Buffers & Line Drivers 2-3.6V CMOS Hex
Parameter Name | Attribute value |
Is it Rohs certified? | conform to |
Parts packaging code | SOIC |
package instruction | LEAD FREE, EIAJ, SO-14 |
Contacts | 14 |
Reach Compliance Code | unknown |
series | LV/LV-A/LVX/H |
JESD-30 code | R-PDSO-G14 |
JESD-609 code | e4 |
length | 10.2 mm |
Load capacitance (CL) | 50 pF |
Logic integrated circuit type | BUFFER |
MaximumI(ol) | 0.004 A |
Number of functions | 6 |
Number of entries | 1 |
Number of terminals | 14 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
Package body material | PLASTIC/EPOXY |
encapsulated code | SOP |
Encapsulate equivalent code | SOP14,.3 |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE |
method of packing | RAIL |
Peak Reflow Temperature (Celsius) | 260 |
power supply | 3.3 V |
Prop。Delay @ Nom-Sup | 11.5 ns |
propagation delay (tpd) | 16 ns |
Certification status | Not Qualified |
Schmitt trigger | NO |
Maximum seat height | 2.05 mm |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 2 V |
Nominal supply voltage (Vsup) | 2.7 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Nickel/Palladium/Gold (Ni/Pd/Au) |
Terminal form | GULL WING |
Terminal pitch | 1.27 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | 40 |
width | 5.275 mm |
Base Number Matches | 1 |