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72V82L20PA8

Description
FIFO 1Kx9 ASYNCHRONOUS DUAL FIFO 3.3V
Categorystorage    storage   
File Size96KB,12 Pages
ManufacturerIDT (Integrated Device Technology)
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72V82L20PA8 Overview

FIFO 1Kx9 ASYNCHRONOUS DUAL FIFO 3.3V

72V82L20PA8 Parametric

Parameter NameAttribute value
Brand NameIntegrated Device Technology
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerIDT (Integrated Device Technology)
Parts packaging codeTSSOP
package instructionTSSOP-56
Contacts56
Manufacturer packaging codePA56
Reach Compliance Codenot_compliant
ECCN codeEAR99
Maximum access time20 ns
Other featuresRETRANSMIT
Maximum clock frequency (fCLK)33 MHz
period time30 ns
JESD-30 codeR-PDSO-G56
JESD-609 codee0
length14 mm
memory density9216 bit
Memory IC TypeOTHER FIFO
memory width9
Humidity sensitivity level1
Number of functions1
Number of terminals56
word count1024 words
character code1000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize1KX9
ExportableYES
Package body materialPLASTIC/EPOXY
encapsulated codeTSSOP
Encapsulate equivalent codeTSSOP56,.3,20
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)240
power supply3.3 V
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum slew rate0.1 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn85Pb15)
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationDUAL
Maximum time at peak reflow temperature20
width6.1 mm
Base Number Matches1
3.3 Volt CMOS DUAL ASYNCHRONOUS FIFO
DUAL 512 x 9, DUAL 1,024 x 9
DUAL 2,048 x 9, DUAL 4,096 X 9
DUAL 8,192 X 9
LEAD FINISH (SnPb) ARE IN EOL PROCESS - LAST TIME BUY EXPIRES JUNE 15, 2018
IDT72V81
IDT72V82
IDT72V83
IDT72V84
IDT72V85
FEATURES:
The IDT72V81 is equivalent to two IDT72V01 - 512 x 9 FIFOs
The IDT72V82 is equivalent to two IDT72V02 - 1,024 x 9 FIFOs
The IDT72V83 is equivalent to two IDT72V03 - 2,048 x 9 FIFOs
The IDT72V84 is equivalent to two IDT72V04 - 4,096 x 9 FIFOs
The IDT72V85 is equivalent to two IDT72V05 - 8,192 x 9 FIFOs
Low power consumption
— Active: 330 mW (max.)
— Power-down: 18 mW (max.)
Ultra high speed—15 ns access time
Asynchronous and simultaneous read and write
Offers optimal combination of data capacity, small foot print
and functional flexibility
Ideal for bidirectional, width expansion, depth expansion, bus-
matching, and data sorting applications
Status Flags: Empty, Half-Full, Full
Auto-retransmit capability
High-performance CMOS™ technology
Space-saving TSSOP package
Industrial temperature range (–40°C to +85°C) is available
°
°
Green parts available, see ordering information
DESCRIPTION:
The IDT72V81/72V82/72V83/72V84/72V85 are dual-FIFO memories that
load and empty data on a first-in/first-out basis. These devices are functional and
compatible to two IDT72V01/72V02/72V03/72V04/72V05 FIFOs in a single
package with all associated control, data, and flag lines assigned to separate
pins. The devices use Full and Empty flags to prevent data overflow and
underflow and expansion logic to allow for unlimited expansion capability in both
word size and depth.
The reads and writes are internally sequential through the use of ring
pointers, with no address information required to load and unload data. Data
is toggled in and out of the devices through the use of the Write (W) and Read
(R) pins.
The devices utilize a 9-bit wide data array to allow for control and parity
bits at the user’s option. This feature is especially useful in data communications
applications where it is necessary to use a parity bit for transmission/reception
error checking. It also features a Retransmit (RT) capability that allows for reset
of the read pointer to its initial position when
RT
is pulsed low to allow for
retransmission from the beginning of data. A Half-Full Flag is available in the
single device mode and width expansion modes.
These FIFOs are fabricated using high-speed CMOS technology. They are
designed for those applications requiring asynchronous and simultaneous
read/writes in multiprocessing and rate buffer applications.
FUNCTIONAL BLOCK DIAGRAM
DATA INPUTS
(DA
0
-DA
8
)
WA
WRITE
CONTROL
WRITE
POINTER
THREE-
STATE
BUFFERS
RSA
WB
WRITE
CONTROL
WRITE
POINTER
DATA INPUTS
(DB
0
-DB
8
)
RSB
RAM
ARRAY A
512 x 9
1,024 x 9
2,048 x 9
4,096 x 9
8,192 x 9
READ
POINTER
RAM
ARRAY A
512 x 9
1,024 x 9
2,048 x 9
4,096 x 9
8,192 x 9
READ
POINTER
THREE-
STATE
BUFFERS
RA
READ
CONTROL
FLAG
LOGIC
EXPANSION
LOGIC
RESET
LOGIC
READ
CONTROL
FLAG
LOGIC
EXPANSION
LOGIC
RESET
LOGIC
XIA
XOA/HFA
FFA
EFA
DATA
OUTPUTS
(QA
0
-QA
8
)
FLA/RTA
RB
XIB
XOB/HFB
FFB
EFB
DATA
OUTPUTS
(QB
0
-QB
8
)
FLB/RTB
3966 drw 01
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc. The AsyncFIFO™ is a trademark of Integrated Device Technology, Inc.
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
1
NOVEMBER 2017
DSC-3966/6
©
2017 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice.

72V82L20PA8 Related Products

72V82L20PA8
Description FIFO 1Kx9 ASYNCHRONOUS DUAL FIFO 3.3V
Brand Name Integrated Device Technology
Is it lead-free? Contains lead
Is it Rohs certified? incompatible
Maker IDT (Integrated Device Technology)
Parts packaging code TSSOP
package instruction TSSOP-56
Contacts 56
Manufacturer packaging code PA56
Reach Compliance Code not_compliant
ECCN code EAR99
Maximum access time 20 ns
Other features RETRANSMIT
Maximum clock frequency (fCLK) 33 MHz
period time 30 ns
JESD-30 code R-PDSO-G56
JESD-609 code e0
length 14 mm
memory density 9216 bit
Memory IC Type OTHER FIFO
memory width 9
Humidity sensitivity level 1
Number of functions 1
Number of terminals 56
word count 1024 words
character code 1000
Operating mode ASYNCHRONOUS
Maximum operating temperature 70 °C
organize 1KX9
Exportable YES
Package body material PLASTIC/EPOXY
encapsulated code TSSOP
Encapsulate equivalent code TSSOP56,.3,20
Package shape RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial PARALLEL
Peak Reflow Temperature (Celsius) 240
power supply 3.3 V
Certification status Not Qualified
Maximum seat height 1.2 mm
Maximum slew rate 0.1 mA
Maximum supply voltage (Vsup) 3.6 V
Minimum supply voltage (Vsup) 3 V
Nominal supply voltage (Vsup) 3.3 V
surface mount YES
technology CMOS
Temperature level COMMERCIAL
Terminal surface Tin/Lead (Sn85Pb15)
Terminal form GULL WING
Terminal pitch 0.5 mm
Terminal location DUAL
Maximum time at peak reflow temperature 20
width 6.1 mm
Base Number Matches 1

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