1-Gbit Double-Data-Rate-Two SDRAM
Parameter Name | Attribute value |
Is it Rohs certified? | conform to |
Maker | QIMONDA |
Parts packaging code | BGA |
package instruction | TFBGA, BGA68,9X19,32 |
Contacts | 68 |
Reach Compliance Code | unknow |
ECCN code | EAR99 |
access mode | FOUR BANK PAGE BURST |
Maximum access time | 0.6 ns |
Other features | AUTO/SELF REFRESH |
Maximum clock frequency (fCLK) | 200 MHz |
I/O type | COMMON |
interleaved burst length | 4,8 |
JESD-30 code | R-PBGA-B68 |
length | 17 mm |
memory density | 1073741824 bi |
Memory IC Type | DDR DRAM |
memory width | 4 |
Humidity sensitivity level | 3 |
Number of functions | 1 |
Number of ports | 1 |
Number of terminals | 68 |
word count | 268435456 words |
character code | 256000000 |
Operating mode | SYNCHRONOUS |
organize | 256MX4 |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
encapsulated code | TFBGA |
Encapsulate equivalent code | BGA68,9X19,32 |
Package shape | RECTANGULAR |
Package form | GRID ARRAY, THIN PROFILE, FINE PITCH |
Peak Reflow Temperature (Celsius) | 260 |
power supply | 1.8 V |
Certification status | Not Qualified |
refresh cycle | 8192 |
Maximum seat height | 1.2 mm |
self refresh | YES |
Continuous burst length | 4,8 |
Maximum supply voltage (Vsup) | 1.9 V |
Minimum supply voltage (Vsup) | 1.7 V |
Nominal supply voltage (Vsup) | 1.8 V |
surface mount | YES |
technology | CMOS |
Terminal form | BALL |
Terminal pitch | 0.8 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | 40 |
width | 10 mm |