Reach Compliance Code |
- |
unknown |
unknown |
- |
unknown |
unknown |
unknown |
compliant |
unknown |
unknown |
ECCN code |
- |
3A991.A.2 |
3A991.A.2 |
- |
3A991.A.2 |
3A991.A.2 |
3A991.A.2 |
EAR99 |
3A991.A.2 |
3A991.A.2 |
Has ADC |
- |
YES |
YES |
- |
YES |
YES |
YES |
- |
YES |
YES |
Other features |
- |
IT ALSO REQUIRES 5 V SUPPLY |
IT ALSO REQUIRES 5 V SUPPLY |
- |
IT ALSO REQUIRES 5 V SUPPLY |
IT ALSO REQUIRES 5 V SUPPLY |
IT ALSO REQUIRES 5 V SUPPLY |
- |
IT ALSO REQUIRES 5 V SUPPLY |
IT ALSO REQUIRES 5 V SUPPLY |
bit size |
- |
16 |
16 |
- |
16 |
16 |
16 |
- |
16 |
16 |
CPU series |
- |
CPU12 |
CPU12 |
- |
CPU12 |
CPU12 |
CPU12 |
- |
CPU12 |
CPU12 |
maximum clock frequency |
- |
80 MHz |
80 MHz |
- |
80 MHz |
80 MHz |
80 MHz |
- |
80 MHz |
80 MHz |
DAC channel |
- |
NO |
NO |
- |
NO |
NO |
NO |
- |
NO |
NO |
DMA channel |
- |
YES |
YES |
- |
YES |
YES |
YES |
- |
YES |
YES |
JESD-30 code |
- |
S-PQFP-G80 |
S-PQFP-G144 |
- |
S-PQFP-G112 |
S-PQFP-G144 |
S-PQFP-G112 |
- |
S-PQFP-G80 |
S-PQFP-G80 |
JESD-609 code |
- |
e3 |
e3 |
- |
e3 |
e3 |
e3 |
e0 |
e3 |
e3 |
length |
- |
14 mm |
20 mm |
- |
20 mm |
20 mm |
20 mm |
- |
14 mm |
14 mm |
Humidity sensitivity level |
- |
3 |
3 |
- |
3 |
3 |
3 |
- |
3 |
3 |
Number of I/O lines |
- |
59 |
119 |
- |
91 |
119 |
91 |
- |
59 |
59 |
Number of terminals |
- |
80 |
144 |
- |
112 |
144 |
112 |
12 |
80 |
80 |
Maximum operating temperature |
- |
125 °C |
85 °C |
- |
85 °C |
85 °C |
85 °C |
125 °C |
85 °C |
105 °C |
Minimum operating temperature |
- |
-40 °C |
-40 °C |
- |
-40 °C |
-40 °C |
-40 °C |
-55 °C |
-40 °C |
-40 °C |
PWM channel |
- |
YES |
YES |
- |
YES |
YES |
YES |
- |
YES |
YES |
Package body material |
- |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
- |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
- |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
- |
QFP |
LFQFP |
- |
LQFP |
LFQFP |
LQFP |
- |
QFP |
QFP |
Encapsulate equivalent code |
- |
QFP80,.68SQ |
QFP144,.87SQ,20 |
- |
QFP112,.87SQ |
QFP144,.87SQ,20 |
QFP112,.87SQ |
- |
QFP80,.68SQ |
QFP80,.68SQ |
Package shape |
- |
SQUARE |
SQUARE |
- |
SQUARE |
SQUARE |
SQUARE |
- |
SQUARE |
SQUARE |
Package form |
- |
FLATPACK |
FLATPACK, LOW PROFILE, FINE PITCH |
- |
FLATPACK, LOW PROFILE |
FLATPACK, LOW PROFILE, FINE PITCH |
FLATPACK, LOW PROFILE |
SIP |
FLATPACK |
FLATPACK |
Peak Reflow Temperature (Celsius) |
- |
260 |
260 |
- |
260 |
260 |
260 |
- |
260 |
260 |
power supply |
- |
2.5,5 V |
2.5,5 V |
- |
2.5,5 V |
2.5,5 V |
2.5,5 V |
- |
2.5,5 V |
2.5,5 V |
Certification status |
- |
Not Qualified |
Not Qualified |
- |
Not Qualified |
Not Qualified |
Not Qualified |
- |
Not Qualified |
Not Qualified |
RAM (bytes) |
- |
6144 |
32768 |
- |
32768 |
4096 |
4096 |
- |
4096 |
4096 |
rom(word) |
- |
131072 |
524288 |
- |
524288 |
262144 |
262144 |
- |
262144 |
262144 |
ROM programmability |
- |
FLASH |
FLASH |
- |
FLASH |
FLASH |
FLASH |
- |
FLASH |
FLASH |
Maximum seat height |
- |
2.45 mm |
1.6 mm |
- |
1.6 mm |
1.6 mm |
1.6 mm |
- |
2.45 mm |
2.45 mm |
speed |
- |
40 MHz |
40 MHz |
- |
40 MHz |
40 MHz |
40 MHz |
- |
40 MHz |
40 MHz |
Maximum supply voltage |
- |
2.75 V |
2.75 V |
- |
2.75 V |
2.75 V |
2.75 V |
- |
2.75 V |
2.75 V |
Minimum supply voltage |
- |
2.35 V |
2.35 V |
- |
2.35 V |
2.35 V |
2.35 V |
- |
2.35 V |
2.35 V |
Nominal supply voltage |
- |
2.5 V |
2.5 V |
- |
2.5 V |
2.5 V |
2.5 V |
- |
2.5 V |
2.5 V |
surface mount |
- |
YES |
YES |
- |
YES |
YES |
YES |
NO |
YES |
YES |
technology |
- |
CMOS |
CMOS |
- |
CMOS |
CMOS |
CMOS |
METAL GLAZE/THICK FILM |
CMOS |
CMOS |
Temperature level |
- |
AUTOMOTIVE |
INDUSTRIAL |
- |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
- |
INDUSTRIAL |
INDUSTRIAL |
Terminal surface |
- |
Matte Tin (Sn) |
Matte Tin (Sn) |
- |
Matte Tin (Sn) |
Matte Tin (Sn) |
Matte Tin (Sn) |
Tin/Lead (Sn/Pb) |
Matte Tin (Sn) |
Matte Tin (Sn) |
Terminal form |
- |
GULL WING |
GULL WING |
- |
GULL WING |
GULL WING |
GULL WING |
- |
GULL WING |
GULL WING |
Terminal pitch |
- |
0.65 mm |
0.5 mm |
- |
0.65 mm |
0.5 mm |
0.65 mm |
- |
0.65 mm |
0.65 mm |
Terminal location |
- |
QUAD |
QUAD |
- |
QUAD |
QUAD |
QUAD |
- |
QUAD |
QUAD |
Maximum time at peak reflow temperature |
- |
40 |
40 |
- |
40 |
40 |
40 |
- |
40 |
40 |
width |
- |
14 mm |
20 mm |
- |
20 mm |
20 mm |
20 mm |
- |
14 mm |
14 mm |
uPs/uCs/peripheral integrated circuit type |
- |
MICROCONTROLLER |
MICROCONTROLLER |
- |
MICROCONTROLLER |
MICROCONTROLLER |
MICROCONTROLLER |
- |
MICROCONTROLLER |
MICROCONTROLLER |