Microprocessors - MPU G8 REV 3.0 1.05V 105C
Parameter Name | Attribute value |
Brand Name | Freescale |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | NXP |
Parts packaging code | BGA |
package instruction | 33 X 33 MM, CERAMIC, BGA-1023 |
Contacts | 1023 |
Reach Compliance Code | not_compliant |
ECCN code | 3A991.A.1 |
Address bus width | 32 |
bit size | 32 |
boundary scan | YES |
maximum clock frequency | 1333 MHz |
External data bus width | 32 |
Format | FLOATING POINT |
Integrated cache | YES |
JESD-30 code | S-CBGA-B1023 |
JESD-609 code | e0 |
length | 33 mm |
low power mode | YES |
Humidity sensitivity level | 3 |
Number of terminals | 1023 |
Package body material | CERAMIC, METAL-SEALED COFIRED |
encapsulated code | BGA |
Encapsulate equivalent code | BGA1023,32X32,40 |
Package shape | SQUARE |
Package form | GRID ARRAY |
Peak Reflow Temperature (Celsius) | 245 |
power supply | 1.1,1.8/2.5,2.5/3.3 V |
Certification status | Not Qualified |
Maximum seat height | 2.97 mm |
speed | 166.66 MHz |
Maximum supply voltage | 1.1 V |
Minimum supply voltage | 1 V |
Nominal supply voltage | 1.05 V |
surface mount | YES |
technology | CMOS |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | BALL |
Terminal pitch | 1 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | 30 |
width | 33 mm |
uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR |