|
HYB18T512161BF-28 |
HYB18T512161BF-26 |
HYB18T512161BF |
HYB18T512161BF-22 |
HYB18T512161BF-33 |
Description |
512-Mbit x16 DDR2 SDRAM |
512-Mbit x16 DDR2 SDRAM |
512-Mbit x16 DDR2 SDRAM |
512-Mbit x16 DDR2 SDRAM |
512-Mbit x16 DDR2 SDRAM |
Is it Rohs certified? |
conform to |
- |
- |
conform to |
conform to |
Maker |
QIMONDA |
- |
- |
QIMONDA |
QIMONDA |
Parts packaging code |
BGA |
- |
- |
BGA |
BGA |
package instruction |
TFBGA, BGA84,9X15,32 |
- |
- |
TFBGA, BGA84,9X15,32 |
TFBGA, BGA84,9X15,32 |
Contacts |
84 |
- |
- |
84 |
84 |
Reach Compliance Code |
unknown |
- |
- |
unknow |
unknow |
ECCN code |
EAR99 |
- |
- |
EAR99 |
EAR99 |
access mode |
FOUR BANK PAGE BURST |
- |
- |
FOUR BANK PAGE BURST |
FOUR BANK PAGE BURST |
Maximum access time |
0.55 ns |
- |
- |
0.45 ns |
0.6 ns |
Other features |
AUTO/SELF REFRESH |
- |
- |
AUTO/SELF REFRESH |
AUTO/SELF REFRESH |
Maximum clock frequency (fCLK) |
350 MHz |
- |
- |
450 MHz |
300 MHz |
I/O type |
COMMON |
- |
- |
COMMON |
COMMON |
interleaved burst length |
4,8 |
- |
- |
4,8 |
4,8 |
JESD-30 code |
R-PBGA-B84 |
- |
- |
R-PBGA-B84 |
R-PBGA-B84 |
length |
12.5 mm |
- |
- |
12.5 mm |
12.5 mm |
memory density |
536870912 bit |
- |
- |
536870912 bi |
536870912 bi |
Memory IC Type |
DDR DRAM |
- |
- |
DDR DRAM |
DDR DRAM |
memory width |
16 |
- |
- |
16 |
16 |
Number of functions |
1 |
- |
- |
1 |
1 |
Number of ports |
1 |
- |
- |
1 |
1 |
Number of terminals |
84 |
- |
- |
84 |
84 |
word count |
33554432 words |
- |
- |
33554432 words |
33554432 words |
character code |
32000000 |
- |
- |
32000000 |
32000000 |
Operating mode |
SYNCHRONOUS |
- |
- |
SYNCHRONOUS |
SYNCHRONOUS |
Maximum operating temperature |
95 °C |
- |
- |
95 °C |
95 °C |
organize |
32MX16 |
- |
- |
32MX16 |
32MX16 |
Output characteristics |
3-STATE |
- |
- |
3-STATE |
3-STATE |
Package body material |
PLASTIC/EPOXY |
- |
- |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
TFBGA |
- |
- |
TFBGA |
TFBGA |
Encapsulate equivalent code |
BGA84,9X15,32 |
- |
- |
BGA84,9X15,32 |
BGA84,9X15,32 |
Package shape |
RECTANGULAR |
- |
- |
RECTANGULAR |
RECTANGULAR |
Package form |
GRID ARRAY, THIN PROFILE, FINE PITCH |
- |
- |
GRID ARRAY, THIN PROFILE, FINE PITCH |
GRID ARRAY, THIN PROFILE, FINE PITCH |
Peak Reflow Temperature (Celsius) |
260 |
- |
- |
NOT SPECIFIED |
NOT SPECIFIED |
power supply |
1.8 V |
- |
- |
1.8 V |
1.8 V |
Certification status |
Not Qualified |
- |
- |
Not Qualified |
Not Qualified |
refresh cycle |
8192 |
- |
- |
8192 |
8192 |
Maximum seat height |
1.2 mm |
- |
- |
1.2 mm |
1.2 mm |
self refresh |
YES |
- |
- |
YES |
YES |
Continuous burst length |
4,8 |
- |
- |
4,8 |
4,8 |
Maximum standby current |
0.004 A |
- |
- |
0.004 A |
0.004 A |
Maximum slew rate |
0.149 mA |
- |
- |
0.173 mA |
0.129 mA |
Maximum supply voltage (Vsup) |
1.9 V |
- |
- |
2.1 V |
1.9 V |
Minimum supply voltage (Vsup) |
1.7 V |
- |
- |
1.9 V |
1.7 V |
Nominal supply voltage (Vsup) |
1.8 V |
- |
- |
2 V |
1.8 V |
surface mount |
YES |
- |
- |
YES |
YES |
technology |
CMOS |
- |
- |
CMOS |
CMOS |
Temperature level |
OTHER |
- |
- |
OTHER |
OTHER |
Terminal form |
BALL |
- |
- |
BALL |
BALL |
Terminal pitch |
0.8 mm |
- |
- |
0.8 mm |
0.8 mm |
Terminal location |
BOTTOM |
- |
- |
BOTTOM |
BOTTOM |
Maximum time at peak reflow temperature |
40 |
- |
- |
NOT SPECIFIED |
NOT SPECIFIED |
width |
10 mm |
- |
- |
10 mm |
10 mm |