GS880E18BGT-200I datasheet, PDF

GS880E18BGT-200I: Description512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs; Categorystorage storage; File Size448KB，28 Pages; ManufacturerGSI Technology; Websitehttp://www.gsitechnology.com/; Environmental Compliance

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GS880E18BGT-200I Overview

512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	GSI Technology
Parts packaging code	QFP
package instruction	LQFP,
Contacts	100
Reach Compliance Code	unknow
ECCN code	3A991.B.2.B
Maximum access time	6.5 ns
Other features	FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY
JESD-30 code	R-PQFP-G100
JESD-609 code	e3
length	20 mm
memory density	9437184 bi
Memory IC Type	CACHE SRAM
memory width	18
Humidity sensitivity level	3
Number of functions	1
Number of terminals	100
word count	524288 words
character code	512000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	512KX18
Package body material	PLASTIC/EPOXY
encapsulated code	LQFP
Package shape	RECTANGULAR
Package form	FLATPACK, LOW PROFILE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	260
Certification status	Not Qualified
Maximum seat height	1.6 mm
Maximum supply voltage (Vsup)	2.7 V
Minimum supply voltage (Vsup)	2.3 V
Nominal supply voltage (Vsup)	2.5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	PURE MATTE TIN
Terminal form	GULL WING
Terminal pitch	0.65 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	14 mm

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