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MC10H176M

Description
Flip Flops Hexadecimal D-Type
Categorylogic    logic   
File Size146KB,7 Pages
ManufacturerON Semiconductor
Websitehttp://www.onsemi.cn
Environmental Compliance
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MC10H176M Overview

Flip Flops Hexadecimal D-Type

MC10H176M Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerON Semiconductor
Parts packaging codeSOIC
package instructionEIAJ, SOP-16
Contacts16
Reach Compliance Codeunknown
series10H
JESD-30 codeR-PDSO-G16
JESD-609 codee4
length10.2 mm
Logic integrated circuit typeD FLIP-FLOP
Maximum Frequency@Nom-Sup250000000 Hz
Number of digits6
Number of functions1
Number of terminals16
Maximum operating temperature75 °C
Minimum operating temperature
Output polarityTRUE
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Encapsulate equivalent codeSOP16,.3
Package shapeRECTANGULAR
Package formSMALL OUTLINE
method of packingRAIL
Maximum supply current (ICC)123 mA
propagation delay (tpd)2.2 ns
Certification statusNot Qualified
Maximum seat height2.05 mm
surface mountYES
technologyECL
Temperature levelCOMMERCIAL EXTENDED
Terminal surfaceNickel/Palladium/Gold (Ni/Pd/Au)
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
Trigger typePOSITIVE EDGE
width5.275 mm
minfmax250 MHz

MC10H176M Related Products

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Description Flip Flops Hexadecimal D-Type Flip Flops Hexadecimal D-Type Flip Flops Hexadecimal D-Type Flip Flops Hexadecimal D-Type Master-Slave Fixed Resistor, Thin Film, 0.4W, 42700ohm, 200V, 0.1% +/-Tol, -100,100ppm/Cel, 1010, Flip Flops Hexadecimal D-Type Master-Slave
Is it Rohs certified? conform to conform to incompatible conform to conform to conform to
Reach Compliance Code unknown unknown not_compliant unknown compliant unknown
series 10H 10H 10H 10H CC5 10H
Number of terminals 16 16 20 16 2 16
Maximum operating temperature 75 °C 75 °C 75 °C 75 °C 125 °C 75 °C
Package form SMALL OUTLINE SMALL OUTLINE CHIP CARRIER SMALL OUTLINE SMT SMALL OUTLINE
method of packing RAIL TAPE AND REEL RAIL TAPE AND REEL Waffle Pack RAIL
technology ECL ECL ECL ECL THIN FILM ECL
Terminal surface Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Tin/Lead (Sn/Pb) Nickel/Palladium/Gold (Ni/Pd/Au) Aluminum (Al) Nickel/Palladium/Gold (Ni/Pd/Au)
Maker ON Semiconductor ON Semiconductor ON Semiconductor ON Semiconductor - ON Semiconductor
Parts packaging code SOIC SOIC QLCC SOIC - SOIC
package instruction EIAJ, SOP-16 EIAJ, SOP-16 PLASTIC, LCC-20 LEAD FREE, EIAJ, SOP-16 - LEAD FREE, EIAJ, SOP-16
Contacts 16 16 20 16 - 16
JESD-30 code R-PDSO-G16 R-PDSO-G16 S-PQCC-J20 R-PDSO-G16 - R-PDSO-G16
JESD-609 code e4 e4 e0 e4 - e4
length 10.2 mm 10.2 mm 8.965 mm 10.2 mm - 10.2 mm
Logic integrated circuit type D FLIP-FLOP D FLIP-FLOP D FLIP-FLOP D FLIP-FLOP - D FLIP-FLOP
Maximum Frequency@Nom-Sup 250000000 Hz 250000000 Hz 250000000 Hz 250000000 Hz - 250000000 Hz
Number of digits 6 6 6 6 - 6
Number of functions 1 1 1 1 - 1
Output polarity TRUE TRUE TRUE TRUE - TRUE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY
encapsulated code SOP SOP QCCJ SOP - SOP
Encapsulate equivalent code SOP16,.3 SOP16,.3 LDCC20,.4SQ SOP16,.3 - SOP16,.3
Package shape RECTANGULAR RECTANGULAR SQUARE RECTANGULAR - RECTANGULAR
Maximum supply current (ICC) 123 mA 123 mA 123 mA 123 mA - 123 mA
propagation delay (tpd) 2.2 ns 2.2 ns 2.2 ns 2.2 ns - 2.2 ns
Certification status Not Qualified Not Qualified Not Qualified Not Qualified - Not Qualified
Maximum seat height 2.05 mm 2.05 mm 4.57 mm 2.05 mm - 2.05 mm
surface mount YES YES YES YES - YES
Temperature level COMMERCIAL EXTENDED COMMERCIAL EXTENDED COMMERCIAL EXTENDED COMMERCIAL EXTENDED - COMMERCIAL EXTENDED
Terminal form GULL WING GULL WING J BEND GULL WING - GULL WING
Terminal pitch 1.27 mm 1.27 mm 1.27 mm 1.27 mm - 1.27 mm
Terminal location DUAL DUAL QUAD DUAL - DUAL
Trigger type POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE - POSITIVE EDGE
width 5.275 mm 5.275 mm 8.965 mm 5.275 mm - 5.275 mm
minfmax 250 MHz 250 MHz 250 MHz 250 MHz - 250 MHz
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