|
NCS2002SN1T1G |
NCV2002SN1T1G |
NCS2002SN2T1G |
Description |
Operational Amplifiers - Op Amps 0.9V Single Rail to Rail -40 to 105 Cel |
Operational Amplifiers - Op Amps 0.9-7V Sngl Rail to Rail Extended Temp |
Operational Amplifiers - Op Amps 0.9V Single Rail to Rail -40 to 105 Cel |
Brand Name |
ON Semiconductor |
ON Semiconductor |
ON Semiconductor |
Is it lead-free? |
Lead free |
Lead free |
Lead free |
Maker |
ON Semiconductor |
ON Semiconductor |
ON Semiconductor |
Parts packaging code |
TSOP |
TSOP |
TSOP |
package instruction |
TSSOP, TSOP6,.11,37 |
TSSOP, TSOP6,.11,37 |
TSSOP, TSOP6,.11,37 |
Contacts |
6 |
6 |
6 |
Manufacturer packaging code |
318G-02 |
318G-02 |
318G-02 |
Reach Compliance Code |
compliant |
compliant |
compliant |
ECCN code |
EAR99 |
EAR99 |
EAR99 |
Factory Lead Time |
5 weeks |
1 week |
1 week |
Amplifier type |
OPERATIONAL AMPLIFIER |
OPERATIONAL AMPLIFIER |
OPERATIONAL AMPLIFIER |
Architecture |
VOLTAGE-FEEDBACK |
VOLTAGE-FEEDBACK |
VOLTAGE-FEEDBACK |
Nominal Common Mode Rejection Ratio |
82 dB |
82 dB |
82 dB |
frequency compensation |
YES |
YES |
YES |
Maximum input offset voltage |
7500 µV |
7500 µV |
7500 µV |
JESD-30 code |
R-PDSO-G6 |
R-PDSO-G6 |
R-PDSO-G6 |
JESD-609 code |
e3 |
e3 |
e3 |
length |
3 mm |
3 mm |
3 mm |
low-bias |
YES |
YES |
YES |
low-dissonance |
NO |
NO |
NO |
micropower |
NO |
NO |
NO |
Humidity sensitivity level |
1 |
1 |
1 |
Negative supply voltage upper limit |
-3.5 V |
-3.5 V |
-3.5 V |
Nominal Negative Supply Voltage (Vsup) |
-2.5 V |
-2.5 V |
-2.5 V |
Number of functions |
1 |
1 |
1 |
Number of terminals |
6 |
6 |
6 |
Maximum operating temperature |
105 °C |
125 °C |
105 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
TSSOP |
TSSOP |
TSSOP |
Encapsulate equivalent code |
TSOP6,.11,37 |
TSOP6,.11,37 |
TSOP6,.11,37 |
Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package form |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
method of packing |
TAPE AND REEL |
TAPE AND REEL |
TAPE AND REEL |
Peak Reflow Temperature (Celsius) |
260 |
260 |
260 |
power |
NO |
NO |
NO |
power supply |
+-2.5 V |
+-2.5 V |
+-2.5 V |
Programmable power |
NO |
NO |
NO |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Maximum seat height |
1.1 mm |
1.1 mm |
1.1 mm |
minimum slew rate |
0.85 V/us |
0.85 V/us |
0.85 V/us |
Nominal slew rate |
1.2 V/us |
1.2 V/us |
1.2 V/us |
Maximum slew rate |
1 mA |
1 mA |
1 mA |
Supply voltage upper limit |
3.5 V |
3.5 V |
3.5 V |
Nominal supply voltage (Vsup) |
2.5 V |
2.5 V |
2.5 V |
surface mount |
YES |
YES |
YES |
technology |
CMOS |
CMOS |
CMOS |
Temperature level |
INDUSTRIAL |
AUTOMOTIVE |
INDUSTRIAL |
Terminal surface |
Tin (Sn) |
Tin (Sn) |
Tin (Sn) |
Terminal form |
GULL WING |
GULL WING |
GULL WING |
Terminal pitch |
0.95 mm |
0.95 mm |
0.95 mm |
Terminal location |
DUAL |
DUAL |
DUAL |
Maximum time at peak reflow temperature |
40 |
40 |
40 |
Nominal Uniform Gain Bandwidth |
900 kHz |
900 kHz |
900 kHz |
Minimum voltage gain |
10000 |
10000 |
10000 |
broadband |
NO |
NO |
NO |
width |
1.5 mm |
1.5 mm |
1.5 mm |