†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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2
BCP56 Series, SBCP56 Series
TYPICAL ELECTRICAL CHARACTERISTICS
1000
hFE, DC CURRENT GAIN
T
J
= 125°C
T
J
= 25°C
100
T
J
= - 55°C
10
1
10
I
C
, COLLECTOR CURRENT (mA)
100
1000
Figure 1. DC Current Gain
f T, CURRENT‐GAIN — BANDWIDTH PRODUCT (MHz)
1000
80
60
T
J
= 25°C
C, CAPACITANCE (pF)
40
C
ibo
100
20
10
8.0
6.0
C
obo
0.2
0.5 1.0 2.0
5.0 10
20
V
R
, REVERSE VOLTAGE (VOLTS)
50
100
10
1.0
10
100
I
C
, COLLECTOR CURRENT (mA)
1000
4.0
0.1
Figure 2. Current−Gain
−
Bandwidth Product
1
V
CE(sat)
, COLLECTOR−EMITTER
SATURATION VOLTAGE (V)
I
C
/I
B
= 10
V
BE(sat)
, BASE−EMITTER
SATURATION VOLTAGE (V)
150°C
25°C
1.2
1.1
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
150°C
−55°C
25°C
I
C
/I
B
= 10
Figure 3. Capacitance
0.1
−55°C
0.01
0.001
0.01
0.1
1
0.001
0.01
0.1
1
I
C
, COLLECTOR CURRENT (A)
I
C
, COLLECTOR CURRENT (A)
Figure 4. Collector Emitter Saturation Voltage
vs. Collector Current
Figure 5. Base Emitter Saturation Voltage vs.
Collector Current
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3
BCP56 Series, SBCP56 Series
TYPICAL ELECTRICAL CHARACTERISTICS
1.2
1.1
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
150°C
−55°C
25°C
V
CE
= 2 V
1.0
T
J
= 25°C
0.8
I
C
= 10 mA
50
mA
100 mA
250 mA
500 mA
V
BE(on)
, BASE−EMITTER VOLTAGE (V)
VCE , COLLECTOR‐EMITTER VOLTAGE (VOLTS)
0.6
0.4
0.2
0
0.05
0.001
0.01
0.1
1
0.1
0.2
I
C
, COLLECTOR CURRENT (A)
1.0 2.0
0.5
5.0
10
I
C
, COLLECTOR CURRENT (mA)
20
50
Figure 6. Base Emitter Voltage vs. Collector
Current
Figure 7. Collector Saturation Region
1
I
C
, COLLECTOR CURRENT (A)
1S
100 mS
10 mS
0.1
1 mS
P
D
, POWER DISSIPATION (W)
100
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.01
0.1
1
10
0.0
0
20
40
60
80
120
100
T
A
, AMBIENT TEMPERATURE (°C)
140
160
V
CE
, COLLECTOR EMITTER VOLTAGE (V)
Figure 8. Safe Operating Area
Figure 9. Power Derating Curve
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4
BCP56 Series, SBCP56 Series
PACKAGE DIMENSIONS
SOT−223 (TO−261)
CASE 318E−04
ISSUE N
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCH.
DIM
A
A1
b
b1
c
D
E
e
e1
L
L1
H
E
MIN
1.50
0.02
0.60
2.90
0.24
6.30
3.30
2.20
0.85
0.20
1.50
6.70
0°
MILLIMETERS
NOM
MAX
1.63
1.75
0.06
0.10
0.75
0.89
3.06
3.20
0.29
0.35
6.50
6.70
3.50
3.70
2.30
2.40
0.94
1.05
−−−
−−−
1.75
2.00
7.00
7.30
10°
−
MIN
0.060
0.001
0.024
0.115
0.009
0.249
0.130
0.087
0.033
0.008
0.060
0.264
0°
INCHES
NOM
0.064
0.002
0.030
0.121
0.012
0.256
0.138
0.091
0.037
−−−
0.069
0.276
−
MAX
0.068
0.004
0.035
0.126
0.014
0.263
0.145
0.094
0.041
−−−
0.078
0.287
10°
D
b1
4
H
E
E
1
2
3
e1
b
e
A
q
L
L1
C
q
0.08 (0003)
A1
STYLE 1:
PIN 1.
2.
3.
4.
BASE
COLLECTOR
EMITTER
COLLECTOR
SOLDERING FOOTPRINT*
3.8
0.15
2.0
0.079
2.3
0.091
2.3
0.091
6.3
0.248
2.0
0.079
1.5
0.059
mm
inches
SCALE 6:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor
and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
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