FPGA - Field Programmable Gate Array Axcelerator (AX)
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Microsemi |
package instruction | 1 MM PITCH, FBGA-484 |
Reach Compliance Code | compliant |
ECCN code | 3A001.A.7.A |
Other features | 1000000 SYSTEM GATES AVAILABLE |
maximum clock frequency | 649 MHz |
Combined latency of CLB-Max | 0.99 ns |
JESD-30 code | S-PBGA-B484 |
JESD-609 code | e0 |
length | 27 mm |
Humidity sensitivity level | 3 |
Configurable number of logic blocks | 12096 |
Equivalent number of gates | 1000000 |
Number of entries | 516 |
Number of logical units | 18144 |
Output times | 516 |
Number of terminals | 484 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 12096 CLBS, 1000000 GATES |
Package body material | PLASTIC/EPOXY |
encapsulated code | BGA |
Encapsulate equivalent code | BGA484,22X22,40 |
Package shape | SQUARE |
Package form | GRID ARRAY |
Peak Reflow Temperature (Celsius) | 225 |
power supply | 1.5,1.5/3.3,2.5/3.3 V |
Programmable logic type | FIELD PROGRAMMABLE GATE ARRAY |
Certification status | Not Qualified |
Maximum seat height | 2.44 mm |
Maximum supply voltage | 1.575 V |
Minimum supply voltage | 1.425 V |
Nominal supply voltage | 1.5 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | BALL |
Terminal pitch | 1 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | 30 |
width | 27 mm |
Base Number Matches | 1 |